Questions?
[x] Content Type
Other

[x] SRC Program
GRC

Year
2023 6
2022 6
2021 6
2020 6
2019 6
2018 7
2017 6
2016 6
2015 5
2014 2
2013 4
2012 4
2011 61
2010 20

Center
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
EBSM 1
IPC 1
NCRC 1
TxACE 1

Thrust/Theme
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

GRC Science Area
CADTS – Computer Aided Design & ... 1
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
ICSS – Integrated Circuit & Syst... 1
INT – Interconnect Sciences 1
IPS – Interconnect & Packaging S... 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
NMS – Nanomanufacturing Sciences 1
PID – Process Integration & Devi... 1
PKG – Packaging Sciences 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

1 through 30 of 146 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 next >>
1: pdfSRC Needs Document: Logic, Physical, and Electrical Design and...
SRC Needs Document Logic, Physical, and Electrical Design and Analysis Tools June 2004 / December 2005 Research needs in design tools are driven by both constant and changing ...
URL: https://www.src.org/...c/cadts/research-needs/2004/needs.pdf
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2: pdfResearch Needs in Computer-Aided Design: Logic and Physical...
Research Needs in Computer-Aided Design: Logic and Physical Design and Analysis Logic synthesis and physical design, once considered separate topics, have grown together with the ...
URL: https://www.src.org/...grc/cadts/research-needs/2001/lpd.pdf
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3: pdfCADTS LPD Needs Document
Logic, Physical, and System Design Tools SRC GRC CADTS Needs May 2011 The Computer-Aided Design and Test Sciences area of the Semiconductor Research Corporation's Global Research ...
URL: https://www.src.org/...grc/cadts/research-needs/2010/lpd.pdf
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4: pdfCADT Research Needs Document - June 2018
Research Challenges in CAD and Test Semiconductor Research Corporation June 2018 The Computer-Aided Design and Test thrust at the Semiconductor Research Corporation is soliciting ...
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5: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
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6: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
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7: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
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Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
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10: 2008 GRC compelling research reasons - SRC
2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
URL: https://www.src.org/...ive/2008/compelling-research-reasons/
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11: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
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12: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
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13: pdfSemiSynBio Roadmap: ARO-NSF-SRC Technical Exchange Meeting on...
Page - 1 ARO/NSF/SRC Technical Exchange Meeting Cell-Semiconductor Interfaces and Hybrid Semiconductor-Biological Systems Meeting Date: July 27 & 28, 2016 Meeting Place: Georgia ...
URL: https://www.src.org/...c-technical-exchange-meeting-twg2.pdf
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14: pdfResearch Needs for CADTS November 2007
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URL: https://www.src.org/...c/cadts/research-needs/2007/needs.pdf
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25: pdfMicrosoft Word - SRC Needs for Research in Support of Convergence...
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27: pdfS200807_research_needs_INT.doc
Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
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28: pdfMicrosoft Word - SRC Needs for Research in Support of Convergence...
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
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29: pdfMicrosoft Word - Interface Research Needs.doc
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
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1 through 30 of 146 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 next >>