Questions?
[x] SRC Program
GRC

Content Type
Other 113
Events 80
Patent Filings 1

Year
2024 1
2023 7
2022 11
2021 4
2020 4
2019 5
2018 6
2017 5
2016 9
2015 5
2014 2
2013 3
2012 3
2011 92
2010 34
2009 1

Center
CHIRP 5
TxACE 5
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
EBSM 1
GSRC 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 8
AMS-CSD – Analog/Mixed-Signal Ci... 3
LMD – Logic and Memory Devices 3
LPD – Logic & Physical Design 3
SLD – System Level Design 3
AIHW – Artificial Intelligence H... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
HWS – Hardware Security 2
ISD – Integrated System Design 2
NMP – Nanomanufacturing Material... 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 13
ICSS – Integrated Circuit & Syst... 12
IPS – Interconnect & Packaging S... 10
PKG – Packaging Sciences 6
NMS – Nanomanufacturing Sciences 5
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

1 through 30 of 194 similar documents, best matches first.   
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1: pdfVIA-2020 Forum - Panel 3 - Nair
Evolution of Computer Architectures Ravi Nair IBM Thomas J. Watson Research Center Yorktown Heights, NY July 10, 2008 RN 7/10/08 2 Thanks to Dan Prener for collaboration and useful ...
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Integrated Circuit and Systems Sciences Research Needs: Integrated System Design June 2013 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) program ...
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8: pdf2007 Circuit Design Need
ICSS Research Needs: Circuit Design Addressing the Grand Challenges listed in the 2006 International Technology Roadmap for Semiconductors (http://public.itrs.net) requires the ...
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9: pdf2006 Circuit Design Needs Categories
Artificial Intelligence HW: Research Needs June 2019 SRC's Global Research Collaboration is please to introduce the Artificial Intelligence Hardware (AIHW) program and a new ...
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11: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
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URL: https://www.src.org/calendar/e003676/lu.pdf
Modified: 2010-07-29 - 1.1MB
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2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
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21: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
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29: pdf2011-2015 SRC-GRC Strategic Plan
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1 through 30 of 194 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 next >>