Questions?
Content Type
Other 272
Events 229
Patent Filings 4

SRC Program
SRC 244
GRC 208
JUMP2 21
NRI 12
FCRP 6
SRP 5
3D EC 4
Auto 4
STARnet 3
JUMP 2
ICA 1
SRCEA 1
nCORE 1

Year
2024 14
2023 33
2022 35
2021 20
2020 10
2019 14
2018 21
2017 36
2016 17
2015 15
2014 10
2013 21
2012 44
2011 116
2010 90
2009 1

Center
CHIRP 5
SONIC 4
TxACE 4
ACE 2
C-FAR 2
CUBIC 2
FAME 2
LEAST 2
TerraSwarm 2
ACE4S 1
ADA 1
ASCENT 1
C-SPIN 1
C2S2 1
CAIST 1
CBRIC 1
CDADIC 1
CEMPI 1
CHIMES 1
CNFD 1
COCOSYS 1
COGNISENSE 1
CONIX 1
CRISP 1
ComSenTer 1
EBSM 1
FENA 1
GSRC 1
IFC 1
INDEX 1
IPC 1
JUMP-URI 1
MSD 1
MuSyC 1
NCRC 1
PRISM 1
SUPREME 1
SWAN 1

Thrust/Theme
PKG – Packaging 8
NMP – Nanomanufacturing Material... 4
AIHW – Artificial Intelligence H... 3
AMS-CSD – Analog/Mixed-Signal Ci... 3
HWS – Hardware Security 3
LMD – Logic and Memory Devices 3
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
I3T – Innovative and Intelligent... 2
SCARF – Supply Chain AI Realized... 2
SLD – System Level Design 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
ASCENT-T2 – Beyond CMOS 1
ASCENT-T3 – Heterogeneous Integr... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CBRIC-T1 – Neuro-inspired Algori... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T1 – ARENA Integrator 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T1 – Systems and Algor... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
ComSenTer-T4 – Center-wide Demon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
ISD – Integrated System Design 1
Interconnect Architecture 1
JUMP-URI – JUMP Undergraduate Re... 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 17
ICSS – Integrated Circuit & Syst... 14
IPS – Interconnect & Packaging S... 10
SRCEA – SRC Education Alliance 9
NMS – Nanomanufacturing Sciences 6
PKG – Packaging Sciences 5
CSR – Cross-disciplinary Semicon... 3
DS – Device Sciences 3
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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391: SRC NRI: Mission - SRC
NRI Mission and Description Program Mission NRI Mission: Demonstrate non-conventional, low-energy technologies which can outperform CMOS on critical applications in ten years and ...
URL: https://www.src.org/program/nri/about/mission/
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392: pdfMicrosoft Word - Packaging_Needs.doc
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393: pdfBEP Research Needs Statement
IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2012/interface.pdf
Modified: 2012-09-25 - 134KB
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394: pdfResearch Needs for Device Sciences Modeling and Simulation
1 Research Needs for Analog and Mixed-Signal (AMS) Devices Oct. 2010 Device Sciences, GRC Semiconductor Research Corp P.O. Box 12053 Research Triangle Park, NC 27709-2053 Scope and ...
URL: https://www.src.org/...am/grc/ds/research-needs/2010/ams.pdf
Modified: 2011-02-15 - 73KB
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395: pdfModeling and Co-Simulation of Power Distribution Networks for...
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396: Summer Study - Abstract - James Kolhoff - SRC
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397: Marinella Abstract - SRC
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398: pdfVIA Forum - P2 Presentation - Raja Koduri
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399: pdfVIA-2020 Forum - Panel 4 - Montague
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400: SRC: Grant Application for Nanomanufacturing Sciences (NMS) Patterning...
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URL: https://www.src.org/compete/archive/grc/s200404/
Modified: 2011-02-03 - 26KB
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401: nCORE Request for Proposals - SRC
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URL: https://www.src.org/compete/ncore/rfp/
Modified: 2017-07-28 - 53KB
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402: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
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403: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
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404: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
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URL: https://www.src.org/.../grc/nis/research-needs/2002/cmos.pdf
Modified: 2010-06-21 - 286KB
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405: pdfResearch needs documen - packaging
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URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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406: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
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URL: https://www.src.org/...m/grc/ds/research-needs/2003/cmos.pdf
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407: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
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408: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
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Modified: 2010-07-29 - 1.1MB
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409: pdfSRC GRC: Nano-Morphic Forum - P2 Guiducci
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410: pdfSlide 1
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URL: https://www.src.org/...ar/e006125/mcdonnell-presentation.pdf
Modified: 2017-03-22 - 309KB
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411: Call for White Papers in Packaging - SRC
Call for White Papers in Packaging Overview Research Needs White Paper Guidelines Timetable and Deadlines Overview The Packaging Thrust area of SRC is soliciting white papers (due ...
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412: Call for Research in India Research Program - SRC
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URL: https://www.src.org/compete/s201910/
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413: STARSS Proposal Submission Guide - SRC
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URL: https://www.src.org/app/proposal/submit/guide/t3s/
Modified: 2016-06-03 - 29KB
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414: Undergraduate Research Program (URP) Call for Applications -...
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415: Forum on Nanoelectronic Manufacturing: From Materials to Systems...
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416: pdfBEP Research Needs Statement
Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
URL: https://www.src.org/...m/grc/ips/research-needs/2011/bep.pdf
Modified: 2011-03-22 - 67KB
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417: pdf2011 Verification Needs Document Final
SRC Research Needs in Computer-Aided Design and Test Verification 2011-2012 CADTS Research Needs: Verification This member-generated document describes needs and problems SRC ...
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418: pdfMicrosoft Word - SRCTAB_ResearchPrioritiesDSRCCLMay162014j.doc
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419: Bevan Baas abstract - SRC
Abstract: Future Energy Efficient Many-Core Processing Bevan Baas Department of Computer & Electrical Engineering Univ. of California/Davis Future fabrication technologies are ...
URL: https://www.src.org/calendar/e003804/baas-abstract/
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420: Call for Research: Interconnect and Packaging Sciences Program...
Call for Research: Interconnect and Packaging Sciences Research Program You may submit your White Paper online or you may send the PDF or PostScript files as email attachments to: ...
URL: https://www.src.org/compete/archive/grc/2004-bep/
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391 through 420 of 505 similar documents, best matches first.   
<< previous Page: 10 11 12 13 14 15 16 17 next >>