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Content Type
Other 360
Events 320
Patent Filings 31

SRC Program
GRC 326
SRC 297
NRI 36
JUMP2 20
FCRP 16
STARnet 8
nCORE 7
3D EC 5
ERI 3
JUMP 3
Auto 1
ICA 1
NINE 1
SRP 1

Year
2024 15
2023 38
2022 56
2021 40
2020 16
2019 12
2018 25
2017 30
2016 22
2015 20
2014 17
2013 14
2012 52
2011 183
2010 135
2009 1

Center
SWAN 13
IFC 12
GSRC 11
MSD 11
C2S2 10
CHIRP 10
FENA 10
TxACE 10
INDEX 9
MuSyC 8
LEAST 6
ACE4S 5
C-SPIN 5
EBSM 5
FAME 5
IMPACT 5
CNFD 4
E2CDA-NRI 4
NRI-NSF 4
C-FAR 3
MIND 3
SONIC 3
TerraSwarm 3
WIN 3
ASCENT 2
CAIST 2
NEWLIMITS 2
ACE 1
AMML 1
Benchmarking 1
CAPSL 1
CDADIC 1
CEMPI 1
CUBIC 1
DEEP3M 1
E2CDA 1
IPC 1
NCRC 1
NPT 1
NRI-Projects 1

Thrust/Theme
PKG – Packaging 21
NMP – Nanomanufacturing Material... 9
CD – Circuit Design 7
LMD – Logic and Memory Devices 6
ESH – Environment Safety and Hea... 5
I3T – Innovative and Intelligent... 5
SLD – System Level Design 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
IMPACT-T1 – Materials for Scaled... 4
NEM – Nanoengineered Materials 4
Back End Processes 3
AMS – Analog and Mixed-Signal De... 2
ASCENT-T1 – Vertical CMOS 2
FACSYS – Factory Systems 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
Materials 2
NEWLIMITS-T4 – Characterization ... 2
PAT – Patterning 2
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMML-T1 – Antiferromagnetic Magn... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T2 – Materials for Storag... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1

GRC Science Area
CADTS – Computer Aided Design & ... 34
ICSS – Integrated Circuit & Syst... 31
NMS – Nanomanufacturing Sciences 26
IPS – Interconnect & Packaging S... 25
CSR – Cross-disciplinary Semicon... 12
DS – Device Sciences 12
SRCEA – SRC Education Alliance 8
PKG – Packaging Sciences 6
MPS – Material & Process Science... 4
ES-H – Environmental Safety & He... 3
NIS – Nanostructure & Integratio... 3
DES – Design Sciences 2
INT – Interconnect Sciences 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

91 through 120 of 711 similar documents, best matches first.   
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91: pdfS200807_research_needs_BEP.doc
Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
URL: https://www.src.org/...ch-needs/2008/back-end-processing.pdf
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93: pdfBEP Research Needs Statement
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94: GRC Managed Crosscuts - SRC
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96: pdfResearch Needs: Logic and Memory Devices (LMD)
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98: pdfResearch Needs: Logic and Memory Devices (LMD)
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99: pdfSTUDENTS' CATALOG
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100: 2015 Mahboob Khan Outstanding Liaison Award Winners - SRC
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103: pdf2016 SLD Research Needs Document
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104: pdfE003676 - Memory Forum - 3D Memory Integration Platforms
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108: pdf2006 Circuit Design Needs Categories
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112: pdf2010 Test Needs Document
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114: pdf2002-2007 ICSS Research Needs Document
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116: nCORE Research Program - SRC
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118: pdf2006 Circuit Design Needs Categories
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91 through 120 of 711 similar documents, best matches first.   
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