Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

[x] SRC Program
GRC

Content Type
Patent Filings 32
Events 15
Other 1

Year
2017 3
2016 4
2012 2
2011 6

Center
CEMPI 4
CAIST 3
ACE4S 1
CDADIC 1
CHIRP 1
EBSM 1
IPC 1
NCRC 1
TxACE 1

Thrust/Theme
PKG – Packaging 19
BEP – Back End Processes 16
NMP – Nanomanufacturing Material... 4
Back End Processes 3
PAT – Patterning 3
Processes – Processes 3
CM – Compact Modeling 2
Multi-level Interconnect 2
NEM – Nanoengineered Materials 2
Reliability 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 30 of 48 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: pdfSlide 1
3D University Research Summit May 5 th , 2011 Restricted Distribution: Contains SRC Confidential Material Restricted Distribution: Contains SRC Confidential Material Summit Goals . ...
URL: https://www.src.org/calendar/e004357/0-intro.pdf
Modified: 2011-05-04 - 285KB
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2: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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3: Conductors Created by Metal Deposition Using Selective Passivation...
Conductors Created by Metal Deposition Using Selective Passivation Layer and Related Methods Application Type: Utility Patent Number: 7534967 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0447/
Modified: 2009-05-19 - 23KB
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4: Multiple Copper Vias for Integrated Circuit Metallization and...
Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
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5: Systems, Methods, and Computer Readable Media for Fractional...
Systems, Methods, and Computer Readable Media for Fractional Pre-emphasis of Multi-Mode Interconnect Application Type: Utility Patent Number: 8208578 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1191/
Modified: 2012-06-26 - 22KB
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6: Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB
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7: pdfI Loading Doc!<i '"....,._,
. isu1101ng & o Sapp G> ;;t / Rfl9ional F.. t_ Stauffer II ben~er for § I Loading Doc!<i '"....,._, rf . ,' ' der Construction ; c1en~e Birct\ -,Po,PT~...... .. ...
URL: https://www.src.org/calendar/e006242/campus_map_parking.pdf
Modified: 2017-03-21 - 121KB
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8: Surface Modifcation of CVD Polymer Films (Patent P0591) - SRC
Surface Modifcation of CVD Polymer Films Application Type: Utility Patent Number: 7501154 Country: United States Status: Filed on 18-Feb-2005, Issued on 10-Mar-2009 Organization: ...
URL: https://www.src.org/library/patent/p0591/
Modified: 2009-03-10 - 22KB
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9: Mixed-signal Substrate with Integrated Through-Substrate Vias...
Mixed-signal Substrate with Integrated Through-Substrate Vias Application Type: Utility Patent Number: 10330874 Country: United States Status: Filed on 2-Feb-2017, Issued on ...
URL: https://www.src.org/library/patent/p1675/
Modified: 2019-06-25 - 23KB
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10: Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor...
Polyelectrolyte Nanolayers as Diffusion Barriers In Semiconductor Devices Application Type: Utility Patent Number: 7081674 Country: United States Status: Filed on 11-Jun-2004, ...
URL: https://www.src.org/library/patent/p0466/
Modified: 2006-07-25 - 22KB
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11: Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
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12: Low Dielectric Constant (Low-K) Dielectric and Method of Forming...
Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same Application Type: Utility Patent Number: 10090150 Country: United States Status: Filed on 6-Sep-2017, ...
URL: https://www.src.org/library/patent/p1731/
Modified: 2018-10-02 - 24KB
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13: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB
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14: Systems for Performing Chemical Mechanical Planarization and...
Systems for Performing Chemical Mechanical Planarization and Process for Conducting Same Application Type: Utility Patent Number: 5637185 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0012/
Modified: 1997-06-10 - 24KB
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15: Growth of Inorganic Thin Films using Self-Assembled Monolayers...
Growth of Inorganic Thin Films using Self-Assembled Monolayers as Nucleation Sites Application Type: Utility Patent Number: 7829150 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1139/
Modified: 2010-11-09 - 22KB
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16: pdfState-of-the-3D Industry Future Opportunities and Challenges
Rev 2.0 1  Building the Case for 3D  3D Vs. Scaling  Technology Roadmap  Technology Hurdles  Psycho-political Hurdles  Evolutionary vs. Revolutionary  The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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17: High Gain Integrated Antenna and Devices Therefrom (Patent P0392...
High Gain Integrated Antenna and Devices Therefrom Application Type: Utility Patent Number: 6842144 Country: United States Status: Filed on 10-Jun-2003, Issued on 11-Jan-2005, ...
URL: https://www.src.org/library/patent/p0392/
Modified: 2005-01-11 - 22KB
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18: Electromagnetic Bandgap Structure for Isolation in Mixed-Signal...
Electromagnetic Bandgap Structure for Isolation in Mixed-Signal Systems Application Type: Utility Patent Number: 7215301 Country: United States Status: Filed on 8-Sep-2004, Issued ...
URL: https://www.src.org/library/patent/p0470/
Modified: 2007-05-08 - 22KB
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19: Composite Thermal Interface Material Including Particles and...
Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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20: Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers...
Self-Assembled Sub-Nanolayers as Interfacial Adhesion Enhancers and Diffusion Barriers Application Type: Utility Patent Number: 7026716 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0415/
Modified: 2006-04-11 - 22KB
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21: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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22: Low Temperature Metal Etching and Patterning (Patent P1290) ...
Low Temperature Metal Etching and Patterning Application Type: Utility Patent Number: 8679359 Country: United States Status: Filed on 10-May-2011, Issued on 25-Mar-2014 ...
URL: https://www.src.org/library/patent/p1290/
Modified: 2014-03-25 - 23KB
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23: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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24: Wafer Fabrication Monitoring/Control System and Method (Patent...
Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
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25: Self-Healing Analog-to-Digital Converters with Background Calibration...
Self-Healing Analog-to-Digital Converters with Background Calibration Application Type: Utility Patent Number: 8330632 Country: United States Status: Filed on 11-Feb-2011, Issued ...
URL: https://www.src.org/library/patent/p1266/
Modified: 2012-12-11 - 22KB
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26: pdfGaTech Campus Map Marcus Nanotechnology Building 345 Ferst Drive...
GaTech Campus Map Marcus Nanotechnology Building 345 Ferst Drive NW
URL: https://www.src.org/calendar/e006135/gatech-campus-map.pdf
Modified: 2017-03-16 - 170KB
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27: Process and Apparatus for the Use of Solid Precursor Sources...
Process and Apparatus for the Use of Solid Precursor Sources in Liquid Form for Vapor Deposition of Materials Application Type: Utility Patent Number: 5376409 Country: United ...
URL: https://www.src.org/library/patent/p0261/
Modified: 1994-12-27 - 22KB
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28: Multilevel Reservoirs for Integrated Circuit Interconnects (Patent...
Multilevel Reservoirs for Integrated Circuit Interconnects Application Type: Utility Patent Number: 8278758 Country: United States Status: Filed on 29-Apr-2009, Issued on ...
URL: https://www.src.org/library/patent/p1141/
Modified: 2012-10-02 - 22KB
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29: Oxidation Resistant High Conductivity Copper Layers for Microelectric...
Oxidation Resistant High Conductivity Copper Layers for Microelectric Applications and Process of Making Same Application Type: Utility Patent Number: 5622608 Country: United ...
URL: https://www.src.org/library/patent/p0007/
Modified: 1997-04-22 - 22KB
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30: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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1 through 30 of 48 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>