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SRC Program

SRC	287
GRC	257
FCRP	53
NRI	51
JUMP2	22
STARnet	16
nCORE	7
JUMP	5
3D EC	3
ERI	2
ICA	1
SRCEA	1
SRP	1

Year

2024	12
2023	30
2022	42
2021	38
2020	16
2019	12
2018	22
2017	34
2016	17
2015	20
2014	19
2013	19
2012	50
2011	170
2010	130
2009	1
2008	1

Thrust/Theme

ESH – Environment Safety and Hea...	8
PKG – Packaging	8
LMD – Logic and Memory Devices	7
AMS-CSD – Analog/Mixed-Signal Ci...	6
LPD – Logic & Physical Design	6
CADT – Computer-Aided Design and...	5
NMP – Nanomanufacturing Material...	5
CD – Circuit Design	4
HWS – Hardware Security	4
ISD – Integrated System Design	4
SLD – System Level Design	4
TT – Test & Testability	4
VER – Verification	4
NEWLIMITS-T1 – Novel Computing a...	3
NEWLIMITS-T4 – Characterization ...	3
ADS – Alternative Device Structu...	2
FACSYS – Factory Systems	2
IMPACT-T1 – Materials for Scaled...	2
Materials	2
NEM – Nanoengineered Materials	2
NEWLIMITS-T2 – 2D Materials Devi...	2
NEWLIMITS-T3 – Advanced Manufact...	2
NEWLIMITS-T5 – Simulations and M...	2
PAT – Patterning	2
AIHW – Artificial Intelligence H...	1
AMML-T1 – Antiferromagnetic Magn...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T3 – Heterogeneous Integr...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
CFM&TCM – CFM & Total Chemical M...	1
CM – Compact Modeling	1
CRISP-T1 – Hardware Support for ...	1
CSR – Cross-Disciplinary Semicon...	1
ComSenTer-T1 – Systems and Algor...	1
ComSenTer-T2 – mm-wave/THz ICs a...	1
ComSenTer-T3 – Application-speci...	1
ComSenTer-T4 – Center-wide Demon...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
I3T – Innovative and Intelligent...	1
IMPACT-T2 – Materials for Storag...	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1
PhyDes – Physical Design	1
Physical Design	1
Plasma Etch	1
Process Architecture	1
Processes – Processes	1
Quality & Reliability	1
Rapid Yield Learning	1
Reliability	1
Resist	1