Questions?
Content Type
Other 330
Events 253
Patent Filings 9

SRC Program
GRC 287
SRC 246
NRI 24
JUMP2 16
FCRP 9
nCORE 7
3D EC 4
ERI 3
STARnet 3
ICA 1
JUMP 1
NINE 1
SRP 1

Year
2024 11
2023 31
2022 48
2021 31
2020 16
2019 12
2018 20
2017 26
2016 17
2015 15
2014 15
2013 11
2012 34
2011 161
2010 130
2009 1

Center
MSD 9
C2S2 8
EBSM 8
FENA 8
GSRC 8
IFC 8
MuSyC 7
CHIRP 6
IMPACT 6
TxACE 6
INDEX 5
SWAN 5
C-SPIN 3
NRI-NSF 3
C-FAR 2
FAME 2
LEAST 2
MIND 2
SONIC 2
TerraSwarm 2
WIN 2
ACE 1
ACE4S 1
AMML 1
ASCENT 1
CAIST 1
CAPSL 1
CDADIC 1
CEMPI 1
CNFD 1
CUBIC 1
DEEP3M 1
E2CDA 1
IPC 1
NCRC 1
NEWLIMITS 1
NPT 1
SMART 1

Thrust/Theme
NMP – Nanomanufacturing Material... 15
PKG – Packaging 11
ESH – Environment Safety and Hea... 7
LMD – Logic and Memory Devices 6
Factory Systems 4
IMPACT-T1 – Materials for Scaled... 4
NEM – Nanoengineered Materials 3
AIHW – Artificial Intelligence H... 2
AMS-CSD – Analog/Mixed-Signal Ci... 2
BEP – Back End Processes 2
FACSYS – Factory Systems 2
HWS – Hardware Security 2
IMPACT-T2 – Materials for Storag... 2
Materials 2
PAT – Patterning 2
SLD – System Level Design 2
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
ASCENT-T1 – Vertical CMOS 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1

GRC Science Area
CADTS – Computer Aided Design & ... 30
NMS – Nanomanufacturing Sciences 27
ICSS – Integrated Circuit & Syst... 22
IPS – Interconnect & Packaging S... 17
CSR – Cross-disciplinary Semicon... 10
SRCEA – SRC Education Alliance 10
DS – Device Sciences 9
PKG – Packaging Sciences 6
MPS – Material & Process Science... 5
ES-H – Environmental Safety & He... 3
INT – Interconnect Sciences 2
MBP – Materials & Bulk Processes... 2
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfBEP Research Needs Statement
Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
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2: pdfBEP Research Needs Statement
Back End Processing Needs Document Introduction In a recent Scientific American editorial, Stuart Firestein asserts that "if you meet a scientist, don't ask her what she knows, ask ...
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3: pdfBEP Research Needs Statement
Back End Processing Needs Document A. Introduction This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP), which includes ...
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4: pdfS200807_research_needs_BEP.doc
Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
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5: pdfMicrosoft Word - BEP_Research_Needs.doc
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6: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
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7: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
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8: pdfTable
1 2 Table of Contents B. Executive Summary ...... 3 C. Description of ...
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9: 2007 GRC compelling research reasons - SRC
2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
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10: pdfTable
1 2 Table of Contents B. Executive Summary ...... 3 C. Description of ...
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11: pdfResearch Needs: nanoelectronics COmputing REsearch (nCORE
Research Needs: nanoelectronics COmputing REsearch (nCORE) Ver. 4 (June 12, 2019) The nanoelectronics COmputing REsearch (nCORE) program at the Semiconductor Research Corporation ...
URL: https://www.src.org/...8/2019-ncore-research-needs-final.pdf
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12: pdfMicrosoft Word - 2022_pkg_needs_final.docx
Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
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13: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
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14: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
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15: Call for Research: Interconnect and Packaging Sciences Program...
Call for Research: Interconnect and Packaging Sciences Research Program You may submit your White Paper online or you may send the PDF or PostScript files as email attachments to: ...
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16: nCORE Research Program - SRC
Technical scope of nanoelectronic COmputing REsearch (nCORE) program Mission and Objective The nanoelectronic COmputing REsearch (nCORE) program funds collaborative university ...
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17: 2005 GRC Compelling Research Report - SRC
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18: pdfESH Needs Document for Nanotechnology
ESH/Technology Research Needs (2008 Update) April 7, 2008 INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor ...
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19: pdfESH for Nanotechnology
1 2011 ESH/Technology Research Needs Document INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor Manufacturing, as well ...
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20: 2008 GRC compelling research reasons - SRC
2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
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21: pdf2010 NMS Research Needs in patterning, nanoengineered materials...
2010 NMS RESEARCH NEEDS IN PATTERNING, NANOENGINEERED MATERIALS, AND METROLOGY July 8, 2010 Introduction Patterning and nanoengineered materials are recognized today as critical to ...
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22: pdf2008 SRC Corporate Annual Report
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28: pdfNMS Research Needs Document, Version 1
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1 through 30 of 592 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>