Questions?
[x] SRC Program
GRC

Content Type
Events 192
Other 167
Patent Filings 16

Year
2024 1
2023 10
2022 16
2021 11
2020 9
2019 9
2018 23
2017 8
2016 12
2015 26
2014 5
2013 7
2012 8
2011 146
2010 65
2009 1
2008 1

Center
EBSM 12
TxACE 6
CHIRP 5
FENA 2
GSRC 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
ESH – Environment Safety and Hea... 13
PKG – Packaging 9
NMP – Nanomanufacturing Material... 7
CD – Circuit Design 6
HWS – Hardware Security 6
LMD – Logic and Memory Devices 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
PAT – Patterning 5
TT – Test & Testability 5
CADT – Computer-Aided Design and... 4
ISD – Integrated System Design 4
LPD – Logic & Physical Design 4
NEM – Nanoengineered Materials 3
SLD – System Level Design 3
VER – Verification 3
DV – Design Verification 2
DesTech – Design Techniques 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
I3T – Innovative and Intelligent... 2
Modeling & Simulation 2
Physical Design 2
TechCAD – Technology CAD 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1

GRC Science Area
CADTS – Computer Aided Design & ... 27
ICSS – Integrated Circuit & Syst... 24
NMS – Nanomanufacturing Sciences 21
IPS – Interconnect & Packaging S... 9
ES-H – Environmental Safety & He... 7
PKG – Packaging Sciences 5
DES – Design Sciences 4
MPS – Material & Process Science... 3
CSR – Cross-disciplinary Semicon... 2
MBP – Materials & Bulk Processes... 2
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

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1: pdfFinal Report - Workshop on Failure and Uncertainty in Mixed-Signal...
National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
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2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
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4: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
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10: pdf2011-2015 SRC-GRC Strategic Plan
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16: pdfTechnology Working Group Meeting on Future DNA Synthesis Technologies
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17: pdf2006 Circuit Design Needs Categories
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18: pdf2010 SRC Operations Plan
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1 through 30 of 375 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>