Questions?
[x] SRC Program
GRC

Content Type
Other 162
Events 130
Patent Filings 8

Year
2024 1
2023 9
2022 17
2021 9
2020 7
2019 8
2018 14
2017 7
2016 11
2015 14
2014 5
2013 6
2012 9
2011 116
2010 57
2009 1

Center
EBSM 16
CHIRP 6
TxACE 6
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
ESH – Environment Safety and Hea... 17
NMP – Nanomanufacturing Material... 9
PKG – Packaging 9
HWS – Hardware Security 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
CFM&TCM – CFM & Total Chemical M... 4
CADT – Computer-Aided Design and... 3
CD – Circuit Design 3
ISD – Integrated System Design 3
LMD – Logic and Memory Devices 3
LPD – Logic & Physical Design 3
SLD – System Level Design 3
TT – Test & Testability 3
VER – Verification 3
EP3C – Efficiency and Performanc... 2
I3T – Innovative and Intelligent... 2
Multi-level Interconnect 2
NEM – Nanoengineered Materials 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
NCR – Non-Classical CMOS Researc... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
NMS – Nanomanufacturing Sciences 27
CADTS – Computer Aided Design & ... 19
ICSS – Integrated Circuit & Syst... 19
ES-H – Environmental Safety & He... 10
IPS – Interconnect & Packaging S... 9
PKG – Packaging Sciences 5
LIT – Lithography Sciences 4
MBP – Materials & Bulk Processes... 4
MPS – Material & Process Science... 4
INT – Interconnect Sciences 2
MIC – Microstructure Sciences 2
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

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1: pdfESH Needs Document for Nanotechnology
ESH/Technology Research Needs (2008 Update) April 7, 2008 INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor ...
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2: pdfESH for Nanotechnology
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4: pdfEnvironment, Safety, and Health Needs Document
SRC ESH Needs Document 2020 1 Research Needs Document: ESH Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Introduction Semiconductor fabrication processes have ...
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8: pdfPresentation title here
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9: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
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10: 2008 GRC compelling research reasons - SRC
2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
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11: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
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12: pdfESH Needs Document - June 2018
Research Needs Document: ESH June 11, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Introduction In semiconductor manufacturing, it is a universal ...
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13: pdfMicrosoft Word - SRCTAB_ResearchPrioritiesDSRCCLMay162014j.doc
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14: pdfNMS Research Needs Document, Version 1
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1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
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16: pdf2011-2015 SRC-GRC Strategic Plan
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21: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
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24: pdf2006 Circuit Design Needs Categories
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27: pdf2016 - Packaging Research Needs Document
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28: pdfPackaging Research Needs Document
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URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
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30: pdfNMS Nanoengineered Materials Review
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1 through 30 of 300 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>