Questions?
[x] SRC Program
GRC

Content Type
Events 184
Other 146
Patent Filings 8

Year
2024 1
2023 10
2022 17
2021 10
2020 8
2019 8
2018 17
2017 7
2016 10
2015 16
2014 4
2013 4
2012 6
2011 151
2010 59
2009 1

Center
TxACE 11
CHIRP 7
EBSM 4
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 11
CD – Circuit Design 8
AMS-CSD – Analog/Mixed-Signal Ci... 7
HWS – Hardware Security 7
LMD – Logic and Memory Devices 7
CADT – Computer-Aided Design and... 6
ESH – Environment Safety and Hea... 5
NMP – Nanomanufacturing Material... 5
ISD – Integrated System Design 4
LPD – Logic & Physical Design 4
SLD – System Level Design 4
TT – Test & Testability 4
VER – Verification 4
EP3C – Efficiency and Performanc... 2
Factory Systems 2
I3T – Innovative and Intelligent... 2
TechCAD – Technology CAD 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 29
CADTS – Computer Aided Design & ... 26
NMS – Nanomanufacturing Sciences 13
IPS – Interconnect & Packaging S... 10
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 4
DES – Design Sciences 2
MBP – Materials & Bulk Processes... 2
MPS – Material & Process Science... 2
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

121 through 150 of 338 similar documents, best matches first.   
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121: pdfIRP Advisory Board Meeting
AMS-CSD Research Program Annual Review Oct 17-20, 2023 UT Dallas, TX Marcus Pan, Science Director LaTanya Holmes, Research Program Coordinator https://www.src.org/calendar/e007770/ ...
URL: https://www.src.org/calendar/e007770/2023_ams-csd_intro.pdf
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122: pdfE003676 - Memory Forum - Strukov
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123: pdfIRP Advisory Board Meeting
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URL: https://www.src.org/...e007869/2024_pkg_esh_intro_slides.pdf
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124: pdfSlide 1
ITRS - Deterministic Doping, Thomas Schenkel, LBNL, Nov. 12, 2010 Single Ion Implantation Thomas Schenkel Lawrence Berkeley National Laboratory T_Schenkel@LBL.gov ITRS - ...
URL: https://www.src.org/calendar/e004100/e004100-00-session2.pdf
Modified: 2010-11-29 - 52.6MB
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125: pdf2021 Packaging CHIRP Center Review
2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
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126: Vivek De abstract - SRC
Abstract: Research Directions in Low Power Circuits & Systems Vivek De Senior Director Intel Aggressive voltage scaling is a must for making major leaps in energy efficiency and ...
URL: https://www.src.org/calendar/e003804/de-abstract/
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127: pdfResearch Needs for CADTS November 2007
SRC Research Needs in Computer-Aided Design Tools November 2007 The Semiconductor Research Corporation's Global Research Collaboration is seeking innovative research leading to ...
URL: https://www.src.org/...c/cadts/research-needs/2007/needs.pdf
Modified: 2011-02-03 - 18KB
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128: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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129: pdf2023 Research Needs Document: Environmental Safety and Health
SRC ESH Needs Document 2023 1 2023 Research Needs Document: Environmental Safety and Health Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Introduction This ...
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Modified: 2023-05-10 - 195KB
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130: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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131: pdfDesign Forum: John Hayes Position Statement
Future Directions for Design Automation: Three Challenges John P. Hayes October 1, 2006 1. Complexity and Change With CMOS transistor size approaching the nanometer range, two ...
URL: https://www.src.org/...764/john-hayes-position-statement.pdf
Modified: 2011-08-02 - 26KB
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132: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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133: pdfMicrosoft Word - vneeds32.doc
Research Needs in Verification Semiconductor Research Corporation March 2002 This document describes needs and problems SRC member companies see in the verification of hardware ...
URL: https://www.src.org/.../research-needs/2002/verification.pdf
Modified: 2011-01-26 - 22KB
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134: pdfSemiconductor Research Corporation
Research Challenges in CAD and Test Semiconductor Research Corporation March 2016 The Computer-Aided Design and Test thrust at the Semiconductor Research Corporation is soliciting ...
URL: https://www.src.org/...adt/research-needs/2016/2016-cadt.pdf
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135: pdfSRC GRC: Nano-Morphic Forum - Cavin
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Modified: 2011-08-02 - 595KB
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136: Mitigating the Negative Effects of Powered ESD on Integrated...
Mitigating the Negative Effects of Powered ESD on Integrated Circuits Date: Friday, July 24, 2020, 2 p.m.-3 p.m. ET Location: via WebEx, Durham, NC, United States Type: e-Workshop ...
URL: https://www.src.org/calendar/e006609/
Modified: 2020-12-18 - 30KB
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137: pdf2009 Summer Study: Co-Design of Future Architectures with 3D...
IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
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138: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
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139: pdfInnovative and Intelligent Internet of Things (I3T) Research...
Innovative & Intelligent Internet of Things Research Needs: Innovative and Intelligent Internet of Things July 2016 The Semiconductor Research Corporation (SRC) Global Research ...
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140: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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141: pdfVIA-2020 Forum - Panel 4 - Shankar
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URL: https://www.src.org/calendar/e003362/p4-shankar.pdf
Modified: 2011-04-18 - 417KB
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142: pdfResearch Needs Document: Nanomanufacturing Materials and Processes
Research Needs Document: Nanomanufacturing Materials and Processes April 2015 Semiconductor Research Corp. (SRC) P.O. Box 12053 Research Triangle Park, NC 27709-2053 Background ...
URL: https://www.src.org/...m/grc/nmp/research-needs/2015/nmp.pdf
Modified: 2015-04-23 - 29KB
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143: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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144: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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145: pdfMicrosoft PowerPoint - Burnham Session I updated (2).ppt [Compatibilit...
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URL: https://www.src.org/calendar/e003506/05-sessioni-burnham.pdf
Modified: 2011-06-17 - 152KB
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146: pdf2009 Summer Study: Trends in Member Feedback on GRC Portfolio...
Trends in Member Feedback GRC P tf li 5 Y O t on GRC Portfolio 5 Years Out Summary for Summer Study Session 1 y y Frank Robertson June 29, 2009 Ju e 9, 009 Fundamental Issues  ...
URL: https://www.src.org/...dar/e003506/01-sessioni-robertson.pdf
Modified: 2011-06-17 - 61KB
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147: pdfNo Slide Title
Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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148: pdfVIA-2020 Forum - Panel 1 - Presentation - Rabaey
Jan M. Rabaey, Donald O. Pederson Distinguished Professor Director Gigascale Systems Research Center (GSRC) Scientific Co-Director Berkeley Wireless Research Center (BWRC) ...
URL: https://www.src.org/...ar/e003362/p1-presentation-rabaey.pdf
Modified: 2011-04-18 - 2.5MB
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149: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
luj@rpi.edu October 20 October 20- -21, 2009 21, 2009 1 SRC/NSF/A*STAR Forum SRC/NSF/A*STAR Forum 3D Memory Integration Platforms 3D Memory Integration Platforms - - Novel ...
URL: https://www.src.org/calendar/e003676/lu.pdf
Modified: 2010-07-29 - 1.1MB
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150: pdfVIA-2020 Forum - Panel 4 - Zhirnov
1 Device Opportunities for Beyond CMOS: A System Perspective Victor Zhirnov 2 Question How will semiconductor nanoscale technology impact different information-processing and ...
URL: https://www.src.org/calendar/e003362/p4-zhirnov.pdf
Modified: 2011-04-18 - 401KB
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121 through 150 of 338 similar documents, best matches first.   
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