Questions?
Content Type
Other 275
Events 182
Patent Filings 28

SRC Program
SRC 213
GRC 198
JUMP2 23
NRI 22
JUMP 12
SRP 6
FCRP 4
Auto 3
STARnet 3
nCORE 3
3D EC 2
ICA 1

Year
2024 12
2023 32
2022 33
2021 20
2020 13
2019 17
2018 16
2017 37
2016 17
2015 8
2014 7
2013 12
2012 26
2011 123
2010 79
2009 1
2008 1

Center
ACE4S 7
ASCENT 7
EBSM 6
TxACE 5
CHIRP 4
CRISP 4
SONIC 4
E2CDA-NRI 3
GSRC 3
INDEX 3
MIND 3
SWAN 3
ACE 2
C-FAR 2
C2S2 2
CBRIC 2
CUBIC 2
FAME 2
FENA 2
IFC 2
LEAST 2
MSD 2
MuSyC 2
NEWLIMITS 2
NRI-NSF 2
SUPREME 2
TerraSwarm 2
WIN 2
AMML 1
C-SPIN 1
CAPSL 1
CHIMES 1
CNFD 1
COCOSYS 1
COGNISENSE 1
DEEP3M 1
E2CDA 1
IMPACT 1
NPT 1
PRISM 1

Thrust/Theme
CD – Circuit Design 9
I3T – Innovative and Intelligent... 9
SLD – System Level Design 9
ESH – Environment Safety and Hea... 6
HWS – Hardware Security 6
PKG – Packaging 6
ASCENT-T1 – Vertical CMOS 5
AMS-CSD – Analog/Mixed-Signal Ci... 3
LPD – Logic & Physical Design 3
NMP – Nanomanufacturing Material... 3
CADT – Computer-Aided Design and... 2
CRISP-T1 – Hardware Support for ... 2
CRISP-T3 – Scaling Applications ... 2
ISD – Integrated System Design 2
NEWLIMITS-T4 – Characterization ... 2
SCARF – Supply Chain AI Realized... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
AIHW – Artificial Intelligence H... 1
AMML-T1 – Antiferromagnetic Magn... 1
ASCENT-T3 – Heterogeneous Integr... 1
ASCENT-T4 – Merged Logic Memory ... 1
BEP – Back End Processes 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T1 – Neuro-inspired Algori... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
LMD – Logic and Memory Devices 1
MT – Memory Technologies 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T5 – Simulations and M... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SUPREME-T1 – Digital and Analog 1
SUPREME-T2 – Memory and Applicat... 1
SUPREME-T3 – Interconnects and M... 1
SUPREME-T4 – Materials Discovery... 1
TT – Test & Testability 1
VER – Verification 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 24
CADTS – Computer Aided Design & ... 19
NMS – Nanomanufacturing Sciences 14
IPS – Interconnect & Packaging S... 8
DS – Device Sciences 5
SRCEA – SRC Education Alliance 4
CSR – Cross-disciplinary Semicon... 3
PKG – Packaging Sciences 3
ES-H – Environmental Safety & He... 1
MPS – Material & Process Science... 1
NIS – Nanostructure & Integratio... 1

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