Questions?
Content Type
Other 434
Events 338
Patent Filings 42

SRC Program
SRC 379
GRC 350
NRI 29
JUMP2 23
FCRP 21
3D EC 5
SRP 5
Auto 4
ERI 2
JUMP 2
STARnet 2
ICA 1
NINE 1
nCORE 1

Year
2024 16
2023 39
2022 56
2021 42
2020 18
2019 18
2018 34
2017 45
2016 21
2015 27
2014 20
2013 26
2012 45
2011 212
2010 148
2009 1

Center
TxACE 21
C2S2 15
IFC 12
GSRC 11
FENA 10
MSD 10
MuSyC 7
CHIRP 6
E2CDA-NRI 5
EBSM 5
INDEX 5
SWAN 5
C-FAR 4
CNFD 4
FAME 4
LEAST 4
SONIC 4
TerraSwarm 4
ACE 2
CUBIC 2
NRI-NSF 2
SUPREME 2
ACE4S 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
ComSenTer 1
IPC 1
MIND 1
NCRC 1
NPT 1
PRISM 1
WIN 1

Thrust/Theme
CD – Circuit Design 17
AMS-CSD – Analog/Mixed-Signal Ci... 14
PKG – Packaging 11
HWS – Hardware Security 8
LMD – Logic and Memory Devices 8
CADT – Computer-Aided Design and... 7
ISD – Integrated System Design 6
SLD – System Level Design 6
VER – Verification 6
ESH – Environment Safety and Hea... 5
LPD – Logic & Physical Design 5
TT – Test & Testability 5
NMP – Nanomanufacturing Material... 4
Physical Design 4
AIHW – Artificial Intelligence H... 3
I3T – Innovative and Intelligent... 3
TechCAD – Technology CAD 3
DV – Design Verification 2
IRP – India Research Program 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T3 – Application-speci... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1

GRC Science Area
CADTS – Computer Aided Design & ... 53
ICSS – Integrated Circuit & Syst... 45
NMS – Nanomanufacturing Sciences 23
IPS – Interconnect & Packaging S... 19
CSR – Cross-disciplinary Semicon... 13
DS – Device Sciences 13
SRCEA – SRC Education Alliance 7
PKG – Packaging Sciences 6
DES – Design Sciences 4
ES-H – Environmental Safety & He... 4
MBP – Materials & Bulk Processes... 3
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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151: pdfPackaging Research Needs Document
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152: GRC Managed Crosscuts - SRC
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180: pdfDSMS Research Needs
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