Questions?
Content Type
Other 188
Events 131
Patent Filings 4

SRC Program
GRC 153
SRC 131
NRI 17
JUMP2 13
3D EC 4
FCRP 4
STARnet 3
nCORE 3
ICA 1
NINE 1

Year
2024 6
2023 17
2022 21
2021 20
2020 6
2019 7
2018 10
2017 24
2016 13
2015 9
2014 8
2013 10
2012 20
2011 68
2010 79
2009 1

Center
FAME 4
INDEX 3
SWAN 3
C2S2 2
EBSM 2
FENA 2
GSRC 2
IFC 2
MIND 2
MSD 2
MuSyC 2
NRI-NSF 2
WIN 2
ACE 1
C-FAR 1
CHIRP 1
CNFD 1
E2CDA-NRI 1
IMPACT 1
LEAST 1
NPT 1
SONIC 1
TerraSwarm 1
TxACE 1

Thrust/Theme
LMD – Logic and Memory Devices 4
PKG – Packaging 4
NMP – Nanomanufacturing Material... 2
ESH – Environment Safety and Hea... 1
IMPACT-T1 – Materials for Scaled... 1

GRC Science Area
CADTS – Computer Aided Design & ... 10
IPS – Interconnect & Packaging S... 10
NMS – Nanomanufacturing Sciences 9
ICSS – Integrated Circuit & Syst... 8
CSR – Cross-disciplinary Semicon... 3
DS – Device Sciences 3
PKG – Packaging Sciences 3
SRCEA – SRC Education Alliance 3

181 through 210 of 323 similar documents, best matches first.   
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181: pdfPackaging Research Needs Document
Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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182: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
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URL: https://www.src.org/...m/grc/ds/research-needs/2003/cmos.pdf
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183: pdfSRC - Research Needs for Extending CMOS to its Ultimate Limits
Research Needs for Extending CMOS to its Ultimate Limit November 1, 2002 Edition 1 2002 CMOS Extension Task Force SRC Nanostructure & Integration Sciences and Materials & Process ...
URL: https://www.src.org/...m/grc/ds/research-needs/2002/cmos.pdf
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184: pdfResearch Challenges in Computer-Aided Design and Test
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185: pdfFISC 2030 - Plenary - Curley
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Modified: 2012-03-29 - 27.4MB
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186: pdfTask 1.1 Evolvable Distributed Accelerators
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187: pdfLemons are for lemonade
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188: pdfCoCoSys Center Overview
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189: pdfThe Semiconductor Environment in 1982
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190: TECHCON 2013 (Event E004683) - SRC
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URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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191: pdf2011 Systems Design Needs
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URL: https://www.src.org/.../icss/research-needs/2011/systems.pdf
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192: pdfESH for Nanotechnology
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URL: https://www.src.org/...m/grc/nms/research-needs/2011/esh.pdf
Modified: 2011-03-14 - 128KB
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193: pdfBEP Research Needs Statement
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Modified: 2011-03-22 - 67KB
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194: pdfResearch Needs for Circuit Design
Research Needs for Circuit Design Page 1 of 9 January 31, 2001 Rev 2 Research Needs for Circuit Design 2000 Task Force on Circuit Design, SRC Design Sciences Semiconductor Research ...
URL: https://www.src.org/...icss/research-needs/2001/circuits.pdf
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195: pdfESH Needs Document for Nanotechnology
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196: pdfスライド 1
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197: pdfCenter for Ubiquitous Connectivity
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198: pdfPackaging Research Needs Document
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Modified: 2021-05-27 - 211KB
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199: pdf2010 Test Needs Document
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200: pdf2006 Circuit Design Needs Categories
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201: SRC/SFI/NSF Forum on Integrated Sensors for Cybersystems - FISC...
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URL: https://www.src.org/calendar/e004576/
Modified: 2012-09-23 - 75KB
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202: 2005 GRC Compelling Research Report - SRC
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203: pdfS200807_research_needs_PKG.doc
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URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
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204: pdfBEP Research Needs Statement
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URL: https://www.src.org/...m/grc/ips/research-needs/2012/bep.pdf
Modified: 2012-08-30 - 172KB
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205: pdfMicrosoft Word - Pkg Needs 2005.doc
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URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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206: pdf2005 Research Needs for Extending CMOS to its Ultimate Limit
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URL: https://www.src.org/...m/grc/ds/research-needs/2005/cmos.pdf
Modified: 2011-02-03 - 37KB
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207: pdfMicrosoft Word - Packaging Research Needsv2.doc
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208: pdfResearch Needs for Secure,
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URL: https://www.src.org/...04965/sa-ts-workshop-report-final.pdf
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209: pdf1991 SRC Corporate Annual Report
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URL: https://www.src.org/about/corporate-annual/1991.pdf
Modified: 2010-06-21 - 621KB
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210: pdfNeeds document - grey Area between Back-End Processing and Packaging...
Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
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181 through 210 of 323 similar documents, best matches first.   
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