Questions?
Content Type
Other 378
Events 292
Patent Filings 16

SRC Program
SRC 327
GRC 281
NRI 28
JUMP2 22
FCRP 16
3D EC 5
STARnet 4
nCORE 4
JUMP 3
SRCEA 2
Auto 1
ICA 1
NINE 1
SRP 1

Year
2024 17
2023 40
2022 53
2021 36
2020 12
2019 14
2018 26
2017 33
2016 18
2015 20
2014 19
2013 21
2012 41
2011 183
2010 133
2009 1

Center
IFC 18
GSRC 17
MSD 17
C2S2 16
FENA 16
MuSyC 12
TxACE 11
CHIRP 9
INDEX 8
SWAN 8
EBSM 7
FAME 6
C-FAR 5
CNFD 5
LEAST 5
SONIC 5
TerraSwarm 5
NRI-NSF 4
C-SPIN 3
E2CDA-NRI 3
NPT 3
ASCENT 2
CAIST 2
IMPACT 2
MIND 2
WIN 2
ACE 1
ACE4S 1
CDADIC 1
CEMPI 1
CUBIC 1
IPC 1
NCRC 1
NEWLIMITS 1
SUPREME 1

Thrust/Theme
PKG – Packaging 19
NMP – Nanomanufacturing Material... 9
ESH – Environment Safety and Hea... 5
LMD – Logic and Memory Devices 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
NEM – Nanoengineered Materials 4
AMS – Analog and Mixed-Signal De... 2
ASCENT-T1 – Vertical CMOS 2
FACSYS – Factory Systems 2
LPD – Logic & Physical Design 2
PAT – Patterning 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
IMPACT-T1 – Materials for Scaled... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T4 – Characterization ... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

GRC Science Area
CADTS – Computer Aided Design & ... 39
NMS – Nanomanufacturing Sciences 33
IPS – Interconnect & Packaging S... 28
ICSS – Integrated Circuit & Syst... 26
CSR – Cross-disciplinary Semicon... 21
DS – Device Sciences 21
SRCEA – SRC Education Alliance 9
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 5
NIS – Nanostructure & Integratio... 3
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>
1: pdfPackaging Research Needs Document
Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
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2: pdfMicrosoft Word - 2022_pkg_needs_final.docx
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3: pdfPackaging Research Needs Document
Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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4: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
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Modified: 2018-06-22 - 175KB
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5: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
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6: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
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7: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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8: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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9: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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10: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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11: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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12: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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13: pdfS200807_research_needs_PKG.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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14: pdfMicrosoft Word - Packaging Research Needsv2.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
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15: pdfS201617 JUMP Research Announcement - Needs Document
Page 1 JUMP Needs Document Point of Contact: JUMP-Solicitation@src.org 6 JUMP THEMES TO CREATE 6 JUMP RESEARCH CENTERS "VERTICAL," APPLICATION-FOCUSED CENTERS 1. RF to THz Sensor ...
URL: https://www.src.org/...te/s201617/jump-ra-needs-document.pdf
Modified: 2016-11-18 - 234KB
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16: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
URL: https://www.src.org/...ive/2006/compelling-research-reasons/
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17: pdfMicrosoft Word - Pkg Needs 2005.doc
Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
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18: pdf2011-2015 SRC-GRC Strategic Plan
2011-2015 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...tab2011-2015-grc-strat-full-draft.pdf
Modified: 2010-07-01 - 1.2MB
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19: pdfNeeds document - grey Area between Back-End Processing and Packaging...
Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
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20: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
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21: 2007 GRC compelling research reasons - SRC
2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
URL: https://www.src.org/...ive/2007/compelling-research-reasons/
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22: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
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24: pdf2006 Circuit Design Needs Categories
Analog/Mixed-Signal Circuits, Systems and Devices + TxACE Research Needs: AMS-CSD + TxACE June 2020 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) ...
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25: pdf2010 SRC Operations Plan
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URL: https://www.src.org/compete/s201209/pip-s201209.pdf
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URL: https://www.src.org/calendar/e007527/pkgintroslides.pdf
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28: pdf2006 Circuit Design Needs Categories
Research Needs: Analog/Mixed-Signal Circuits, Systems, and Devices (AMS-CSD) + TxACE June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 The Semiconductor ...
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30: pdf2006 Circuit Design Needs Categories
Research Needs: Analog/Mixed-Signal Circuits, Systems, and Devices (AMS-CSD) + TxACE April 10, 2023 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 The Semiconductor ...
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1 through 30 of 686 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>