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- 1:
 Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 2:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB
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- 3:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 4:
Final Report - Workshop on Failure and Uncertainty in Mixed-Signal...
- National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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- 5:
2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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- 6:
Future Challenges from a Thermal Perspective for Three Dimensional...
- Future Challenges from a Thermal Perspective for Three Dimensional Chip Stacks Dr. Gamal Refai-Ahmed, AMD In the recent years, there have been grown activities of the appropriate ...
URL: https://www.src.org/calendar/e003506/refai-abs/
Modified: 2011-06-17 - 20KB
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- 7:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 8:
State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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- 9:
2009 Summer Study: NRI Program Directions and Promising Outputs
- NRI Program Directions and Promising Outputs NRI Program Directions and Promising Outputs ETAB Summer Study Jeff Welser June, 2009 Some information in this presentation is SRC-NRI ...
URL: https://www.src.org/calendar/e003506/04-sessioni-welser.pdf
Modified: 2011-06-17 - 991KB
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- 10:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 11:
2009 Summer Study: Application and Network Optimized Next Generation...
- © 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
URL: https://www.src.org/...dar/e003506/04-sessionii-daijavad.pdf
Modified: 2011-06-17 - 1.3MB
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- 12:
PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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- 13:
Microsoft PowerPoint - etab_jun09.ppt [Compatibility Mode]
- Coping with Vertical Interconnect Coping with Vertical Interconnect Bottleneck Bottleneck Bottleneck Bottleneck Jason Cong Jason Cong UCLA Computer Science Department UCLA Computer ...
URL: https://www.src.org/.../2009s-study-siii-vertint-cong-v2.pdf
Modified: 2011-06-17 - 473KB
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- 14:
VIA Forum - P2 Presentation - Raja Koduri
- AMD Smarter Choice GPU A hit t d GPU Architectures and Futures - Some thoughts Raja Koduri CTO Graphics AMD CTO, Graphics, AMD Agenda . A programmer view of the graphics pipeline . ...
URL: https://www.src.org/...ar/e003362/p2-presentation-koduri.pdf
Modified: 2011-04-18 - 6.3MB
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- 15:
FCRP Program Directions and Promising Outputs
- FCRP Program Directions & Promising Outputs 2009 GRC ETAB Summer Study Betsy Weitzman g g p y y June 29, 2009 Exec. VP, SRC and Exec. Dir., FCRP (919) 941-9426 ...
URL: https://www.src.org/...ndar/e003506/03-sessioni-weitzman.pdf
Modified: 2011-06-17 - 432KB
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- 16:
Massive Data Computing in a Connected World
- Massive Data Computing Massive Data Computing In a Connected World 2009 GRC ETAB Summer Study, June 29 2009 Pradeep K. Dubey IEEE Fellow and Director of Throughput Computing Intel ...
URL: https://www.src.org/calendar/e003506/05-sessionii-dubey.pdf
Modified: 2011-06-17 - 1.2MB
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- 17:
VIA-2020 Forum - Panel 4 Presentation - Cavin
- Computation vis-à-vis Physics: A Framework VIA 2020 Forum, July 10 & 11, 2008 Ralph K. Cavin, III, Victor V. Zhirnov & Sadasivan Shankar (Intel) 2 Outline Relations between ...
URL: https://www.src.org/...dar/e003362/p4-presentation-cavin.pdf
Modified: 2011-04-18 - 553KB
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