Questions?
Content Type
Other 700
Events 480
Patent Filings 407

SRC Program
SRC 659
GRC 560
FCRP 134
NRI 65
JUMP 58
STARnet 56
JUMP2 29
SRCEA 15
nCORE 10
SRP 5
ERI 4
3D EC 3
Auto 3
ICA 2
MSR-Intel 2
Undergrad 1

Year
2024 23
2023 54
2022 63
2021 63
2020 29
2019 33
2018 65
2017 66
2016 51
2015 46
2014 54
2013 42
2012 67
2011 272
2010 242
2009 1
2008 1

Center
C2S2 47
FENA 47
GSRC 40
IFC 33
MSD 33
ASCENT 28
LEAST 27
ACE4S 22
TxACE 20
C-FAR 17
EBSM 17
SWAN 17
SONIC 16
NRI-NSF 15
CBRIC 14
INDEX 14
C-SPIN 12
CRISP 12
E2CDA-NRI 12
MuSyC 11
CNFD 10
TerraSwarm 10
FAME 9
CONIX 6
CHIRP 5
ComSenTer 5
MIND 5
ADA 4
IMPACT 4
NPT 4
Benchmarking 3
DEEP3M 3
SUPREME 3
WIN 3
ACE 2
CAIST 2
CEMPI 2
CUBIC 2
E2CDA 2
NEWLIMITS 2

Thrust/Theme
CD – Circuit Design 38
TT – Test & Testability 27
SLD – System Level Design 26
I3T – Innovative and Intelligent... 23
ISD – Integrated System Design 20
LPD – Logic & Physical Design 20
HWS – Hardware Security 18
CADT – Computer-Aided Design and... 14
ASCENT-T1 – Vertical CMOS 13
ESH – Environment Safety and Hea... 13
NMP – Nanomanufacturing Material... 13
PKG – Packaging 13
AMS-CSD – Analog/Mixed-Signal Ci... 12
CRISP-T1 – Hardware Support for ... 10
ASCENT-T2 – Beyond CMOS 9
PAT – Patterning 9
VER – Verification 8
DesTech – Design Techniques 7
LMD – Logic and Memory Devices 7
CBRIC-T1 – Neuro-inspired Algori... 6
CONIX-T1 – ARENA Integrator 6
Pat(MPS) – Patterning 6
ASCENT-T3 – Heterogeneous Integr... 5
CBRIC-T2 – Neuromorphic Fabrics 5
NEM – Nanoengineered Materials 5
Physical Design 5
ADA-T1 – Deft Development 4
AIHW – Artificial Intelligence H... 4
BEP – Back End Processes 4
Back End Processes 4
Factory Systems 4
MT – Memory Technologies 4
Masks 4
TechCAD – Technology CAD 4
Advanced Devices & Technologies 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T1 – Systems and Algor... 3
DEEP3M-T4 – Architectures 3
DesSyn – Design Synthesis 3
IMPACT-T1 – Materials for Scaled... 3
Packaging & Interconnect Systems 3
ASCENT-T4 – Merged Logic Memory ... 2
CFM&TCM – CFM & Total Chemical M... 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
DV – Design Verification 2
Doping Technologies 2
E2CDA2 – E2CDA 2.0 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
IMPACT-T2 – Materials for Storag... 2
MTMP – Metrology Tools Matls & P... 2
Modeling & Simulation 2
NEWLIMITS-T1 – Novel Computing a... 2
Reliability 2
SCARF – Supply Chain AI Realized... 2
SemiSynBio – Semiconductor Synth... 2
Synthesis & Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1

GRC Science Area
CADTS – Computer Aided Design & ... 103
ICSS – Integrated Circuit & Syst... 86
NMS – Nanomanufacturing Sciences 51
IPS – Interconnect & Packaging S... 30
DS – Device Sciences 27
CSR – Cross-disciplinary Semicon... 23
DES – Design Sciences 22
MPS – Material & Process Science... 21
NIS – Nanostructure & Integratio... 11
LIT – Lithography Sciences 10
SRCEA – SRC Education Alliance 10
MBP – Materials & Bulk Processes... 9
ES-H – Environmental Safety & He... 7
INT – Interconnect Sciences 5
PKG – Packaging Sciences 5
MFGPS – Manufacturing Process Sc... 3
MIC – Microstructure Sciences 2
PID – Process Integration & Devi... 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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181: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
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182: pdfSRCEA Undergraduate Research Opportunities - Year 1 (2009-2010...
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183: NSF Past Research - SRC
Past NRI-NSF Research Brown University MRSEC Micro- and Nano-Mechanics of Materials, W. A. Curtin (Director) NRI Project 2009-2011: 2008.001 Direct Write Synthesis of Graphene ...
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184: SRC: Grant Application for Cross-disciplinary Semiconductor Research...
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185: pdfNMS Nanoengineered Materials Review
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186: Technical Excellence Award - SRC
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187: Technical Excellence Award - SRC
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190: TECHCON 2014 (Event E004684) - SRC
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193: pdf3DASSM
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195: pdfReport to NSF on The Workshop for Energy Efficient Computing
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201: pdfSRC CONNECTIONS OCTOBER 2021
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207: SRC Biography: Michael C. Phillips, Director of Contracts and...
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210: pdfGoal + Message Content
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