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SRC Program

SRC	325
GRC	292
NRI	39
JUMP2	19
FCRP	9
STARnet	6
nCORE	6
3D EC	4
SRP	3
ERI	2
JUMP	2
ICA	1

Year

2024	13
2023	28
2022	45
2021	36
2020	17
2019	12
2018	24
2017	40
2016	19
2015	23
2014	26
2013	24
2012	46
2011	175
2010	155
2009	1

Thrust/Theme

LMD – Logic and Memory Devices	9
ESH – Environment Safety and Hea...	7
NMP – Nanomanufacturing Material...	6
PKG – Packaging	6
Advanced Devices & Technologies	5
AMS-CSD – Analog/Mixed-Signal Ci...	4
HWS – Hardware Security	4
CADT – Computer-Aided Design and...	3
CD – Circuit Design	3
ISD – Integrated System Design	3
LPD – Logic & Physical Design	3
NEM – Nanoengineered Materials	3
NEWLIMITS-T1 – Novel Computing a...	3
NEWLIMITS-T4 – Characterization ...	3
SLD – System Level Design	3
TT – Test & Testability	3
VER – Verification	3
FACSYS – Factory Systems	2
I3T – Innovative and Intelligent...	2
NEWLIMITS-T2 – 2D Materials Devi...	2
NEWLIMITS-T3 – Advanced Manufact...	2
NEWLIMITS-T5 – Simulations and M...	2
PAT – Patterning	2
TechCAD – Technology CAD	2
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMML-T1 – Antiferromagnetic Magn...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T3 – Heterogeneous Integr...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
CFM&TCM – CFM & Total Chemical M...	1
CM – Compact Modeling	1
CSR – Cross-Disciplinary Semicon...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IMPACT-T1 – Materials for Scaled...	1
IMPACT-T2 – Materials for Storag...	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1
PhyDes – Physical Design	1
Physical Design	1
Plasma Etch	1
Process Architecture	1
Processes – Processes	1
Quality & Reliability	1
Rapid Yield Learning	1
Reliability	1
Resist	1
SMART-T1 – Spin-orbit Torque Mat...	1
SMART-T2 – Ultra-Low Loss Spin W...	1
SMART-T3 – Magneto-ionic Materia...	1
SemiSynBio – Semiconductor Synth...	1