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- 91:
 2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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- 92:
E003676 - Memory Forum - Government-University-Industry Collaborative...
- page 1 IME Confidential & Proprietary Government-University-Industry Collaborative Models Singapore Perspective Prof Dim-Lee Kwong Institute of Microelectronics page 2 IME ...
URL: https://www.src.org/calendar/e003676/kwong.pdf
Modified: 2010-07-29 - 646KB
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- 93:
Future Challenges from a Thermal Perspective for Three Dimensional...
- Future Challenges from a Thermal Perspective for Three Dimensional Chip Stacks Dr. Gamal Refai-Ahmed, AMD In the recent years, there have been grown activities of the appropriate ...
URL: https://www.src.org/calendar/e003506/refai-abs/
Modified: 2011-06-17 - 20KB
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- 94:
FISC 2030 - Session 5 - Rabaey
- Jan M. Rabaey Berkeley Ubiquitous Swarm Lab Multiscale Systems Research Center (MuSyC) EECS, University of California at Berkeley FISC SYMPOSIUM, MAYNOOTH, MARCH 2012 Vision 2025 - ...
URL: https://www.src.org/calendar/e004576/rabaey.pdf
Modified: 2012-03-29 - 12.0MB
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- 95:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 96:
State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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- 97:
2nd SRC Bioelectronics Roundtable
- page 1 IME Confidential & Proprietary Singapore - some facts . Country size . Economy size . Population . Rate of growth (Paste a better map of singapore 2 nd SRC Bioelectronics ...
URL: https://www.src.org/calendar/e003891/tushar.pdf
Modified: 2010-06-21 - 3.6MB
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- 98:
S200807_research_needs_INT.doc
- Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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- 99:
Microsoft Word - Interface Research Needs.doc
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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- 100:
2009 Summer Study: NRI Program Directions and Promising Outputs
- NRI Program Directions and Promising Outputs NRI Program Directions and Promising Outputs ETAB Summer Study Jeff Welser June, 2009 Some information in this presentation is SRC-NRI ...
URL: https://www.src.org/calendar/e003506/04-sessioni-welser.pdf
Modified: 2011-06-17 - 991KB
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- 101:
S200807_research_needs_BEP.doc
- Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
URL: https://www.src.org/...ch-needs/2008/back-end-processing.pdf
Modified: 2011-02-03 - 35KB
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- 102:
Microsoft Word - BEP_Research_Needs.doc
- Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
URL: https://www.src.org/...ch-needs/2007/back-end-processing.pdf
Modified: 2011-02-03 - 28KB
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- 103:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 104:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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- 105:
BEP Research Needs Statement
- Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
URL: https://www.src.org/...m/grc/ips/research-needs/2011/bep.pdf
Modified: 2011-03-22 - 67KB
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- 106:
E003676 - Memory Forum - My (Optimistic) 3 Cents to Flash Scaling
- My (Optimistic) 3 Cents to Flash Scaling Flash Scaling Electrostatics, Resonant Tunneling and Planar Stacks Edwin C. Kan El t i l d C t E i i Electrical and Computer Engineering ...
URL: https://www.src.org/calendar/e003676/kan.pdf
Modified: 2010-07-29 - 982KB
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- 107:
2009 Summer Study: Application and Network Optimized Next Generation...
- © 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
URL: https://www.src.org/...dar/e003506/04-sessionii-daijavad.pdf
Modified: 2011-06-17 - 1.3MB
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- 108:
E003676 - Memory Forum - 3D Memory Integration Platforms
- luj@rpi.edu October 20 October 20- -21, 2009 21, 2009 1 SRC/NSF/A*STAR Forum SRC/NSF/A*STAR Forum 3D Memory Integration Platforms 3D Memory Integration Platforms - - Novel ...
URL: https://www.src.org/calendar/e003676/lu.pdf
Modified: 2010-07-29 - 1.1MB
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- 109:
BEP Research Needs Statement
- Back End Processing Needs Document Introduction In a recent Scientific American editorial, Stuart Firestein asserts that "if you meet a scientist, don't ask her what she knows, ask ...
URL: https://www.src.org/...m/grc/ips/research-needs/2012/bep.pdf
Modified: 2012-08-30 - 172KB
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- 110:
Microsoft Word - Pkg Needs 2005.doc
- Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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- 111:
Research Needs: Logic and Memory Devices (LMD)
- Research Needs: Logic and Memory Devices (LMD) May 12, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 This document is prepared to accompany the ...
URL: https://www.src.org/...022/2022_lmd_research_needs_final.pdf
Modified: 2022-04-27 - 233KB
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- 112:
Research Needs: Logic and Memory Devices (LMD)
- Research Needs: Logic and Memory Devices (LMD) May 1st, 2023 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 [ This document is prepared to accompany the ...
URL: https://www.src.org/...rch-needs/2023_lmd_research_needs.pdf
Modified: 2023-05-01 - 232KB
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- 113:
BEP Research Needs Statement
- Back End Processing Needs Document A. Introduction This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP), which includes ...
URL: https://www.src.org/.../ips/research-needs/2010/back end.pdf
Modified: 2010-07-22 - 69KB
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- 114:
TECHCON 2013 (Event E004683) - SRC
- TECHCON 2013 Date: Monday, Sept. 9, 2013, 8 a.m. - Tuesday, Sept. 10, 2013, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004683 E004683 image ...
URL: https://www.src.org/calendar/e004683/
Modified: 2014-03-10 - 136KB
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- 115:
Semiconductor Research Corporation
- Research Challenges in CAD and Test Semiconductor Research Corporation March 2016 The Computer-Aided Design and Test thrust at the Semiconductor Research Corporation is soliciting ...
URL: https://www.src.org/...adt/research-needs/2016/2016-cadt.pdf
Modified: 2016-03-17 - 88KB
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- 116:
Call for White Papers in Emerging Technologies in Materials,...
- Call for White Papers in Emerging Technologies in Materials, Processes, and Devices Overview Research Scope White Paper Guidelines Timetable and Deadlines Overview Semiconductor ...
URL: https://www.src.org/compete/s201213/
Modified: 2012-07-27 - 28KB
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- 117:
2010 Test Needs Document
- 1 Research Challenges in Test and Testability Semiconductor Research Corporation January 2010 Introduction Test and design for testability are recognized today as critical to a ...
URL: https://www.src.org/...rc/cadts/research-needs/2010/test.pdf
Modified: 2011-02-03 - 198KB
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- 118:
2021 Packaging CHIRP Center Review
- 2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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- 119:
E003932 - Variability Forum - Gupta
- NanoCAD Lab Modeling Performance Impact of Variability Puneet Gupta Dept. of EE, University of California Los Angeles (puneet@ee.ucla.edu) Work partly supported by NSF, UC ...
URL: https://www.src.org/calendar/e003932/e003932_s2_2_gupta.pdf
Modified: 2010-06-29 - 1.4MB
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- 120:
NRI Newsletter April 15.docx
- Monthly Newsletter for April 2012 Dr. Jeffrey Welser, Director NRI in the News INDEX Graduate Research Assistant Wins Excellence Award. Congratulations to Shaloo Rakheja who ...
URL: https://www.src.org/program/nri/newsletter/april-15.pdf
Modified: 2012-04-16 - 363KB
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