Questions?
Content Type
Other 423
Events 342
Patent Filings 80

SRC Program
SRC 356
GRC 335
NRI 65
STARnet 25
nCORE 19
FCRP 18
JUMP 15
JUMP2 15
3D EC 5
ERI 5
SRP 4
SRCEA 2
ICA 1
MSR-Intel 1
NINE 1

Year
2023 43
2022 55
2021 48
2020 21
2019 17
2018 29
2017 45
2016 24
2015 24
2014 23
2013 28
2012 54
2011 189
2010 158
2009 1

Center
C-SPIN 19
MSD 17
SWAN 17
FENA 14
C2S2 13
CNFD 13
GSRC 13
IFC 13
INDEX 13
NRI-NSF 11
TxACE 11
LEAST 10
ASCENT 9
E2CDA-NRI 9
MuSyC 9
FAME 8
MIND 8
AMML 7
EBSM 7
WIN 7
CHIRP 6
NEWLIMITS 6
C-FAR 4
CRISP 4
SONIC 4
TerraSwarm 4
Benchmarking 3
CAPSL 3
DEEP3M 3
SUPREME 3
ACE 2
ADA 2
CUBIC 2
NRI-Projects 2
SMART 2
ACE4S 1
CAIST 1
CBRIC 1
CDADIC 1
CEMPI 1

Thrust/Theme
LMD – Logic and Memory Devices 13
Advanced Devices & Technologies 9
PKG – Packaging 9
AMML-T1 – Antiferromagnetic Magn... 7
AMS-CSD – Analog/Mixed-Signal Ci... 7
ESH – Environment Safety and Hea... 7
HWS – Hardware Security 7
NMP – Nanomanufacturing Material... 7
NEM – Nanoengineered Materials 6
TT – Test & Testability 6
ASCENT-T1 – Vertical CMOS 5
CADT – Computer-Aided Design and... 5
ASCENT-T2 – Beyond CMOS 4
CD – Circuit Design 4
I3T – Innovative and Intelligent... 4
SLD – System Level Design 4
VER – Verification 4
CAPSL-T4 – Architectures and Sys... 3
DEEP3M-T4 – Architectures 3
Factory Systems 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
NEWLIMITS-T2 – 2D Materials Devi... 3
PAT – Patterning 3
ADA-T1 – Deft Development 2
AIHW – Artificial Intelligence H... 2
AMS – Analog and Mixed-Signal De... 2
ASCENT-T3 – Heterogeneous Integr... 2
CAPSL-T1 – Materials Development... 2
CAPSL-T2 – P-transistors for PSL... 2
CAPSL-T3 – Device Models and Tut... 2
CRISP-T1 – Hardware Support for ... 2
CRISP-T3 – Scaling Applications ... 2
DCMOS – Digital CMOS Technologie... 2
FACSYS – Factory Systems 2
IRP – India Research Program 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
SMART-T1 – Spin-orbit Torque Mat... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T3 – Application-speci... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1

GRC Science Area
CADTS – Computer Aided Design & ... 43
NMS – Nanomanufacturing Sciences 39
ICSS – Integrated Circuit & Syst... 27
IPS – Interconnect & Packaging S... 19
DS – Device Sciences 17
CSR – Cross-disciplinary Semicon... 16
NIS – Nanostructure & Integratio... 10
SRCEA – SRC Education Alliance 9
PID – Process Integration & Devi... 6
PKG – Packaging Sciences 5
MPS – Material & Process Science... 4
MIC – Microstructure Sciences 3
ES-H – Environmental Safety & He... 2
MBP – Materials & Bulk Processes... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfResearch Needs: Logic and Memory Devices (LMD)
Research Needs: Logic and Memory Devices (LMD) May 12, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 This document is prepared to accompany the ...
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2: pdfResearch Needs Document: Logic and Memory Devices
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3: pdfResearch Needs Document: Logic and Memory Devices
Research Needs Document: Logic and Memory Devices June 2019 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background This document is prepared to accompany ...
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4: pdfResearch Needs: Logic and Memory Devices (LMD)
Research Needs: Logic and Memory Devices (LMD) May 1st, 2023 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 [ This document is prepared to accompany the ...
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Research Needs Document: Logic and Memory Devices March 2015 Semiconductor Research Corp. (SRC) P.O. Box 12053 Research Triangle Park, NC 27709-2053 Background This document is ...
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1 through 30 of 845 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>