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- 1:
 Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 2:
Packaging Research Needs Document
- Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
Modified: 2021-05-27 - 211KB
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- 3:
Microsoft Word - 2022_pkg_needs_final.docx
- Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...h-needs/2022/2022_pkg_needs_final.pdf
Modified: 2022-05-02 - 784KB
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- 4:
Packaging Research Needs Document
- Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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- 5:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB
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- 6:
2006 GRC compelling research reasons - SRC
- 2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
URL: https://www.src.org/...ive/2006/compelling-research-reasons/
Modified: 2010-06-26 - 200KB
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- 7:
AMS-CSD Needs Document - FINAL - June 20, 2016
- Analog/Mixed-Signal Circuits, Systems and Devices + TxACE Research Needs: AMS-CSD + TxACE June 2016 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) ...
URL: https://www.src.org/.../research-needs/2016/2016-ams-csd.pdf
Modified: 2016-06-02 - 80KB
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- 8:
BEP Research Needs Statement
- IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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- 9:
BEP Research Needs Statement
- IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2012/interface.pdf
Modified: 2012-09-25 - 134KB
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- 10:
Needs document - grey Area between Back-End Processing and Packaging...
- Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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- 11:
Packaging Research Needs Document
- 1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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- 12:
DSMS Research Needs
- 1 Research Needs for Device Sciences Modeling and Simulation (DSMS), April 2008 Device Sciences Semiconductor Research Corporation P.O. Box 12053 Research Triangle Park, NC ...
URL: https://www.src.org/...grc/ds/research-needs/2008/modsin.pdf
Modified: 2010-06-21 - 29KB
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- 13:
2016 - Packaging Research Needs Document
- Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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- 14:
Packaging Research Needs Document
- Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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- 15:
DSMS Research Needs
- 1 Research Needs for Device Sciences Modeling and Simulation (DSMS), April 2008 Device Sciences Semiconductor Research Corporation P.O. Box 12053 Research Triangle Park, NC ...
URL: https://www.src.org/...ch-needs/2008/modeling-simulation.pdf
Modified: 2011-02-03 - 29KB
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- 16:
Microsoft Word - 2005_Final_ds_msneeds_rev3.doc
- 1 Research Needs for Device Sciences Modeling and Simulation (May 6, 2005) SRC Device Sciences 2005 Modeling and Simulation Task Force Contributing organizations: Axcelis, ...
URL: https://www.src.org/...ch-needs/2003/modeling-simulation.pdf
Modified: 2011-02-03 - 37KB
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- 17:
Microsoft Word - 2005_Final_ds_msneeds_rev3.doc
- 1 Research Needs for Device Sciences Modeling and Simulation (May 6, 2005) SRC Device Sciences 2005 Modeling and Simulation Task Force Contributing organizations: Axcelis, ...
URL: https://www.src.org/...c/ds/research-needs/2005/modeling.pdf
Modified: 2010-06-21 - 37KB
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- 18:
SRC 2003 CADTS Research Needs in test and Testability V4.doc
- Research Challenges in Test and Testability Semiconductor Research Corporation March 2013 Introduction Test and design for testability are recognized today as critical to a ...
URL: https://www.src.org/...rc/cadts/research-needs/2013/test.pdf
Modified: 2013-06-24 - 93KB
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- 19:
E003676 - SRC/NSF/A*STAR Forum on 2020 Semiconductor Memory Strategies...
- SRC/NSF/A*STAR Forum on 2020 Semiconductor Memory Strategies: Processes, Devices, and Architectures I. Introduction In 1957, Richard Feynman asked in a lecture at Caltech if it ...
URL: https://www.src.org/calendar/e003676/finalreport.pdf
Modified: 2010-07-29 - 526KB
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- 20:
2008 GRC compelling research reasons - SRC
- 2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
URL: https://www.src.org/...ive/2008/compelling-research-reasons/
Modified: 2010-06-26 - 188KB
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- 21:
2010 SRC Operations Plan
- 2010 SRC Operations Plan Restricted Distribution: Contains SRC Confidential Material Final - March 2010 2 Table of Contents 2010 SRC Operations Plan Section I Introduction ...
URL: https://www.src.org/...board/executive/etab2010ops-final.pdf
Modified: 2010-07-01 - 541KB
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- 22:
2006 Circuit Design Needs Categories
- Research Needs: Analog/Mixed-Signal Circuits, Systems, and Devices (AMS-CSD) + TxACE April 10, 2023 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 The Semiconductor ...
URL: https://www.src.org/...3_ams_csd_research_needs_v4_clean.pdf
Modified: 2023-04-07 - 170KB
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- 23:
2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
- 1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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- 24:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 25:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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- 26:
Research needs documen - packaging
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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- 27:
architectures for Extremely Scaled Memories
- Architectures for Architectures for Extremely Scaled Memories Extremely Scaled Memories y y Paul Franzon Department of Electrical and Computer Engineering paulf@ncsu edu ...
URL: https://www.src.org/calendar/e003676/franzon.pdf
Modified: 2010-07-29 - 4.1MB
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- 28:
Microsoft Word - Final 2004 Needs.doc
- 1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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- 29:
Microsoft Word - Final 2004 Needs.doc
- 1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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- 30:
S200807_research_needs_PKG.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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