Questions?
Content Type
Other 402
Events 375
Patent Filings 10

SRC Program
SRC 381
GRC 326
NRI 27
JUMP2 25
FCRP 17
3D EC 5
Auto 4
SRP 3
ICA 2
JUMP 2
STARnet 2
nCORE 2
ERI 1
NINE 1

Year
2024 18
2023 39
2022 50
2021 37
2020 17
2019 23
2018 31
2017 50
2016 23
2015 26
2014 27
2013 27
2012 48
2011 217
2010 138
2009 1
2008 1

Center
TxACE 12
C2S2 11
GSRC 10
MSD 10
FENA 9
IFC 9
MuSyC 8
CHIRP 5
E2CDA-NRI 4
EBSM 4
INDEX 4
C-FAR 3
CNFD 3
FAME 3
LEAST 3
SONIC 3
SWAN 3
TerraSwarm 3
ACE 2
CUBIC 2
SUPREME 2
ACE4S 1
ADA 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
MIND 1
NCRC 1
NPT 1
NRI-NSF 1
PRISM 1

Thrust/Theme
PKG – Packaging 10
HWS – Hardware Security 8
AMS-CSD – Analog/Mixed-Signal Ci... 7
SLD – System Level Design 7
CADT – Computer-Aided Design and... 6
LPD – Logic & Physical Design 6
VER – Verification 6
ISD – Integrated System Design 5
LMD – Logic and Memory Devices 5
AIHW – Artificial Intelligence H... 4
CD – Circuit Design 4
ESH – Environment Safety and Hea... 4
TT – Test & Testability 4
I3T – Innovative and Intelligent... 3
NMP – Nanomanufacturing Material... 3
Physical Design 3
EP3C – Efficiency and Performanc... 2
NEM – Nanoengineered Materials 2
PAT – Patterning 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1

GRC Science Area
CADTS – Computer Aided Design & ... 50
ICSS – Integrated Circuit & Syst... 34
NMS – Nanomanufacturing Sciences 21
IPS – Interconnect & Packaging S... 18
CSR – Cross-disciplinary Semicon... 10
DS – Device Sciences 10
SRCEA – SRC Education Alliance 9
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 3
DES – Design Sciences 2
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdf2016 SLD Research Needs Document
System Level Design Research Needs: System Level Design April 2016 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) program member companies are ...
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2: pdf2011 Systems Design Needs
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3: pdfS200807_research_needs_PKG.doc
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4: pdfMicrosoft Word - Packaging Research Needsv2.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
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5: pdfAcknowledgements
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6: pdfDecadal Plan Full Report
F U L L R E P O R T Decadal Plan for Semiconductors Published January 2021 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ...
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Research Needs: Computer-Aided Design and Test (CADT) May 12, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 The Computer-Aided Design and Test (CADT) research ...
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8: pdfSRC/NSF Design Forum - Position Statement
A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
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10: pdfPowerPoint Presentation
CogniSense: Center on Cognitive Multispectral Sensors Center Overview and Highlights Director: Saibal Mukhopadhyay, Georgia Tech Co-Director: James Buckwalter, University of ...
URL: https://www.src.org/...r/e007830/cognisense_sab_f2f_2024.pdf
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Event-Driven Random Backpropagation: Enabling Neuromorphic Deep Learning Machines Emre Neftci Department of Cognitive Sciences, UC Irvine, Department of Computer Science, UC ...
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1 Summary Report for the Forum on Integrated Sensors for Cybersystems Forum Dates: March 22 & 23, 2012 Forum Location: Carton House, Maynooth, Co. Kildare, Ireland Sponsors: ...
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13: pdf2006 Circuit Design Needs Categories
Integrated Circuit and Systems Sciences Research Needs: Integrated System Design June 2013 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) program ...
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14: pdfPowerPoint Presentation
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15: pdf2006 Circuit Design Needs Categories
Artificial Intelligence HW: Research Needs June 2019 SRC's Global Research Collaboration is please to introduce the Artificial Intelligence Hardware (AIHW) program and a new ...
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17: pdf2010 Circuit Design Needs Categories
ICSS Research Needs: Integrated System Design 2010 The SRC GRC member companies are pleased to release this document that describes their research needs in the thrust of Integrated ...
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18: pdf2007 System Design Needs
ICSS Research Needs: Integrated System Design The ITRS cites design cost due to exploding silicon and system complexities as the key factor with the potential to limit the ...
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19: pdfResearch Needs: Artificial Intelligence
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Artificial Intelligence HW: Research Needs May 2020 Semiconductor Research Corp. (SRC) Global Research Collaboration (GRC) is soliciting white papers in the Artificial ...
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21: pdfResearch needs documen - packaging
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URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
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22: pdf2011 Verification Needs Document Final
SRC Research Needs in Computer-Aided Design and Test Verification 2011-2012 CADTS Research Needs: Verification This member-generated document describes needs and problems SRC ...
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23: pdf2002-2007 ICSS Research Needs Document
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28: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
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1 through 30 of 787 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>