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[x] SRC Program
GRC

Content Type
Events 151
Other 134
Patent Filings 5

Year
2024 1
2023 10
2022 14
2021 9
2020 8
2019 8
2018 11
2017 6
2016 11
2015 12
2014 4
2013 5
2012 5
2011 123
2010 55
2009 1
2008 1

Center
EBSM 11
TxACE 10
CHIRP 7
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
ESH – Environment Safety and Hea... 11
PKG – Packaging 10
CD – Circuit Design 6
AMS-CSD – Analog/Mixed-Signal Ci... 5
CADT – Computer-Aided Design and... 5
HWS – Hardware Security 5
LMD – Logic and Memory Devices 5
NMP – Nanomanufacturing Material... 4
SLD – System Level Design 4
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
TT – Test & Testability 3
VER – Verification 3
AIHW – Artificial Intelligence H... 2
I3T – Innovative and Intelligent... 2
Physical Design 2
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 23
CADTS – Computer Aided Design & ... 21
NMS – Nanomanufacturing Sciences 18
IPS – Interconnect & Packaging S... 8
ES-H – Environmental Safety & He... 6
PKG – Packaging Sciences 5
DES – Design Sciences 2
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

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91: pdfOutput from 2009 SRC GRC ETAB Summer Study
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94: pdf2002-2007 ICSS Research Needs Document
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100: pdfNanomanufacturing Materials and Processes
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115: pdf2021 Packaging CHIRP Center Review
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118: pdf2006 Circuit Design Needs Categories
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91 through 120 of 290 similar documents, best matches first.   
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