Questions?
[x] SRC Program
GRC

Content Type
Other 92
Events 88
Patent Filings 14

Year
2024 1
2023 10
2022 14
2021 8
2020 8
2019 7
2018 15
2017 6
2016 8
2015 7
2014 5
2013 4
2012 2
2011 50
2010 32
2009 1
2008 1

Center
EBSM 12
TxACE 9
CHIRP 6
C2S2 2
FENA 2
GSRC 2
ACE4S 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CNFD 1
CRISP 1
IPC 1
NCRC 1
NRI-NSF 1

Thrust/Theme
ESH – Environment Safety and Hea... 13
AMS-CSD – Analog/Mixed-Signal Ci... 8
PKG – Packaging 7
HWS – Hardware Security 5
ISD – Integrated System Design 5
LMD – Logic and Memory Devices 5
LPD – Logic & Physical Design 5
NMP – Nanomanufacturing Material... 5
PAT – Patterning 4
SLD – System Level Design 4
NEM – Nanoengineered Materials 3
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
I3T – Innovative and Intelligent... 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CRISP-T1 – Hardware Support for ... 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
NMS – Nanomanufacturing Sciences 12
CADTS – Computer Aided Design & ... 7
ES-H – Environmental Safety & He... 7
ICSS – Integrated Circuit & Syst... 7
IPS – Interconnect & Packaging S... 4
PKG – Packaging Sciences 4
MPS – Material & Process Science... 3
CSR – Cross-disciplinary Semicon... 2
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

61 through 90 of 194 similar documents, best matches first.   
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61: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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62: pdfPackaging Research Needs Document
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63: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
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Modified: 2016-02-09 - 110KB
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64: pdfPackaging Research Needs Document
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Modified: 2014-12-12 - 112KB
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65: pdfMicrosoft PowerPoint - Burnham Session I updated (2).ppt [Compatibilit...
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Modified: 2011-06-17 - 152KB
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66: Trends in Semiconductor Materials (Event E005568) - SRC
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69: pdfMicrosoft PowerPoint - SessionII_agenda_ver2_burnham updated...
2009 GRC ETAB Summer Study La Quinta Golf Resort, CA June 29-30, 2009 Session II: Systems, Software, and Applications Research for the Semiconductor Industry Working Committee  ...
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71: pdfETAB Member Survey Results and Action Plan
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72: pdfOutput from 2009 SRC GRC ETAB Summer Study
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73: Liaison Handbook - SRC
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74: pdfMicrosoft Word - Novel_Device_Needs_May03.doc
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76: pdfMicrosoft Word - Final 2004 Needs.doc
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78: pdf2009 Summer Study: Trends in Member Feedback on GRC Portfolio...
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82: pdfSlide 1
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88: 2020 Simon Karecki Award Winner - SRC
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89: 2019 Simon Karecki Award Winner - SRC
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90: 2018 Simon Karecki Award Winner - SRC
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61 through 90 of 194 similar documents, best matches first.   
<< previous Page: 1 2 3 4 5 6 7 next >>