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- 121:
 State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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- 122:
VIA-2020 Forum - Panel 3 - Baas
- Computational Platforms for Virtual Immersion Architectures: Integrating Specialized Processing Units Into A Homogeneous Array of Processors Bevan Baas Department of Electrical and ...
URL: https://www.src.org/calendar/e003362/p3-baas.pdf
Modified: 2011-04-18 - 1.9MB
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- 123:
Microsoft Word - SRC Needs for Research in Support of Convergence...
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergance.pdf
Modified: 2011-02-03 - 26KB
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- 124:
Memory Needs
- 1 Research Needs for Memory Technologies Oct. 2008 Device Sciences, GRC Semiconductor Research Corporation P.O. Box 12053 Research Triangle Park, NC 27709-2053 Requirements and ...
URL: https://www.src.org/...ch-needs/2008/memory-technologies.pdf
Modified: 2011-02-03 - 33KB
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- 125:
2016 - Packaging Research Needs Document
- Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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- 126:
Packaging Research Needs Document
- Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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- 127:
Needs document - grey Area between Back-End Processing and Packaging...
- Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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- 128:
2011 Verification Needs Document Final
- SRC Research Needs in Computer-Aided Design and Test Verification 2011-2012 CADTS Research Needs: Verification This member-generated document describes needs and problems SRC ...
URL: https://www.src.org/.../research-needs/2011/verification.pdf
Modified: 2011-08-25 - 122KB
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- 129:
VIA-2020 Forum - Panel 4 - Peleg
- 1 Intel confidential Future PC Trends Future PC Trends & their Implications on & their Implications on Traditional Computing Architectures Traditional Computing Architectures Alex ...
URL: https://www.src.org/calendar/e003362/p4-peleg.pdf
Modified: 2011-04-18 - 83KB
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- 130:
2023 Research Needs Document: Environmental Safety and Health
- SRC ESH Needs Document 2023 1 2023 Research Needs Document: Environmental Safety and Health Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Introduction This ...
URL: https://www.src.org/...needs/2023_src_esh_research_needs.pdf
Modified: 2023-05-10 - 195KB
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- 131:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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- 132:
Nanomanufacturing Materials and Processes Annual Review Research...
- Nanomanufacturing Materials and Processes Annual Review Research Program Annual Review Aug 3 - Aug 5, 2022 Tokyo Electron, Austin, TX Kashyap Yellai, Science Director Tameka Bell, ...
URL: https://www.src.org/...56/introslides/nmp2022introslides.pdf
Modified: 2022-08-08 - 597KB
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- 133:
Research Needs Document: Logic and Memory Devices
- Research Needs Document: Logic and Memory Devices March 2015 Semiconductor Research Corp. (SRC) P.O. Box 12053 Research Triangle Park, NC 27709-2053 Background This document is ...
URL: https://www.src.org/...m/grc/lmd/research-needs/2015/lmd.pdf
Modified: 2015-03-26 - 48KB
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- 134:
Packaging Research Needs Document
- 1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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- 135:
E003676 - Memory Forum - Research Priorities/Needs
- A STAR/SRC/NSF Memory Forum Singapore Panel VI: Needs and Models for Collaborative Research A-STAR/SRC/NSF Memory Forum - Singapore Research Priorities/Needs Research Priorities/...
URL: https://www.src.org/calendar/e003676/sandhu.pdf
Modified: 2010-07-29 - 651KB
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- 136:
VIA-2020 Forum - Panel 2 - Vahid
- Custom Sensor-Based Embedded Computing Systems Frank Vahid Professor Dept. of Computer Science and Engineering University of California, Riverside Assoc. Director, Center for ...
URL: https://www.src.org/calendar/e003362/p2-vahid.pdf
Modified: 2011-04-18 - 688KB
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- 137:
SRC/NSF Design Forum - Position Statement
- A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB
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- 138:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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- 139:
Research Needs Document: ESH Semiconductor Research Corp. (SRC...
- SRC ESH Needs Document 2021 1 Research Needs Document: ESH Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Introduction Semiconductor fabrication processes have ...
URL: https://www.src.org/...021_esh_needs_document_final_5_31.pdf
Modified: 2021-05-27 - 70KB
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- 140:
S200807_research_needs_PKG.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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- 141:
Research needs documen - packaging
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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- 142:
Microsoft Word - Pkg Needs 2005.doc
- Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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- 143:
2006 Circuit Design Needs Categories
- Integrated Circuit and Systems Sciences Research Needs: Circuit Design June 2013 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) program member ...
URL: https://www.src.org/...icss/research-needs/2013/circuits.pdf
Modified: 2013-06-24 - 69KB
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- 144:
Microsoft Word - Packaging Research Needsv2.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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- 145:
Research Needs Document: Nanomanufacturing Materials and Processes
- Research Needs Document: Nanomanufacturing Materials and Processes April 2015 Semiconductor Research Corp. (SRC) P.O. Box 12053 Research Triangle Park, NC 27709-2053 Background ...
URL: https://www.src.org/...m/grc/nmp/research-needs/2015/nmp.pdf
Modified: 2015-04-23 - 29KB
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- 146:
E003676 - Memory Forum - Strukov
- OUTL OUTL 1. HP's memristor and ap 2. Models of resistance sw 3 Volatility speed tradeo 3. Volatility speed tradeo 4. 3D circuit architecture 5. Proposal for evaluatio LINE LINE ...
URL: https://www.src.org/calendar/e003676/strukov.pdf
Modified: 2010-07-29 - 1.4MB
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- 147:
Design Forum: Sharad Malik Panel Position Statement
- Making our Way through the End-of-the Roadmap Maze Panel Position Statement Sharad Malik Princeton University As we look forward over the next 10-15 years, there are several ...
URL: https://www.src.org/...4/sharad-malik-position-statement.pdf
Modified: 2011-08-02 - 20KB
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- 148:
Microsoft Word - Interface Research Needs.doc
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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- 149:
S200807_research_needs_INT.doc
- Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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- 150:
Dr. Malcolm Thompson - e-Workshop Packaging
- Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1 FlexTech & NBMC Business Model 20+ years as ...
URL: https://www.src.org/...ndar/e005802/e005802-presentation.pdf
Modified: 2015-07-23 - 4.9MB
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