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Content Type

Other	274
Events	199
Patent Filings	2

SRC Program

GRC	242
SRC	194
JUMP2	15
NRI	15
FCRP	9
3D EC	4
nCORE	3
ICA	1

Year

2024	11
2023	25
2022	39
2021	24
2020	9
2019	11
2018	18
2017	20
2016	14
2015	14
2014	10
2013	10
2012	32
2011	127
2010	106
2009	1

Center

CHIRP	8
TxACE	7
MSD	5
C2S2	4
FENA	4
GSRC	4
IFC	4
INDEX	4
SWAN	4
MuSyC	3
IMPACT	2
MIND	2
NRI-NSF	2
WIN	2
ACE	1
AMML	1
C-FAR	1
CAPSL	1
CNFD	1
CUBIC	1
DEEP3M	1
E2CDA	1
EBSM	1
FAME	1
LEAST	1
NEWLIMITS	1
NPT	1
SMART	1
SONIC	1
TerraSwarm	1

Thrust/Theme

PKG – Packaging	16
NMP – Nanomanufacturing Material...	7
LMD – Logic and Memory Devices	2
NEM – Nanoengineered Materials	2
AMML-T1 – Antiferromagnetic Magn...	1
AMS-CSD – Analog/Mixed-Signal Ci...	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
E2CDA2 – E2CDA 2.0	1
ESH – Environment Safety and Hea...	1
FACSYS – Factory Systems	1
IMPACT-T1 – Materials for Scaled...	1
IMPACT-T2 – Materials for Storag...	1
NEWLIMITS-T1 – Novel Computing a...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NEWLIMITS-T3 – Advanced Manufact...	1
NEWLIMITS-T4 – Characterization ...	1
NEWLIMITS-T5 – Simulations and M...	1
PAT – Patterning	1
SMART-T1 – Spin-orbit Torque Mat...	1
SMART-T2 – Ultra-Low Loss Spin W...	1
SMART-T3 – Magneto-ionic Materia...	1

GRC Science Area

CADTS – Computer Aided Design & ...	23
ICSS – Integrated Circuit & Syst...	15
NMS – Nanomanufacturing Sciences	14
IPS – Interconnect & Packaging S...	13
CSR – Cross-disciplinary Semicon...	5
PKG – Packaging Sciences	5
DS – Device Sciences	4
SRCEA – SRC Education Alliance	4
ES-H – Environmental Safety & He...	1
NIS – Nanostructure & Integratio...	1

1 through 30 of 475 similar documents, best matches first.

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1: BEP Research Needs Statement: IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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2: BEP Research Needs Statement: IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2012/interface.pdf
Modified: 2012-09-25 - 134KB
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3: BEP Research Needs Statement: Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
URL: https://www.src.org/...m/grc/ips/research-needs/2011/bep.pdf
Modified: 2011-03-22 - 67KB
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4: Needs document - grey Area between Back-End Processing and Packaging...: Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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5: 2005 GRC Compelling Research Report - SRC: 2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
URL: https://www.src.org/...ive/2005/compelling-research-reasons/
Modified: 2010-06-26 - 189KB
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6: BEP Research Needs Statement: Back End Processing Needs Document Introduction In a recent Scientific American editorial, Stuart Firestein asserts that "if you meet a scientist, don't ask her what she knows, ask ...
URL: https://www.src.org/...m/grc/ips/research-needs/2012/bep.pdf
Modified: 2012-08-30 - 172KB
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7: Microsoft Word - SRC Needs for Research in Support of Convergence...: Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergence.pdf
Modified: 2010-06-21 - 26KB
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8: Microsoft Word - SRC Needs for Research in Support of Convergence...: Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergance.pdf
Modified: 2011-02-03 - 26KB
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9: 2012 - 2016 SRC-GRC Strategic Plan - DRAFT II: 1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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10: Microsoft Word - Final 2004 Needs.doc: 1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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11: Microsoft Word - Interface Research Needs.doc: Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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12: S200807_research_needs_INT.doc: Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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13: Microsoft Word - Final 2004 Needs.doc: 1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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14: S200807_research_needs_PKG.doc: Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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15: Microsoft Word - Pkg Needs 2005.doc: Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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16: Microsoft Word - Packaging Research Needsv2.doc: Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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17: Microsoft Word - Packaging_Needs.doc: 5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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18: Packaging Research Needs Document: Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
Modified: 2021-05-27 - 211KB
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19: Microsoft Word - 2022_pkg_needs_final.docx: Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...h-needs/2022/2022_pkg_needs_final.pdf
Modified: 2022-05-02 - 784KB
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20: The GRC division of SRC focuses on research in a timeframe 5...: Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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21: Research needs documen - packaging: Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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22: 2007 GRC compelling research reasons - SRC: 2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
URL: https://www.src.org/...ive/2007/compelling-research-reasons/
Modified: 2010-06-26 - 167KB
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23: The GRC division of SRC focuses on research in a timeframe 5...: Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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24: 2008 GRC compelling research reasons - SRC: 2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
URL: https://www.src.org/...ive/2008/compelling-research-reasons/
Modified: 2010-06-26 - 188KB
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25: 2006 GRC compelling research reasons - SRC: 2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
URL: https://www.src.org/...ive/2006/compelling-research-reasons/
Modified: 2010-06-26 - 200KB
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26: 2006 Annual Report: Ta b l e o f C o n t e n t s 1 Table of Contents 2006 in Perspective 4 Global Research Collaboration 6 SRC Fundamental Studies 15 Focus Center Research Program 16 Nanoelectronics ...
URL: https://www.src.org/about/corporate-annual/2006.pdf
Modified: 2010-06-21 - 2.3MB
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27: ESH Needs Document for Nanotechnology: ESH/Technology Research Needs (2008 Update) April 7, 2008 INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor ...
URL: https://www.src.org/...m/grc/nms/research-needs/2008/esh.pdf
Modified: 2011-02-03 - 56KB
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28: 2006 Circuit Design Needs Categories: Research Needs: Analog/Mixed-Signal Circuits, Systems, and Devices (AMS-CSD) + TxACE April 10, 2023 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 The Semiconductor ...
URL: https://www.src.org/...3_ams_csd_research_needs_v4_clean.pdf
Modified: 2023-04-07 - 170KB
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29: ESH for Nanotechnology: 1 2011 ESH/Technology Research Needs Document INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor Manufacturing, as well ...
URL: https://www.src.org/...m/grc/nms/research-needs/2011/esh.pdf
Modified: 2011-03-14 - 128KB
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30: Dr. Malcolm Thompson - e-Workshop Packaging: Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1 FlexTech & NBMC Business Model  20+ years as ...
URL: https://www.src.org/...ndar/e005802/e005802-presentation.pdf
Modified: 2015-07-23 - 4.9MB
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1 through 30 of 475 similar documents, best matches first.

Results by:	Page: 1 2 3 4 5 6 7 8 9 10	next >>