Questions?
Content Type
Other 426
Events 328
Patent Filings 46

SRC Program
SRC 356
GRC 336
NRI 38
FCRP 37
JUMP2 23
3D EC 4
Auto 3
JUMP 3
SRP 3
STARnet 3
SRCEA 2
ERI 1
ICA 1
NINE 1
nCORE 1

Year
2024 13
2023 37
2022 50
2021 42
2020 17
2019 18
2018 31
2017 44
2016 19
2015 30
2014 19
2013 21
2012 44
2011 204
2010 159
2009 1
2008 1

Center
C2S2 25
GSRC 16
IFC 15
MSD 15
FENA 13
TxACE 13
INDEX 7
MuSyC 7
CHIRP 6
EBSM 6
SWAN 6
CNFD 5
E2CDA-NRI 5
FAME 5
LEAST 5
C-FAR 4
NRI-NSF 4
SONIC 4
TerraSwarm 4
ACE 2
ASCENT 2
C-SPIN 2
CBRIC 2
CUBIC 2
MIND 2
SUPREME 2
ACE4S 1
Benchmarking 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
NCRC 1
NPT 1
PRISM 1
WIN 1

Thrust/Theme
CD – Circuit Design 14
PKG – Packaging 10
AMS-CSD – Analog/Mixed-Signal Ci... 8
HWS – Hardware Security 7
CADT – Computer-Aided Design and... 6
VER – Verification 6
ESH – Environment Safety and Hea... 5
ISD – Integrated System Design 5
LMD – Logic and Memory Devices 5
LPD – Logic & Physical Design 5
TT – Test & Testability 5
DesTech – Design Techniques 4
NMP – Nanomanufacturing Material... 4
SLD – System Level Design 4
TechCAD – Technology CAD 3
FACSYS – Factory Systems 2
Factory Systems 2
I3T – Innovative and Intelligent... 2
NEM – Nanoengineered Materials 2
PAT – Patterning 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T3 – Heterogeneous Integr... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CBRIC-T1 – Neuro-inspired Algori... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1

GRC Science Area
CADTS – Computer Aided Design & ... 56
ICSS – Integrated Circuit & Syst... 42
NMS – Nanomanufacturing Sciences 31
IPS – Interconnect & Packaging S... 17
CSR – Cross-disciplinary Semicon... 16
DS – Device Sciences 15
DES – Design Sciences 7
SRCEA – SRC Education Alliance 6
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
MBP – Materials & Bulk Processes... 3
MPS – Material & Process Science... 2
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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151: pdfLogic and Memory Devices Research Needs Document
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153: Technical Excellence Award - SRC
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154: Technical Excellence Award - SRC
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155: pdfYEARS
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161: pdfPackaging Research Needs Document
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166: pdf2008 Verification Needs final.doc
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180: pdfPresentation Title
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