Questions?
Content Type
Other 375
Events 296
Patent Filings 44

SRC Program
SRC 319
GRC 306
NRI 26
FCRP 23
JUMP2 15
JUMP 10
3D EC 6
SRP 6
STARnet 6
Auto 4
ICA 2
nCORE 2
ERI 1
SRCEA 1

Year
2023 38
2022 49
2021 35
2020 19
2019 17
2018 29
2017 46
2016 21
2015 25
2014 15
2013 26
2012 45
2011 179
2010 120
2009 1
2008 1

Center
TxACE 14
C2S2 11
GSRC 8
EBSM 7
MSD 6
C-FAR 5
CHIRP 5
FENA 5
IFC 5
INDEX 5
ASCENT 4
CONIX 4
E2CDA-NRI 4
LEAST 4
MuSyC 4
CNFD 3
FAME 3
SONIC 3
SUPREME 3
SWAN 3
TerraSwarm 3
ACE 2
ACE4S 2
ADA 2
CBRIC 2
CUBIC 2
C-SPIN 1
CAIST 1
CAPSL 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
CRISP 1
ComSenTer 1
IPC 1
JUMP-URI 1
MIND 1
NCRC 1

Thrust/Theme
CADT – Computer-Aided Design and... 13
PKG – Packaging 11
LPD – Logic & Physical Design 10
AMS-CSD – Analog/Mixed-Signal Ci... 9
HWS – Hardware Security 7
SLD – System Level Design 7
TT – Test & Testability 7
CD – Circuit Design 6
ESH – Environment Safety and Hea... 6
VER – Verification 6
AIHW – Artificial Intelligence H... 5
CONIX-T1 – ARENA Integrator 4
ISD – Integrated System Design 4
LMD – Logic and Memory Devices 4
NMP – Nanomanufacturing Material... 4
I3T – Innovative and Intelligent... 3
ADA-T1 – Deft Development 2
ADA-T2 – Algorithm-driven Archit... 2
ADA-T3 – Technology-driven Syste... 2
ASCENT-T2 – Beyond CMOS 2
ASCENT-T3 – Heterogeneous Integr... 2
ASCENT-T4 – Merged Logic Memory ... 2
EP3C – Efficiency and Performanc... 2
IRP – India Research Program 2
PAT – Patterning 2
Pat(MPS) – Patterning 2
SCARF – Supply Chain AI Realized... 2
SemiSynBio – Semiconductor Synth... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T1 – Neuro-inspired Algori... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
JUMP-URI – JUMP Undergraduate Re... 1
Lithography 1
Logic Design 1

GRC Science Area
CADTS – Computer Aided Design & ... 42
ICSS – Integrated Circuit & Syst... 26
IPS – Interconnect & Packaging S... 18
NMS – Nanomanufacturing Sciences 15
SRCEA – SRC Education Alliance 8
CSR – Cross-disciplinary Semicon... 7
DS – Device Sciences 7
PKG – Packaging Sciences 6
NIS – Nanostructure & Integratio... 3
ES-H – Environmental Safety & He... 2
LIT – Lithography Sciences 2
MPS – Material & Process Science... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdf2009 Summer Study: Application and Network Optimized Next Generation...
© 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
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Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>