Questions?
Content Type
Other 423
Events 335
Patent Filings 2

SRC Program
SRC 386
GRC 301
JUMP2 25
NRI 24
FCRP 14
3D EC 5
Auto 4
SRP 3
ICA 2
JUMP 2
STARnet 2
nCORE 2
ERI 1

Year
2024 19
2023 41
2022 60
2021 42
2020 18
2019 21
2018 27
2017 34
2016 21
2015 20
2014 28
2013 26
2012 47
2011 211
2010 137
2009 1
2008 1

Center
MSD 16
FENA 15
C2S2 14
GSRC 14
IFC 14
TxACE 11
CHIRP 10
INDEX 9
MuSyC 9
EBSM 8
SWAN 7
C-FAR 5
CNFD 5
FAME 5
LEAST 5
SONIC 5
TerraSwarm 5
NRI-NSF 3
ACE 2
CUBIC 2
E2CDA-NRI 2
MIND 2
NPT 2
SUPREME 2
WIN 2
ACE4S 1
ASCENT 1
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IMPACT 1
IPC 1
NCRC 1
PRISM 1

Thrust/Theme
PKG – Packaging 16
ESH – Environment Safety and Hea... 7
NMP – Nanomanufacturing Material... 7
AMS-CSD – Analog/Mixed-Signal Ci... 4
LMD – Logic and Memory Devices 4
HWS – Hardware Security 3
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
Modeling & Simulation 2
NEM – Nanoengineered Materials 2
PAT – Patterning 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1

GRC Science Area
CADTS – Computer Aided Design & ... 44
ICSS – Integrated Circuit & Syst... 31
NMS – Nanomanufacturing Sciences 30
IPS – Interconnect & Packaging S... 22
CSR – Cross-disciplinary Semicon... 18
DS – Device Sciences 18
SRCEA – SRC Education Alliance 10
PKG – Packaging Sciences 6
ES-H – Environmental Safety & He... 3
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

1 through 30 of 760 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>
1: pdfMicrosoft Word - 2022_pkg_needs_final.docx
Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...h-needs/2022/2022_pkg_needs_final.pdf
Modified: 2022-05-02 - 784KB
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2: pdfPackaging Research Needs Document
Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
Modified: 2021-05-27 - 211KB
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3: pdfMicrosoft Word - Pkg Needs 2005.doc
Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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4: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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5: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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6: pdfS200807_research_needs_PKG.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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7: pdfMicrosoft Word - Packaging Research Needsv2.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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8: pdfPowerPoint Presentation
Future Needs of Advanced Packaging Research Brett Wilkerson Fellow Advanced Packaging 2 | Future Needs of Packaging Research Microelectronic and Advanced Packaging Technologies ...
URL: https://www.src.org/...dar/e007890/adv_pkg_research_mapt.pdf
Modified: 2024-03-05 - 420KB
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9: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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10: pdfNeeds document - grey Area between Back-End Processing and Packaging...
Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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11: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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12: pdfCenter for Ubiquitous Connectivity
Center for Ubiquitous Connectivity S RC e-Workshop: CUbiC Center Plan and Vision 1 Director: Keren Bergman, Columbia University Co-Director: Ali Niknejad, UC Berkeley JUMP 2.0 ...
URL: https://www.src.org/...e007743/cubic_plan_of_action_2023.pdf
Modified: 2023-04-28 - 5.2MB
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13: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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14: pdf2011-2015 SRC-GRC Strategic Plan
2011-2015 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...tab2011-2015-grc-strat-full-draft.pdf
Modified: 2010-07-01 - 1.2MB
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15: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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16: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
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17: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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18: pdfPackaging Research Needs Document
Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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19: pdfS201617 JUMP Research Announcement - Needs Document
Page 1 JUMP Needs Document Point of Contact: JUMP-Solicitation@src.org 6 JUMP THEMES TO CREATE 6 JUMP RESEARCH CENTERS "VERTICAL," APPLICATION-FOCUSED CENTERS 1. RF to THz Sensor ...
URL: https://www.src.org/...te/s201617/jump-ra-needs-document.pdf
Modified: 2016-11-18 - 234KB
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20: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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21: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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22: pdfMicrosoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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23: pdfMicrosoft Word - Interface Research Needs.doc
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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24: pdfS200807_research_needs_INT.doc
Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
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25: 2007 GRC compelling research reasons - SRC
2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
URL: https://www.src.org/...ive/2007/compelling-research-reasons/
Modified: 2010-06-26 - 167KB
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26: pdf1998 SRC Annual Report
S e m i c o n d u c t o r R e s e a r c h C o r p o r a t i o n Strategic Research for a Dynamic Industry S R C A n n u a l R e p o r t 1 9 9 8 Members Advanced Micro Devices, Inc. ...
URL: https://www.src.org/about/corporate-annual/1998.pdf
Modified: 2010-06-21 - 835KB
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27: pdfMicrosoft Word - SRC Needs for Research in Support of Convergence...
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergence.pdf
Modified: 2010-06-21 - 26KB
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28: pdfMicrosoft Word - SRC Needs for Research in Support of Convergence...
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergance.pdf
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29: pdf2004 SRC Annual Report
1 2 SRC Historical Highlights 1981 - Robert N. Noyce, SIA Chair, announced the creation of SRC in December 1982 - SRC offi cially formed; Eric Bloch, IBM, fi rst BOD chair; Larry ...
URL: https://www.src.org/about/corporate-annual/2004.pdf
Modified: 2010-06-21 - 2.9MB
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30: pdfPowerPoint Presentation
Center for Heterogeneous Integration of Micro Electronic Systems Vision & Plan Madhavan Swaminathan, Director Penn State Univ. Muhannad Bakir, Asst. Director Georgia Tech 2 ...
URL: https://www.src.org/...007743/chimes_plan_of_action_2023.pdf
Modified: 2023-04-28 - 2.8MB
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1 through 30 of 760 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>