T3S Collaborating with NSF to Jointly Fund Research
T3S is collaborating with the National Science Foundation (NSF) to jointly fund research in Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS). This joint effort builds on a 2013 workshop now summarized in a public report: Research Needs for Secure, Trustworthy, and Reliable Semiconductors. The collaboration enhances and accelerates the research and education objectives of all sponsors.
The growing scale and complexity of information networks and embedded systems, and our increasing reliance upon them, are accompanied by challenges and risks. Are the networks and systems on which we depend trustworthy and secure? Are they resistant to unintended access, tampering and counterfeiting?
The Trustworthy and Secure Semiconductors and Systems (T3S) initiative is focused on developing strategies, techniques, and tools to provide assurance that electronic systems will perform as intended. Such assurance is a function of processes and tools integrated across all steps of design, manufacture, and distribution. In order to build a technological foundation that business and government can use to make systems that are trustworthy and secure, there is a need for fundamental, multidisciplinary research that spans architecture, design and manufacture.
T3S is an industry consortium that partners with government agencies to fund university research — building and coordinating an academic network, generating new ideas and understanding, and providing a pipeline of relevantly educated talent. Member companies set the research agenda and get early and easy access to research and researchers, while leveraging their investment.
For additional information, please contact Celia Merzbacher.
Current23 Research Tasks18 Universities21 Students31 Faculty Researchers25 Industry Liaison Personnel
This Year38 Research Publications
Last Year21 Task Starts15 Research Publications
Since Inception23 Research Tasks19 Universities23 Students32 Faculty Researchers25 Industry Liaison Personnel55 Research Publications