Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Patent Filings 25
Events 23
Other 1

SRC Program
GRC 31
SRC 18
3D EC 2
FCRP 2

Year
2016 3
2013 5
2012 4
2011 11

Center
C2S2 12
FENA 12
GSRC 12
IFC 12
MSD 12
MuSyC 12
C-FAR 6
CNFD 6
FAME 6
INDEX 6
LEAST 6
SONIC 6
SWAN 6
TerraSwarm 6
EBSM 5
TxACE 5
CEMPI 4
NPT 4
CAIST 3
ACE4S 1
CDADIC 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 13
BEP – Back End Processes 11
Back End Processes 3
CM – Compact Modeling 2
Multi-level Interconnect 2
NMP – Nanomanufacturing Material... 2
Processes – Processes 2
Reliability 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 30 of 49 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>
1: Systems, Methods and Computer Program Products for Prediction...
Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
URL: https://www.src.org/library/patent/p0050/
Modified: 1998-10-13 - 22KB
Find Similar Documents
2: Methods, Systems, and Computer Program Products for Asymmetric...
Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
Find Similar Documents
3: Methods, Systems, and Computer Program Products for Low Power...
Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB
Find Similar Documents
4: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
Find Similar Documents
5: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
Find Similar Documents
6: 3D IC University Research e-Workshop (Event E004357) - SRC
3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
Find Similar Documents
7: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
Find Similar Documents
8: Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit...
Method of Forming Boron Carbo-Nitride Layers for Integrated Circuit Devices Application Type: Utility Patent Number: 7144803 Country: United States Status: Filed on 16-Apr-2004, ...
URL: https://www.src.org/library/patent/p0451/
Modified: 2006-12-05 - 22KB
Find Similar Documents
9: Multiple Copper Vias for Integrated Circuit Metallization and...
Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
Find Similar Documents
10: Systems, Methods, and Computer Readable Media for Fractional...
Systems, Methods, and Computer Readable Media for Fractional Pre-emphasis of Multi-Mode Interconnect Application Type: Utility Patent Number: 8208578 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1191/
Modified: 2012-06-26 - 22KB
Find Similar Documents
11: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
Find Similar Documents
12: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
Find Similar Documents
13: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
Find Similar Documents
14: Wafer Fabrication Monitoring/Control System and Method (Patent...
Wafer Fabrication Monitoring/Control System and Method Application Type: Utility Patent Number: 9366601 Country: United States Status: Filed on 15-Mar-2012, Issued on 14-Jun-2016 ...
URL: https://www.src.org/library/patent/p1332/
Modified: 2016-06-14 - 23KB
Find Similar Documents
15: Methods and Apparatuses for Integrated Packaging of Microelectromechan...
Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
Find Similar Documents
16: Conductors Created by Metal Deposition Using Selective Passivation...
Conductors Created by Metal Deposition Using Selective Passivation Layer and Related Methods Application Type: Utility Patent Number: 7534967 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0447/
Modified: 2009-05-19 - 23KB
Find Similar Documents
17: Low Dielectric Constant (Low-K) Dielectric and Method of Forming...
Low Dielectric Constant (Low-K) Dielectric and Method of Forming The Same Application Type: Utility Patent Number: 10090150 Country: United States Status: Filed on 6-Sep-2017, ...
URL: https://www.src.org/library/patent/p1731/
Modified: 2018-10-02 - 24KB
Find Similar Documents
18: Putting Watson to Work (TECHCON 2013) - SRC
Putting Watson to Work TECHCON 2013 Special Session Richard Talbot, Director, PLM of the IBM Poser Systems View presentation as PDF Presented: Monday, September 9 at TECHCON 2013 ...
URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
Find Similar Documents
19: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
Find Similar Documents
20: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
URL: https://www.src.org/...4/authors-kit/preparing-presentation/
Modified: 2012-05-10 - 24KB
Find Similar Documents
21: Preparing Your Oral Presentation - TECHCON 2011 Author's Kit...
TECHCON 2011 Author's Kit Preparing The Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable ...
URL: https://www.src.org/calendar/e004113/preparing-presentation/
Modified: 2011-04-15 - 24KB
Find Similar Documents
22: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
Find Similar Documents
23: URO Travel Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit URO Travel Information Travel assistance as defined below will be available to one URO student from each program presenting a poster at TECHCON 2011. A ...
URL: https://www.src.org/...ndar/e004113/uro-travel-instructions/
Modified: 2011-04-15 - 22KB
Find Similar Documents
24: Travel Instructions - TECHCON 2011 Author's Kit - SRC
TECHCON 2011 Author's Kit Travel Information Travel assistance (hotel reservations, meals and ground transportation) will be available to students presenting accepted papers, ...
URL: https://www.src.org/calendar/e004113/travel-instructions/
Modified: 2011-04-15 - 22KB
Find Similar Documents
25: Multilevel Reservoirs for Integrated Circuit Interconnects (Patent...
Multilevel Reservoirs for Integrated Circuit Interconnects Application Type: Utility Patent Number: 8278758 Country: United States Status: Filed on 29-Apr-2009, Issued on ...
URL: https://www.src.org/library/patent/p1141/
Modified: 2012-10-02 - 22KB
Find Similar Documents
26: Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
Find Similar Documents
27: High Gain Integrated Antenna and Devices Therefrom (Patent P0392...
High Gain Integrated Antenna and Devices Therefrom Application Type: Utility Patent Number: 6842144 Country: United States Status: Filed on 10-Jun-2003, Issued on 11-Jan-2005, ...
URL: https://www.src.org/library/patent/p0392/
Modified: 2005-01-11 - 22KB
Find Similar Documents
28: Composite Thermal Interface Material Including Particles and...
Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
Find Similar Documents
29: Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition...
Nano-Laminate Diffusion Barrier for Direct Electrochemical Deposition Copper Application Type: Utility Patent Number: 7808106 Country: United States Status: Filed on 9-May-2008, ...
URL: https://www.src.org/library/patent/p1076/
Modified: 2010-10-05 - 22KB
Find Similar Documents
30: Oxidation Resistant PB-Free Solder Alloys (Patent P1108) - SRC
Oxidation Resistant PB-Free Solder Alloys Application Type: Utility Patent Number: 8530058 Country: United States Status: Filed on 6-Mar-2009, Issued on 10-Sep-2013, Patent ...
URL: https://www.src.org/library/patent/p1108/
Modified: 2013-09-10 - 22KB
Find Similar Documents
1 through 30 of 49 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 next >>