Questions?
[x] SRC Program
GRC

Content Type
Events 141
Other 135
Patent Filings 14

Year
2023 10
2022 12
2021 9
2020 7
2019 8
2018 14
2017 6
2016 10
2015 12
2014 3
2013 4
2012 6
2011 124
2010 48
2009 1
2008 1

Center
TxACE 9
ACE4S 6
EBSM 6
CHIRP 5
C2S2 2
CAIST 1
CDADIC 1
CEMPI 1
GSRC 1
IPC 1
NCRC 1

Thrust/Theme
SLD – System Level Design 10
AMS-CSD – Analog/Mixed-Signal Ci... 8
CD – Circuit Design 8
PKG – Packaging 8
HWS – Hardware Security 7
I3T – Innovative and Intelligent... 7
ISD – Integrated System Design 7
ESH – Environment Safety and Hea... 6
LMD – Logic and Memory Devices 6
LPD – Logic & Physical Design 6
CADT – Computer-Aided Design and... 4
NMP – Nanomanufacturing Material... 4
TT – Test & Testability 4
VER – Verification 4
SemiSynBio – Semiconductor Synth... 3
AIHW – Artificial Intelligence H... 2
EP3C – Efficiency and Performanc... 2
NEM – Nanoengineered Materials 2
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 29
CADTS – Computer Aided Design & ... 24
NMS – Nanomanufacturing Sciences 16
IPS – Interconnect & Packaging S... 7
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 3
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

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151: pdfSRC GRC: Nano-Morphic Forum - P2 Guiducci
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154: pdf2009 Summer Study: 3D Desig Eco-System
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155: pdfMemory Needs
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156: pdfResearch Needs Document: Logic and Memory Devices
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157: pdfDr. Malcolm Thompson - e-Workshop Packaging
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158: pdfResearch Needs Document: Logic and Memory Devices
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159: pdfLogic and Memory Devices Research Needs Document
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160: pdfETAB Member Survey Results and Action Plan
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161: pdf2008 Verification Needs final.doc
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162: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
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163: pdfVIA-2020 Forum - Panel 4 - Zhirnov
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164: pdfMicrosoft Word - ITRSpaperfinal.doc
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165: pdfDevice Sciences, Semiconductor Research Corp. (SRC)
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166: pdfMicrosoft Word - Pkg Needs 2005.doc
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167: pdfExecSummary MICurrent.doc
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168: pdfBEP Research Needs Statement
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170: pdfVIA-2020 Forum - Panel 1 - Draper
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171: pdfBEP Research Needs Statement
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172: pdfIRP Advisory Board Meeting
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174: pdfスライド 1
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176: pdfDesign Forum: John Hayes Position Statement
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177: pdfChallenges and Opportunities in the Automotive Sector
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178: pdfNMS Nanoengineered Materials Review
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179: pdfVIA-2020 Forum - Panel 2 - Vahid
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180: pdfGRC: HCP Concepts in View of the Science of Superconductors
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151 through 180 of 290 similar documents, best matches first.   
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