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[x] SRC Program
GRC

Content Type
Events 184
Other 146
Patent Filings 8

Year
2024 1
2023 10
2022 17
2021 10
2020 8
2019 8
2018 17
2017 7
2016 10
2015 16
2014 4
2013 4
2012 6
2011 151
2010 59
2009 1

Center
TxACE 11
CHIRP 7
EBSM 4
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 11
CD – Circuit Design 8
AMS-CSD – Analog/Mixed-Signal Ci... 7
HWS – Hardware Security 7
LMD – Logic and Memory Devices 7
CADT – Computer-Aided Design and... 6
ESH – Environment Safety and Hea... 5
NMP – Nanomanufacturing Material... 5
ISD – Integrated System Design 4
LPD – Logic & Physical Design 4
SLD – System Level Design 4
TT – Test & Testability 4
VER – Verification 4
EP3C – Efficiency and Performanc... 2
Factory Systems 2
I3T – Innovative and Intelligent... 2
TechCAD – Technology CAD 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 29
CADTS – Computer Aided Design & ... 26
NMS – Nanomanufacturing Sciences 13
IPS – Interconnect & Packaging S... 10
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 4
DES – Design Sciences 2
MBP – Materials & Bulk Processes... 2
MPS – Material & Process Science... 2
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

211 through 240 of 338 similar documents, best matches first.   
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211: pdfCADT Research Needs Document - June 2018
Research Challenges in CAD and Test Semiconductor Research Corporation June 2018 The Computer-Aided Design and Test thrust at the Semiconductor Research Corporation is soliciting ...
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212: pdfPowerPoint Presentation
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Modified: 2015-02-04 - 2.9MB
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213: Sram Cell with Intrinsically High Stability and Low Leakage ...
Sram Cell with Intrinsically High Stability and Low Leakage Application Type: Utility Patent Number: 7920409 Country: United States Status: Filed on 5-Jun-2007, Issued on ...
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Modified: 2011-04-05 - 24KB
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214: pdfBEP Research Needs Statement
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215: pdfSRC/NSF Design Forum - Position Statement
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216: pdfKwok Ng
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217: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
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218: pdfSRC/NSF Design Forum - Posiltion Statement
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219: The Challenges and Opportunities of Atomic Layer Etching (Event...
The Challenges and Opportunities of Atomic Layer Etching Date: Thursday, May 5, 2016, 2 p.m.-3 p.m. ET Location: University of Arizona, Tucson, AZ, United States Type: e-Workshop ...
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220: pdfSlide 1
Third Annual India Design Review January 7-8, 2015 William H. Joyner, Jr. CADTS William.Joyner@src.org David C. Yeh ICSS David.Yeh@src.org Restricted Distribution: Contains SRC ...
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221: pdfE003676 - Memory Forum - Materials for ReRAM
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Modified: 2010-07-29 - 620KB
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222: SRC Heterogeneous Integration Colloquium (Event E006526) - SRC
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URL: https://www.src.org/calendar/e006526/
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223: pdfDesign Forum: Hugo De Man Position Statement
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URL: https://www.src.org/...764/hugo-deman-position-statement.pdf
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224: pdfHeterogeneous Integration of Packaging Key Conclusions Stanford...
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225: pdfS200807_research_needs_BEP.doc
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URL: https://www.src.org/...ch-needs/2008/back-end-processing.pdf
Modified: 2011-02-03 - 35KB
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226: pdfMicrosoft Word - BEP_Research_Needs.doc
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227: pdfVIA-2020 Forum - Panel 3 - Baas
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Modified: 2011-04-18 - 1.9MB
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228: pdfE003676 - Memory Forum - SRAM Scaling Limit: Its Circuit and...
SRAM Scaling Limit: Its Circuit & Architecture Solutions Nam Sung Kim Ph D Nam Sung Kim, Ph.D. Assistant Professor Department of Electrical and Computer Engineering University of ...
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229: pdfE003676 - Memory Forum - Perspectives on ReEAM Technologies
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URL: https://www.src.org/calendar/e003676/yoo.pdf
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230: India Design Review (Event E005563) - SRC
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URL: https://www.src.org/calendar/e005563/
Modified: 2015-02-04 - 82KB
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231: pdfBEP Research Needs Statement
Back End Processing Needs Document A. Introduction This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP), which includes ...
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232: 2015 Summer Study - Bio - John Hanks - SRC
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URL: https://www.src.org/calendar/e005502/hanks-bio/
Modified: 2015-06-05 - 21KB
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233: pdfVIA-2020 Forum - Panel 3 - Nair
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URL: https://www.src.org/calendar/e003362/p3-nair.pdf
Modified: 2011-04-18 - 221KB
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234: pdfVIA-2020 Forum - Intro - Hillenius
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Modified: 2011-04-18 - 88KB
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235: pdfe003676 - Memory Forum - eDRAM to the Rescue
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Modified: 2010-07-29 - 1.0MB
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236: pdf슬라이드 1
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Modified: 2022-10-30 - 700KB
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237: pdfCADT - Verification Reserach Needs Document
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239: pdfE003676 - Memory Forum - Research Priorities/Needs
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240: pdfBEP Research Needs Statement
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211 through 240 of 338 similar documents, best matches first.   
<< previous Page: 4 5 6 7 8 9 10 11 12 next >>