Questions?
Content Type
Other 511
Events 420
Patent Filings 297

SRC Program
SRC 477
GRC 458
FCRP 107
STARnet 69
JUMP 42
NRI 40
JUMP2 28
3D EC 6
SRP 5
Auto 4
nCORE 4
ERI 3
SRCEA 3
ICA 2
MSR-Intel 2

Year
2024 21
2023 48
2022 64
2021 58
2020 25
2019 28
2018 50
2017 51
2016 33
2015 37
2014 46
2013 33
2012 46
2011 230
2010 153
2009 1
2008 1

Center
IFC 50
C2S2 37
GSRC 31
C-SPIN 28
ASCENT 27
LEAST 26
ACE4S 22
FENA 20
TxACE 20
MSD 16
SONIC 15
C-FAR 14
EBSM 13
INDEX 13
SWAN 12
CNFD 9
TerraSwarm 9
CHIRP 8
FAME 8
MuSyC 8
CBRIC 7
NRI-NSF 6
CRISP 5
ComSenTer 5
MIND 5
CONIX 4
E2CDA-NRI 4
SUPREME 3
WIN 3
ACE 2
ADA 2
Benchmarking 2
CAIST 2
CAPSL 2
CEMPI 2
CUBIC 2
NPT 2
AMML 1
CDADIC 1
CHIMES 1

Thrust/Theme
SLD – System Level Design 26
CD – Circuit Design 24
I3T – Innovative and Intelligent... 22
PKG – Packaging 20
LPD – Logic & Physical Design 15
ASCENT-T1 – Vertical CMOS 13
ISD – Integrated System Design 13
TT – Test & Testability 12
AMS-CSD – Analog/Mixed-Signal Ci... 11
ESH – Environment Safety and Hea... 11
HWS – Hardware Security 11
CADT – Computer-Aided Design and... 10
ASCENT-T2 – Beyond CMOS 9
NMP – Nanomanufacturing Material... 9
VER – Verification 8
LMD – Logic and Memory Devices 7
AIHW – Artificial Intelligence H... 6
BEP – Back End Processes 6
PAT – Patterning 6
Pat(MPS) – Patterning 6
ASCENT-T3 – Heterogeneous Integr... 5
CONIX-T1 – ARENA Integrator 4
ComSenTer-T1 – Systems and Algor... 4
NEM – Nanoengineered Materials 4
Advanced Devices & Technologies 3
Back End Processes 3
CBRIC-T1 – Neuro-inspired Algori... 3
CRISP-T1 – Hardware Support for ... 3
CRISP-T3 – Scaling Applications ... 3
ComSenTer-T2 – mm-wave/THz ICs a... 3
MT – Memory Technologies 3
Packaging & Interconnect Systems 3
Physical Design 3
ADA-T1 – Deft Development 2
ADA-T2 – Algorithm-driven Archit... 2
ADA-T3 – Technology-driven Syste... 2
ADS – Alternative Device Structu... 2
ASCENT-T4 – Merged Logic Memory ... 2
CAPSL-T1 – Materials Development... 2
CAPSL-T2 – P-transistors for PSL... 2
CAPSL-T3 – Device Models and Tut... 2
CAPSL-T4 – Architectures and Sys... 2
CFM&TCM – CFM & Total Chemical M... 2
ComSenTer-T3 – Application-speci... 2
ComSenTer-T4 – Center-wide Demon... 2
DV – Design Verification 2
Doping Technologies 2
EP3C – Efficiency and Performanc... 2
FACSYS – Factory Systems 2
Masks 2
Modeling & Simulation 2
Processes – Processes 2
Reliability 2
SCARF – Supply Chain AI Realized... 2
SemiSynBio – Semiconductor Synth... 2
Synthesis & Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
C&S – Controls and Sensing 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T2 – System Support for Ma... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
E2CDA2 – E2CDA 2.0 1

GRC Science Area
CADTS – Computer Aided Design & ... 70
ICSS – Integrated Circuit & Syst... 58
NMS – Nanomanufacturing Sciences 38
IPS – Interconnect & Packaging S... 34
DS – Device Sciences 22
CSR – Cross-disciplinary Semicon... 18
MPS – Material & Process Science... 17
NIS – Nanostructure & Integratio... 11
DES – Design Sciences 7
LIT – Lithography Sciences 7
SRCEA – SRC Education Alliance 7
INT – Interconnect Sciences 5
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
MIC – Microstructure Sciences 4
MBP – Materials & Bulk Processes... 3
MFGPS – Manufacturing Process Sc... 3
PID – Process Integration & Devi... 3
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: SRC: Program Announcement: Packaging and Interconnect Systems...
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1 through 30 of 1,228 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>