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SRC Program

SRC	452
GRC	347
NRI	27
JUMP2	24
FCRP	19
JUMP	5
3D EC	4
Auto	3
STARnet	3
ICA	2
SRP	2
NINE	1
nCORE	1

Year

2024	18
2023	37
2022	51
2021	47
2020	23
2019	25
2018	40
2017	31
2016	30
2015	29
2014	27
2013	32
2012	44
2011	242
2010	161
2009	1
2008	1

Thrust/Theme

CD – Circuit Design	14
PKG – Packaging	11
ESH – Environment Safety and Hea...	9
ISD – Integrated System Design	9
LPD – Logic & Physical Design	9
HWS – Hardware Security	8
AMS-CSD – Analog/Mixed-Signal Ci...	7
SLD – System Level Design	7
I3T – Innovative and Intelligent...	6
LMD – Logic and Memory Devices	6
Physical Design	5
TT – Test & Testability	5
CADT – Computer-Aided Design and...	4
VER – Verification	4
DesSyn – Design Synthesis	3
DesTech – Design Techniques	3
Masks	3
NMP – Nanomanufacturing Material...	3
EP3C – Efficiency and Performanc...	2
NEM – Nanoengineered Materials	2
PAT – Patterning	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T2 – Beyond CMOS	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CBRIC-T1 – Neuro-inspired Algori...	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
Doping Technologies	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FACSYS – Factory Systems	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1
PhyDes – Physical Design	1
Plasma Etch	1
Process Architecture	1
Processes – Processes	1