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- 1:
Microsoft PowerPoint - etab_jun09.ppt [Compatibility Mode]
- Coping with Vertical Interconnect Coping with Vertical Interconnect Bottleneck Bottleneck Bottleneck Bottleneck Jason Cong Jason Cong UCLA Computer Science Department UCLA Computer ...
URL: https://www.src.org/.../2009s-study-siii-vertint-cong-v2.pdf
Modified: 2011-06-17 - 473KB Find Similar Documents
- 2:
PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB Find Similar Documents
- 3:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB Find Similar Documents
- 4:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB Find Similar Documents
- 5:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB Find Similar Documents
- 6:
2009 Summer Study: Architecture and Appliction Perspectives for...
- Architecture and Application Perspectives for Application Perspectives for 3D Integration Yuan Xie Associate Professor Associate Professor The Pennsylvania State University ...
URL: https://www.src.org/...2009s-study-siii-architecture-xie.pdf
Modified: 2011-06-17 - 940KB Find Similar Documents
- 7:
VIA-2020 Forum - Panel 1 - McDonald
- "Breaking the Memory Wall for Multi-core Processors with 3D Hyper-integration and Hetero-integration" SRC/NSF/ITRS Forum on Emerging nano-CMOS Architectures - Virtual Immersion ...
URL: https://www.src.org/calendar/e003362/p1-mcdonald.pdf
Modified: 2011-04-18 - 4.7MB Find Similar Documents
- 8:
VIA-2020 Forum - Panel 1 - Draper
- SRC/NSF/ITRS 2020 Virtual Immersion Architectures Santa Cruz, CA July 10-11, 2008 Interconnect Fabrics Don Draper Rambus, Inc. SRC/NSF/ITRS 2020 Virtual Immersion Architectures ...
URL: https://www.src.org/calendar/e003362/p1-draper.pdf
Modified: 2011-04-18 - 1.7MB Find Similar Documents
- 9:
2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB Find Similar Documents
- 10:
VIA Forum - P2 Presentation - Raja Koduri
- AMD Smarter Choice GPU A hit t d GPU Architectures and Futures - Some thoughts Raja Koduri CTO Graphics AMD CTO, Graphics, AMD Agenda . A programmer view of the graphics pipeline . ...
URL: https://www.src.org/...ar/e003362/p2-presentation-koduri.pdf
Modified: 2011-04-18 - 6.3MB Find Similar Documents
- 11:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB Find Similar Documents
- 12:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB Find Similar Documents
- 13:
2009 GRC ETAB Summer Study Session III Summary
- Session III Design Challenges for 3D Integration SRC GRC ETAB Summer Study 8:00 - 12:30 June 30, 2009 8:00 Introduction - John Darringer, IBM 8:15 An IFM Perspective of a 3D Design ...
URL: https://www.src.org/calendar/e003506/siii-sum.pdf
Modified: 2011-06-17 - 44KB Find Similar Documents
- 14:
VIA-2020 Forum - Panel 4 - Peleg
- 1 Intel confidential Future PC Trends Future PC Trends & their Implications on & their Implications on Traditional Computing Architectures Traditional Computing Architectures Alex ...
URL: https://www.src.org/calendar/e003362/p4-peleg.pdf
Modified: 2011-04-18 - 83KB Find Similar Documents
- 15:
FCRP Program Directions and Promising Outputs
- FCRP Program Directions & Promising Outputs 2009 GRC ETAB Summer Study Betsy Weitzman g g p y y June 29, 2009 Exec. VP, SRC and Exec. Dir., FCRP (919) 941-9426 ...
URL: https://www.src.org/...ndar/e003506/03-sessioni-weitzman.pdf
Modified: 2011-06-17 - 432KB Find Similar Documents
- 16:
VIA-2020 Forum - Panel 3 - Baas
- Computational Platforms for Virtual Immersion Architectures: Integrating Specialized Processing Units Into A Homogeneous Array of Processors Bevan Baas Department of Electrical and ...
URL: https://www.src.org/calendar/e003362/p3-baas.pdf
Modified: 2011-04-18 - 1.9MB Find Similar Documents
- 17:
TECHCON 2011 (Event E004113) - SRC
- TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB Find Similar Documents
- 18:
Output from 2009 SRC GRC ETAB Summer Study
- July 1, 2009 Output from 2009 SRC GRC ETAB Summer Study A Report to the SRC Board of Directors Frank Robertson 2 2009 SRC GRC ETAB Summer Study Sessions Research Portfolio Five ...
