Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 26
Patent Filings 11
Other 1

SRC Program
GRC 20
SRC 18
3D EC 4
FCRP 4

Year
2016 3
2013 6
2012 6
2011 10
2010 1

Center
C2S2 11
FENA 11
GSRC 11
IFC 11
MSD 11
MuSyC 11
C-FAR 7
CNFD 7
FAME 7
INDEX 7
LEAST 7
SONIC 7
SWAN 7
TerraSwarm 7
EBSM 6
TxACE 6
NPT 5
CEMPI 4
CAIST 2
ACE4S 1
CDADIC 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 9
BEP – Back End Processes 6
CM – Compact Modeling 2
Multi-level Interconnect 2
NMP – Nanomanufacturing Material... 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 30 of 38 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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2: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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3: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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4: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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5: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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6: TECHCON 2013 (Event E004683) - SRC
TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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7: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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8: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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9: Posters: Undergraduate Research Opportunities (URO) - SRC
TECHCON 2011 TECHCON 2011 Posters - Undergraduate Research Opportunities Room: RioGrande A Back to Session Listing URO Posters Poster Number Presentation Time Title Presenter & ...
URL: https://www.src.org/calendar/e004113/uro-posters/
Modified: 2011-06-30 - 27KB
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10: pdfSemiconductor Research Corporation
TECHCON 2012 Judging Criteria Criteria Technical Content (0 - 35 points) Perceived Value (0 - 15 points) Technology/Information Transfer (0 - 20 points) Presentation (Paper and ...
URL: https://www.src.org/calendar/e004114/judging-criteria.pdf
Modified: 2012-05-10 - 13KB
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11: Judging Criteria - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Judging Criteria Criteria Technical Content 0 - 35 points Perceived Value 0 - 15 points Technology / Information Transfer 0 - 20 points Presentation ...
URL: https://www.src.org/calendar/e004113/judging-criteria/
Modified: 2010-06-21 - 22KB
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12: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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13: Emerging Interconnect Solutions Workshop - Part 1 (Event E004837...
Emerging Interconnect Solutions Workshop - Part 1 Date: Monday, June 11, 2012, 2 p.m.-3:30 p.m. ET Location: via web conference, Research Triangle Park, NC, United States Event ID: ...
URL: https://www.src.org/calendar/e004837/
Modified: 2012-12-11 - 28KB
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14: 2013 GRC SACC and TAB Chair Recognition - SRC
2013 GRC SACC and TAB Chair Recognition TAB and SACC Chairs at TECHCON 2013 Technical Advisory Boards (TABs) and Science Area Coordinating Committees (SACCs) work together with the ...
URL: https://www.src.org/calendar/e004683/tab-chair/
Modified: 2011-09-16 - 21KB
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15: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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16: pdfSlide 1
3D University Research Summit May 5 th , 2011 Restricted Distribution: Contains SRC Confidential Material Restricted Distribution: Contains SRC Confidential Material Summit Goals . ...
URL: https://www.src.org/calendar/e004357/0-intro.pdf
Modified: 2011-05-04 - 285KB
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17: URO Poster Winners (TECHCON 2013) - SRC
Undergraduate Research Opportunities TECHCON 2013 Best Poster Awards First Place URO.23 URO POSTER SRCEA Evaluation of the Photodimerization of 4-vinyl(benzyl) Thymine and ...
URL: https://www.src.org/calendar/e004683/uro/
Modified: 2013-09-09 - 22KB
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18: Composite Thermal Interface Material Including Particles and...
Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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19: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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20: Wafer Fabrication Monitoring/Control System and Method (Patent...
Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
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21: Methods and Apparatuses for Integrated Packaging of Microelectromechan...
Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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22: Integrated Tunable Inductors (Patent P1632) - SRC
Integrated Tunable Inductors Application Type: Utility Patent Number: 9881731 Country: United States Status: Filed on 14-Jun-2016, Issued on 30-Jan-2018 Organization: Arizona State ...
URL: https://www.src.org/library/patent/p1632/
Modified: 2018-01-30 - 24KB
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23: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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24: Process and Apparatus for the Use of Solid Precursor Sources...
Process and Apparatus for the Use of Solid Precursor Sources in Liquid Form for Vapor Deposition of Materials Application Type: Utility Patent Number: 5376409 Country: United ...
URL: https://www.src.org/library/patent/p0261/
Modified: 1994-12-27 - 22KB
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25: Low Dielectric Constant (Low-K) Dielectric and Method of Forming...
Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same Application Type: Utility Patent Number: 10090150 Country: United States Status: Filed on 6-Sep-2017, ...
URL: https://www.src.org/library/patent/p1731/
Modified: 2018-10-02 - 24KB
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26: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing a-Imino Alkoxide as Precursors for Deposition of Metal Films Application Type: Utility Patent ...
URL: https://www.src.org/library/patent/p1373/
Modified: 2017-09-12 - 22KB
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27: Synthesis and Characterization of First Row Transition Metal...
Synthesis and Characterization of First Row Transition Metal Complexes Containing Alpha-Keto Hydrazonate Ligands as Potential Precursors for Use in Metal Film Deposition ...
URL: https://www.src.org/library/patent/p1356/
Modified: 2015-12-09 - 22KB
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28: Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
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29: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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30: Conductors Created by Metal Deposition Using Selective Passivation...
Conductors Created by Metal Deposition Using Selective Passivation Layer and Related Methods Application Type: Utility Patent Number: 7534967 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0447/
Modified: 2009-05-19 - 23KB
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1 through 30 of 38 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>