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SRC Program

GRC	513
SRC	476
JUMP2	25
FCRP	21
NRI	21
3D EC	6
SRP	6
JUMP	3
Auto	2
ICA	2
SRCEA	2
STARnet	2
ERI	1
NINE	1
nCORE	1

Year

2024	16
2023	43
2022	55
2021	42
2020	24
2019	25
2018	41
2017	39
2016	29
2015	34
2014	26
2013	31
2012	57
2011	242
2010	183
2009	1
2008	1

Thrust/Theme

TT – Test & Testability	31
CD – Circuit Design	30
HWS – Hardware Security	21
LPD – Logic & Physical Design	16
SLD – System Level Design	15
I3T – Innovative and Intelligent...	14
NMP – Nanomanufacturing Material...	14
PKG – Packaging	13
AMS-CSD – Analog/Mixed-Signal Ci...	12
ISD – Integrated System Design	12
CADT – Computer-Aided Design and...	11
ESH – Environment Safety and Hea...	11
NEM – Nanoengineered Materials	9
DesTech – Design Techniques	7
Factory Systems	7
PAT – Patterning	7
LMD – Logic and Memory Devices	6
VER – Verification	6
Advanced Devices & Technologies	5
CFM&TCM – CFM & Total Chemical M...	5
Physical Design	5
BEP – Back End Processes	4
Modeling & Simulation	4
TechCAD – Technology CAD	4
ADS – Alternative Device Structu...	3
Masks	3
AIHW – Artificial Intelligence H...	2
Back End Processes	2
CM – Compact Modeling	2
DCMOS – Digital CMOS Technologie...	2
DV – Design Verification	2
DesSyn – Design Synthesis	2
FACSYS – Factory Systems	2
Materials	2
Reliability	2
SCARF – Supply Chain AI Realized...	2
Synthesis & Verification	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T2 – Beyond CMOS	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Technology Option	1
Analysis Design & Simulation	1
C&S – Controls and Sensing	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CRISP-T1 – Hardware Support for ...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
Defect Reduction	1
Deposition	1
Doping Technologies	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Materials & Measurements	1
Metrology	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1