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[x] SRC Program
GRC

Content Type
Other 146
Events 144
Patent Filings 45

Year
2024 1
2023 9
2022 14
2021 8
2020 8
2019 8
2018 20
2017 7
2016 10
2015 15
2014 4
2013 5
2012 5
2011 136
2010 37
2009 1
2008 1

Center
TxACE 11
CHIRP 7
EBSM 7
ACE4S 2
CAIST 1
CDADIC 1
CEMPI 1
GSRC 1
IPC 1
NCRC 1

Thrust/Theme
TT – Test & Testability 23
CADT – Computer-Aided Design and... 11
HWS – Hardware Security 10
PKG – Packaging 10
ESH – Environment Safety and Hea... 9
LPD – Logic & Physical Design 9
ISD – Integrated System Design 7
VER – Verification 7
AMS-CSD – Analog/Mixed-Signal Ci... 6
CD – Circuit Design 5
SLD – System Level Design 5
DesTech – Design Techniques 4
I3T – Innovative and Intelligent... 3
NMP – Nanomanufacturing Material... 3
Physical Design 3
DV – Design Verification 2
LMD – Logic and Memory Devices 2
Modeling & Simulation 2
Reliability 2
Synthesis & Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 60
ICSS – Integrated Circuit & Syst... 32
NMS – Nanomanufacturing Sciences 14
IPS – Interconnect & Packaging S... 10
DES – Design Sciences 8
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
INT – Interconnect Sciences 2
MFGPS – Manufacturing Process Sc... 2
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

151 through 180 of 335 similar documents, best matches first.   
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151: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
Research Needs for Extending CMOS to its Ultimate Limit November 1, 2002 Edition 1 2002 CMOS Extension Task Force SRC Nanostructure & Integration Sciences and Materials & Process ...
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152: pdfOverview of Research
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153: SemiSynBio Consortium and Roadmap - SRC
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154: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
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155: pdfVIA-2020 Forum - Panel 3 Presentation - Pham
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156: pdfIRP Advisory Board Meeting
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157: pdfNanomanufacturing Materials and Processes Research Needs Document
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158: pdfVIA-2020 Forum - Panel 1 - Presentation - Rabaey
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URL: https://www.src.org/...ar/e003362/p1-presentation-rabaey.pdf
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159: pdfNanomanufacturing Materials and Processes Reserach Needs Document...
Research Needs Document: Nanomanufacturing Materials and Processes June 11, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background This document is ...
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160: pdfSRC Research Needs for Semiconductor Device Compact Modeling
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URL: https://www.src.org/...earch-needs/2003/compact-modeling.pdf
Modified: 2011-02-03 - 149KB
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161: pdfSRC Research Needs for Semiconductor Device Compact Modeling
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162: pdfMicrosoft Word - Novel_Device_Needs_May03.doc
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163: pdfSRC: Factory Systems Needs Document 2003
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164: pdfMicrosoft Word - Executive Summary-Schenkel-Nov01-10
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165: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
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166: pdfBEP Research Needs Statement
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167: pdfNeeds document - grey Area between Back-End Processing and Packaging...
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168: pdfBEP Research Needs Statement
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169: pdfResearch Needs Document: Nanomanufacturing Materials and Processes
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170: pdfStudent Poster Information
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171: pdfMicrosoft Word - 2005_Final_ds_msneeds_rev3.doc
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172: pdfResearch Needs for Device Sciences Modeling and Simulation
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URL: https://www.src.org/...am/grc/ds/research-needs/2010/ams.pdf
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173: pdfMicrosoft Word - 2005_Final_ds_msneeds_rev3.doc
1 Research Needs for Device Sciences Modeling and Simulation (May 6, 2005) SRC Device Sciences 2005 Modeling and Simulation Task Force Contributing organizations: Axcelis, ...
URL: https://www.src.org/...c/ds/research-needs/2005/modeling.pdf
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174: pdfMicrosoft PowerPoint - etab_jun09.ppt [Compatibility Mode]
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URL: https://www.src.org/.../2009s-study-siii-vertint-cong-v2.pdf
Modified: 2011-06-17 - 473KB
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175: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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176: pdfMicrosoft Word - ITRSpaperfinal.doc
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URL: https://www.src.org/...004100-09-executive-summary-rogge.pdf
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177: pdfResearch Needs: Logic and Memory Devices (LMD)
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URL: https://www.src.org/...rch-needs/2023_lmd_research_needs.pdf
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178: pdfVIA-2020 Forum - Panel 3 - Baas
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URL: https://www.src.org/calendar/e003362/p3-baas.pdf
Modified: 2011-04-18 - 1.9MB
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179: pdf2009 Summer Study: Future Challenges from a Thermal Perspective...
Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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180: pdfResearch Needs: Logic and Memory Devices (LMD)
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URL: https://www.src.org/...022/2022_lmd_research_needs_final.pdf
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151 through 180 of 335 similar documents, best matches first.   
<< previous Page: 2 3 4 5 6 7 8 9 10 11 next >>