Questions?
Content Type
Other 232
Events 199
Patent Filings 4

SRC Program
SRC 202
GRC 184
JUMP2 21
NRI 15
FCRP 5
3D EC 4
SRP 3
STARnet 3
Auto 1
ICA 1
JUMP 1
SRCEA 1
nCORE 1

Year
2024 12
2023 29
2022 24
2021 24
2020 7
2019 9
2018 16
2017 28
2016 17
2015 13
2014 7
2013 15
2012 39
2011 101
2010 86
2009 1

Center
TxACE 6
CHIRP 5
SONIC 5
ACE4S 3
C-FAR 3
C2S2 3
EBSM 3
FAME 3
FENA 3
GSRC 3
IFC 3
INDEX 3
LEAST 3
MSD 3
SWAN 3
TerraSwarm 3
ACE 2
CNFD 2
CUBIC 2
MIND 2
MuSyC 2
NRI-NSF 2
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
NCRC 1
NPT 1
PRISM 1
SUPREME 1
WIN 1

Thrust/Theme
PKG – Packaging 9
AMS-CSD – Analog/Mixed-Signal Ci... 4
HWS – Hardware Security 4
ISD – Integrated System Design 4
SLD – System Level Design 4
CADT – Computer-Aided Design and... 3
I3T – Innovative and Intelligent... 3
AIHW – Artificial Intelligence H... 2
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
ESH – Environment Safety and Hea... 2
LPD – Logic & Physical Design 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1

GRC Science Area
CADTS – Computer Aided Design & ... 18
ICSS – Integrated Circuit & Syst... 14
IPS – Interconnect & Packaging S... 12
NMS – Nanomanufacturing Sciences 12
CSR – Cross-disciplinary Semicon... 6
DS – Device Sciences 6
SRCEA – SRC Education Alliance 6
PKG – Packaging Sciences 5
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

331 through 360 of 435 similar documents, best matches first.   
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331: pdfIRP Advisory Board Meeting
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332: pdfStudent Poster Information
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333: Semiconductor Research Corporation - SRC
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Modified: 2023-10-10 - 33KB
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334: pdfCoCoSys Center Overview
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Modified: 2024-05-01 - 4.8MB
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335: SRC: Grant Application for Cross-disciplinary Semiconductor Research...
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336: TECHCON 2012 (Event E004114) - SRC
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337: pdfBioelectronics: An Industry Perspective
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339: pdfNEWSLETTER
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340: TECHCON 2016 (Event E005107) - SRC
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341: 2016 Mahboob Khan Outstanding Liaison Award Winners - SRC
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342: 2018 Mahboob Khan Outstanding Liaison Award Winners - SRC
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343: pdfDuke University: GRC Programs Overview
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Modified: 2024-04-08 - 1.2MB
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344: pdfWednesday, November 10, 2010 NRI TPG Conference Call
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345: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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346: SRC NRI: Mission - SRC
NRI Mission and Description Program Mission NRI Mission: Demonstrate non-conventional, low-energy technologies which can outperform CMOS on critical applications in ten years and ...
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Modified: 2010-06-21 - 22KB
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347: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
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348: pdfResearch Needs for Device Sciences Modeling and Simulation
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349: pdfVIA-2020 Forum - Panel 4 - Zhirnov
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350: pdf2009 Summer Study: 3D Desig Eco-System
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Modified: 2011-06-17 - 2.3MB
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351: NRI Annual Review (Event E003789) - SRC
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352: pdfSRC CONNECTIONS SEPTEMBER 2021
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353: SRC: 1998 Technical Excellence Awards - SRC
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Modified: 2010-06-21 - 27KB
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354: pdf2010 NMS Research Needs in patterning, nanoengineered materials...
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355: The Challenges and Opportunities of Atomic Layer Etching (Event...
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356: pdfDNA Storage Discussion Framework - IARPA/SRC Workshop April 27...
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357: IEDM Special Poster Session Highlighting SRC Student Innovation...
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358: pdfCyberSecurity Workshop - Aitken, ARM
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359: pdfE003932 - Variability Forum - Spanos
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360: pdfNRI Newsletter April 15.docx
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URL: https://www.src.org/program/nri/newsletter/april-15.pdf
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331 through 360 of 435 similar documents, best matches first.   
<< previous Page: 8 9 10 11 12 13 14 15 next >>