Questions?
[x] SRC Program
GRC

Content Type
Events 164
Other 148
Patent Filings 23

Year
2023 10
2022 18
2021 13
2020 6
2019 7
2018 12
2017 6
2016 9
2015 11
2014 5
2013 5
2012 11
2011 129
2010 68
2009 1

Center
TxACE 9
CHIRP 6
EBSM 6
ACE4S 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CNFD 1
IPC 1
NCRC 1
NRI-NSF 1

Thrust/Theme
LMD – Logic and Memory Devices 13
Advanced Devices & Technologies 9
PKG – Packaging 9
ESH – Environment Safety and Hea... 7
NMP – Nanomanufacturing Material... 7
AMS-CSD – Analog/Mixed-Signal Ci... 6
HWS – Hardware Security 6
NEM – Nanoengineered Materials 6
TT – Test & Testability 6
CADT – Computer-Aided Design and... 4
CD – Circuit Design 4
VER – Verification 4
Factory Systems 3
I3T – Innovative and Intelligent... 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
PAT – Patterning 3
SLD – System Level Design 3
AMS – Analog and Mixed-Signal De... 2
DCMOS – Digital CMOS Technologie... 2
FACSYS – Factory Systems 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
NMS – Nanomanufacturing Sciences 25
CADTS – Computer Aided Design & ... 23
ICSS – Integrated Circuit & Syst... 20
NIS – Nanostructure & Integratio... 10
IPS – Interconnect & Packaging S... 9
PID – Process Integration & Devi... 6
PKG – Packaging Sciences 5
MPS – Material & Process Science... 4
DS – Device Sciences 3
MIC – Microstructure Sciences 3
CSR – Cross-disciplinary Semicon... 2
ES-H – Environmental Safety & He... 2
MBP – Materials & Bulk Processes... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

211 through 240 of 335 similar documents, best matches first.   
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211: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
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Modified: 2011-02-03 - 23KB
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212: pdf2011 Systems Design Needs
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214: pdfPowerPoint Presentation
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Modified: 2011-05-04 - 1.1MB
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215: SRCEA: 2008 Simon Karecki Award - SRC
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216: pdf2nd Deterministic Doping Workshop
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217: pdfCADT - System, Logic and Physical Design Tools (SLPD)
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218: pdfResearch Needs: Hardware Security (HWS)
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219: pdfResearch Challenges in Computer-Aided Design and Test
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220: pdfSRC/NSF Design Forum - Position Statement
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221: pdfMicrosoft Word - SRCTAB_ResearchPrioritiesDSRCCLMay162014j.doc
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222: pdf2004 Systems Needs Document.doc
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223: Summer Study - Abstract - James Kolhoff - SRC
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224: pdfResearch Needs: Hardware Security (HWS)
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225: pdfSRC CADTS Research Needs in Test and Testability
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226: pdfSRC CADTS Research Needs in Test and Testability
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227: pdfSemiconductor Research Corporation
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230: Method of Fabricating Quantum Bridges by Selective Etching of...
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231: GRC SEMATECH Engineering Research Center for Environmentally...
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232: SRCEA: 2005 Simon Karecki Award - SRC
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URL: https://www.src.org/program/grc/karecki/award/2005/
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233: pdfSRC: Factory Systems Needs Document 2003
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236: pdfNMS Patterning Review Agenda
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URL: https://www.src.org/calendar/e004187/e004187-agenda.pdf
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237: pdfVirtual John Oakley, Science Director Tameka Bell & Mary Nichols...
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238: pdfVertically Integrated Test/Calibration and Reliability Enhancement...
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Modified: 2010-07-19 - 54KB
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239: pdfDesign Forum: John Hayes Position Statement
Future Directions for Design Automation: Three Challenges John P. Hayes October 1, 2006 1. Complexity and Change With CMOS transistor size approaching the nanometer range, two ...
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240: pdfAugust 2011 Patterning Review Agenda
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URL: https://www.src.org/calendar/e004185/061011-agenda.pdf
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211 through 240 of 335 similar documents, best matches first.   
<< previous Page: 4 5 6 7 8 9 10 11 12 next >>