Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 14
Patent Filings 7
Other 1

SRC Program
GRC 13
SRC 9
3D EC 2
FCRP 2

Year
2016 3
2013 4
2012 2
2011 5

Center
C-FAR 5
CNFD 5
FAME 5
INDEX 5
LEAST 5
SONIC 5
SWAN 5
TerraSwarm 5
C2S2 4
FENA 4
GSRC 4
IFC 4
MSD 4
MuSyC 4
EBSM 3
TxACE 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 6
BEP – Back End Processes 3
Back End Processes 3
Reliability 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 22 of 22 similar documents, best matches first.   
1: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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2: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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3: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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4: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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5: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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6: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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7: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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8: Systems, Methods and Computer Program Products for Prediction...
Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
URL: https://www.src.org/library/patent/p0050/
Modified: 1998-10-13 - 22KB
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9: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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10: Growth of Inorganic Thin Films using Self-Assembled Monolayers...
Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB
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11: Posters: Undergraduate Research Opportunities (URO) - SRC
TECHCON 2011 TECHCON 2011 Posters - Undergraduate Research Opportunities Room: RioGrande A Back to Session Listing URO Posters Poster Number Presentation Time Title Presenter & ...
URL: https://www.src.org/calendar/e004113/uro-posters/
Modified: 2011-06-30 - 27KB
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12: Methods, Systems, and Computer Program Products for Asymmetric...
Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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13: Methods, Systems, and Computer Program Products for Low Power...
Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB
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14: Multiple Copper Vias for Integrated Circuit Metallization and...
Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
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15: Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB
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16: Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
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17: URO Poster Winners (TECHCON 2013) - SRC
Undergraduate Research Opportunities TECHCON 2013 Best Poster Awards First Place URO.23 URO POSTER SRCEA Evaluation of the Photodimerization of 4-vinyl(benzyl) Thymine and ...
URL: https://www.src.org/calendar/e004683/uro/
Modified: 2013-09-09 - 22KB
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18: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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19: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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20: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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21: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
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22: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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1 through 22 of 22 similar documents, best matches first.