Questions?
Content Type
Other 287
Events 189
Patent Filings 33

SRC Program
GRC 225
SRC 199
JUMP2 26
NRI 20
JUMP 16
FCRP 13
nCORE 5
3D EC 4
STARnet 4
Auto 1
ICA 1
NINE 1
SRP 1

Year
2024 13
2023 33
2022 29
2021 26
2020 12
2019 14
2018 17
2017 23
2016 15
2015 12
2014 9
2013 15
2012 33
2011 127
2010 91
2009 1

Center
ASCENT 15
ACE4S 10
TxACE 8
IFC 6
MSD 6
C2S2 5
CHIRP 5
FENA 5
GSRC 5
INDEX 5
MIND 5
EBSM 4
IMPACT 4
LEAST 4
MuSyC 4
SWAN 4
WIN 4
NRI-NSF 3
SONIC 3
ACE 2
C-FAR 2
CUBIC 2
FAME 2
SUPREME 2
TerraSwarm 2
ADA 1
AMML 1
C-SPIN 1
CAIST 1
CAPSL 1
CBRIC 1
CDADIC 1
CEMPI 1
CHIMES 1
CNFD 1
COCOSYS 1
COGNISENSE 1
CONIX 1
CRISP 1
ComSenTer 1

Thrust/Theme
ASCENT-T1 – Vertical CMOS 13
I3T – Innovative and Intelligent... 12
SLD – System Level Design 12
PKG – Packaging 10
CD – Circuit Design 8
AMS-CSD – Analog/Mixed-Signal Ci... 6
HWS – Hardware Security 5
ISD – Integrated System Design 5
IMPACT-T1 – Materials for Scaled... 4
ASCENT-T2 – Beyond CMOS 3
CADT – Computer-Aided Design and... 3
ESH – Environment Safety and Hea... 3
NMP – Nanomanufacturing Material... 3
Physical Design 3
AIHW – Artificial Intelligence H... 2
EP3C – Efficiency and Performanc... 2
LPD – Logic & Physical Design 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T3 – Heterogeneous Integr... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T1 – Neuro-inspired Algori... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T1 – ARENA Integrator 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 22
CADTS – Computer Aided Design & ... 19
IPS – Interconnect & Packaging S... 12
NMS – Nanomanufacturing Sciences 9
PKG – Packaging Sciences 6
CSR – Cross-disciplinary Semicon... 5
DS – Device Sciences 5
SRCEA – SRC Education Alliance 5
ES-H – Environmental Safety & He... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfPowerPoint Presentation
Center for Heterogeneous Integration of Micro Electronic Systems Vision & Plan Madhavan Swaminathan, Director Penn State Univ. Muhannad Bakir, Asst. Director Georgia Tech 2 ...
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1 Center for Heterogeneous Integration of Micro Electronic Systems SAB Review - Center Plan of Action for 2024 Madhavan Swaminathan (Penn State), Center Director Muhannad Bakir ...
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14: pdf2006 Annual Report
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20: pdf1985 Annual Report
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