URL: https://www.src.org/calendar/e003506/sstudyoutput.pdf
Modified: 2011-06-17 - 130KB Find Similar Documents
- 19:
2009 Summer Study: Application and Network Optimized Next Generation...
- © 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
URL: https://www.src.org/...dar/e003506/04-sessionii-daijavad.pdf
Modified: 2011-06-17 - 1.3MB Find Similar Documents
- 20:
SRC/NSF Design Forum - Position Statement
- A Position Statement in the Forum on Future Directions for Design Automation Research Jason Cong UCLA Computer Science Department http://cadlab.cs.ucla.edu/~cong There are many ...
URL: https://www.src.org/...764/jason-cong-position-statement.pdf
Modified: 2011-08-02 - 35KB Find Similar Documents
- 21:
VIA-2020 Forum - Panel 4 - Zhirnov
- 1 Device Opportunities for Beyond CMOS: A System Perspective Victor Zhirnov 2 Question How will semiconductor nanoscale technology impact different information-processing and ...
URL: https://www.src.org/calendar/e003362/p4-zhirnov.pdf
Modified: 2011-04-18 - 401KB Find Similar Documents
- 22:
Final Report - Workshop on Failure and Uncertainty in Mixed-Signal...
- National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB Find Similar Documents
- 23:
Coping with Vertical Interconnect Bottleneck - SRC
- Coping with Vertical Interconnect Bottleneck Prof. Jason Cong, UCLA Computer Science Department Vertical interconnect is crucial in realizing the significant area, performance, and ...
URL: https://www.src.org/calendar/e003506/cong-abs/
Modified: 2011-06-17 - 20KB Find Similar Documents
- 24:
State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB Find Similar Documents
- 25:
VIA-2020 Forum - Panel 3 - Moore
- The Role of Accelerated Computing in the Multi-Core Era Chuck Moore Senior Fellow Advanced Micro Devices May 17, 2006 The Role of Accelerated Computing in the Multi-core Era 2 7/...
URL: https://www.src.org/calendar/e003362/p3-moore.pdf
Modified: 2011-04-18 - 511KB Find Similar Documents
- 26:
VIA-2020 Forum - Panel 1 - Presentation - Rabaey
- Jan M. Rabaey, Donald O. Pederson Distinguished Professor Director Gigascale Systems Research Center (GSRC) Scientific Co-Director Berkeley Wireless Research Center (BWRC) ...
URL: https://www.src.org/...ar/e003362/p1-presentation-rabaey.pdf
Modified: 2011-04-18 - 2.5MB Find Similar Documents
- 27:
Avideh Zakhor abstract - SRC
- Data Path Challenges for Future Direct Write Maskless Lithography System Avideh Zakhor Professor, Electrical Engineering and Computer Sciences Univ. of California/Berkeley Future ...
URL: https://www.src.org/calendar/e003804/zakhor-abstract/
Modified: 2011-05-11 - 23KB Find Similar Documents
- 28:
VIA-2020 Forum - Panel 4 Presentation - Cavin
- Computation vis-à-vis Physics: A Framework VIA 2020 Forum, July 10 & 11, 2008 Ralph K. Cavin, III, Victor V. Zhirnov & Sadasivan Shankar (Intel) 2 Outline Relations between ...
URL: https://www.src.org/...dar/e003362/p4-presentation-cavin.pdf
Modified: 2011-04-18 - 553KB Find Similar Documents
- 29:
Vivek De abstract - SRC
- Abstract: Research Directions in Low Power Circuits & Systems Vivek De Senior Director Intel Aggressive voltage scaling is a must for making major leaps in energy efficiency and ...
URL: https://www.src.org/calendar/e003804/de-abstract/
Modified: 2011-05-09 - 22KB Find Similar Documents
- 30:
SRC GRC: Nano-Morphic Forum - P3 Yushin
- www.nano-tech.gatech.edu Integrated Supercapacitors For Nano-Morphic Systems Prof. Gleb Yushin, Georgia Institute of Technology School of Materials Science & Engineering Phone: ...
URL: https://www.src.org/calendar/e003062/yushin.pdf
Modified: 2011-08-02 - 419KB Find Similar Documents
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