Questions?
Content Type
Other 334
Events 258
Patent Filings 10

SRC Program
SRC 268
GRC 248
NRI 34
JUMP2 22
FCRP 14
STARnet 11
nCORE 5
3D EC 4
JUMP 2
SRP 2
ICA 1
NINE 1

Year
2024 14
2023 34
2022 41
2021 32
2020 12
2019 11
2018 22
2017 37
2016 21
2015 19
2014 15
2013 18
2012 38
2011 143
2010 130
2009 1
2008 1

Center
C-SPIN 10
INDEX 10
SWAN 9
EBSM 7
MSD 7
CNFD 6
FAME 6
FENA 6
LEAST 6
NRI-NSF 6
TxACE 6
C2S2 5
CHIRP 5
GSRC 5
IFC 5
C-FAR 4
SONIC 4
TerraSwarm 4
MuSyC 3
NEWLIMITS 3
Benchmarking 2
E2CDA-NRI 2
MIND 2
WIN 2
ACE 1
AMML 1
ASCENT 1
CAPSL 1
CBRIC 1
CUBIC 1
DEEP3M 1
E2CDA 1
IMPACT 1
NPT 1
NRI-Projects 1
SMART 1

Thrust/Theme
PKG – Packaging 8
ESH – Environment Safety and Hea... 5
NMP – Nanomanufacturing Material... 5
AMS-CSD – Analog/Mixed-Signal Ci... 3
CADT – Computer-Aided Design and... 3
HWS – Hardware Security 3
LMD – Logic and Memory Devices 3
SLD – System Level Design 3
CD – Circuit Design 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
NEM – Nanoengineered Materials 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T4 – Characterization ... 2
TT – Test & Testability 2
VER – Verification 2
AIHW – Artificial Intelligence H... 1
AMML-T1 – Antiferromagnetic Magn... 1
ASCENT-T3 – Heterogeneous Integr... 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
E2CDA2 – E2CDA 2.0 1
FACSYS – Factory Systems 1
I3T – Innovative and Intelligent... 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
Materials 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T5 – Simulations and M... 1
PAT – Patterning 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1

GRC Science Area
CADTS – Computer Aided Design & ... 27
NMS – Nanomanufacturing Sciences 24
ICSS – Integrated Circuit & Syst... 18
IPS – Interconnect & Packaging S... 13
CSR – Cross-disciplinary Semicon... 8
DS – Device Sciences 7
SRCEA – SRC Education Alliance 7
PKG – Packaging Sciences 4
ES-H – Environmental Safety & He... 2
INT – Interconnect Sciences 1
MPS – Material & Process Science... 1

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151: pdfNeeds document - grey Area between Back-End Processing and Packaging...
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156: pdfVIA-2020 Forum - Panel 4 - Zhirnov
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171: pdf2002-2007 ICSS Research Needs Document
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