Questions?
Content Type
Other 288
Events 241
Patent Filings 5

SRC Program
GRC 260
SRC 221
JUMP2 18
NRI 18
FCRP 11
nCORE 6
3D EC 5
ERI 2
ICA 1
JUMP 1
NINE 1
STARnet 1

Year
2024 14
2023 30
2022 46
2021 34
2020 13
2019 9
2018 20
2017 19
2016 14
2015 13
2014 13
2013 11
2012 36
2011 141
2010 112
2009 1

Center
CHIRP 10
IFC 9
MSD 9
TxACE 9
C2S2 8
FENA 8
GSRC 8
MuSyC 7
INDEX 5
IMPACT 4
SWAN 4
MIND 3
NRI-NSF 3
WIN 3
C-FAR 2
EBSM 2
FAME 2
LEAST 2
SONIC 2
TerraSwarm 2
ACE 1
ACE4S 1
ASCENT 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CNFD 1
CUBIC 1
E2CDA-NRI 1
IPC 1
NCRC 1
NEWLIMITS 1
NPT 1
NRI-Projects 1

Thrust/Theme
PKG – Packaging 18
NMP – Nanomanufacturing Material... 8
LMD – Logic and Memory Devices 4
AMS-CSD – Analog/Mixed-Signal Ci... 3
IMPACT-T1 – Materials for Scaled... 3
NEM – Nanoengineered Materials 3
ESH – Environment Safety and Hea... 2
FACSYS – Factory Systems 2
PAT – Patterning 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T4 – Characterization ... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

GRC Science Area
CADTS – Computer Aided Design & ... 26
ICSS – Integrated Circuit & Syst... 20
IPS – Interconnect & Packaging S... 18
NMS – Nanomanufacturing Sciences 18
CSR – Cross-disciplinary Semicon... 10
DS – Device Sciences 9
PKG – Packaging Sciences 6
SRCEA – SRC Education Alliance 6
ES-H – Environmental Safety & He... 2
NIS – Nanostructure & Integratio... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

1 through 30 of 534 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>
1: pdfPackaging Research Needs Document
Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
Modified: 2021-05-27 - 211KB
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2: pdfMicrosoft Word - 2022_pkg_needs_final.docx
Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...h-needs/2022/2022_pkg_needs_final.pdf
Modified: 2022-05-02 - 784KB
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3: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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4: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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5: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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6: pdfPackaging Research Needs Document
Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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7: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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8: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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9: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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10: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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11: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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12: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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13: pdfMicrosoft Word - Interface Research Needs.doc
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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14: pdf2011-2015 SRC-GRC Strategic Plan
2011-2015 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...tab2011-2015-grc-strat-full-draft.pdf
Modified: 2010-07-01 - 1.2MB
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15: pdfNeeds document - grey Area between Back-End Processing and Packaging...
Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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16: pdfS200807_research_needs_INT.doc
Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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17: pdf2010 SRC Operations Plan
2010 SRC Operations Plan Restricted Distribution: Contains SRC Confidential Material Final - March 2010 2 Table of Contents 2010 SRC Operations Plan Section I Introduction ...
URL: https://www.src.org/...board/executive/etab2010ops-final.pdf
Modified: 2010-07-01 - 541KB
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18: pdfFI Rponse to Commerce Q1
RESPONSE TO REQUEST FOR INFORMATION Department of Commerce National Institute of Standards and Technology Submitted via: MfgRFI@nist.gov In response to: Request for Information: ...
URL: https://www.src.org/...nts/src_rfi_response_to_nist_2022.pdf
Modified: 2023-02-22 - 2.7MB
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19: nCORE Request for Proposals - SRC
Request for Proposals for the nanoelectronic COmputing REsearch (nCORE) Program A. Background A1. Research Areas of Interest A2. Proposal Process A3. Program Scope and Planned ...
URL: https://www.src.org/compete/ncore/rfp/
Modified: 2017-07-28 - 53KB
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20: pdfBEP Research Needs Statement
IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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21: pdfBEP Research Needs Statement
IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2012/interface.pdf
Modified: 2012-09-25 - 134KB
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22: pdfBioelectronics: The Convergence of Biology and Electronics
Report prepared by: Glenn M. Walker Joint Department of Biomedical Engineering at the University of North Carolina at Chapel Hill and North Carolina State University J. Michael ...
URL: https://www.src.org/...dar/e003426/roadmapping-framework.pdf
Modified: 2010-06-21 - 1.3MB
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23: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
URL: https://www.src.org/...ive/2006/compelling-research-reasons/
Modified: 2010-06-26 - 200KB
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24: pdfPowerPoint Presentation
Future Needs of Advanced Packaging Research Brett Wilkerson Fellow Advanced Packaging 2 | Future Needs of Packaging Research Microelectronic and Advanced Packaging Technologies ...
URL: https://www.src.org/...dar/e007890/adv_pkg_research_mapt.pdf
Modified: 2024-03-05 - 420KB
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25: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
URL: https://www.src.org/...ive/2005/compelling-research-reasons/
Modified: 2010-06-26 - 189KB
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26: pdfMicrosoft Word - Pkg Needs 2005.doc
Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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27: 2007 GRC compelling research reasons - SRC
2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
URL: https://www.src.org/...ive/2007/compelling-research-reasons/
Modified: 2010-06-26 - 167KB
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28: pdfS200807_research_needs_PKG.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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29: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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30: pdfBEP Research Needs Statement
Back End Processing Needs Document Introduction In a recent Scientific American editorial, Stuart Firestein asserts that "if you meet a scientist, don't ask her what she knows, ask ...
URL: https://www.src.org/...m/grc/ips/research-needs/2012/bep.pdf
Modified: 2012-08-30 - 172KB
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1 through 30 of 534 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>