Questions?
Content Type
Other 360
Events 320
Patent Filings 31

SRC Program
GRC 326
SRC 297
NRI 36
JUMP2 20
FCRP 16
STARnet 8
nCORE 7
3D EC 5
ERI 3
JUMP 3
Auto 1
ICA 1
NINE 1
SRP 1

Year
2024 15
2023 38
2022 56
2021 40
2020 16
2019 12
2018 25
2017 30
2016 22
2015 20
2014 17
2013 14
2012 52
2011 183
2010 135
2009 1

Center
SWAN 13
IFC 12
GSRC 11
MSD 11
C2S2 10
CHIRP 10
FENA 10
TxACE 10
INDEX 9
MuSyC 8
LEAST 6
ACE4S 5
C-SPIN 5
EBSM 5
FAME 5
IMPACT 5
CNFD 4
E2CDA-NRI 4
NRI-NSF 4
C-FAR 3
MIND 3
SONIC 3
TerraSwarm 3
WIN 3
ASCENT 2
CAIST 2
NEWLIMITS 2
ACE 1
AMML 1
Benchmarking 1
CAPSL 1
CDADIC 1
CEMPI 1
CUBIC 1
DEEP3M 1
E2CDA 1
IPC 1
NCRC 1
NPT 1
NRI-Projects 1

Thrust/Theme
PKG – Packaging 21
NMP – Nanomanufacturing Material... 9
CD – Circuit Design 7
LMD – Logic and Memory Devices 6
ESH – Environment Safety and Hea... 5
I3T – Innovative and Intelligent... 5
SLD – System Level Design 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
IMPACT-T1 – Materials for Scaled... 4
NEM – Nanoengineered Materials 4
Back End Processes 3
AMS – Analog and Mixed-Signal De... 2
ASCENT-T1 – Vertical CMOS 2
FACSYS – Factory Systems 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
Materials 2
NEWLIMITS-T4 – Characterization ... 2
PAT – Patterning 2
Physical Design 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMML-T1 – Antiferromagnetic Magn... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T2 – Materials for Storag... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1

GRC Science Area
CADTS – Computer Aided Design & ... 34
ICSS – Integrated Circuit & Syst... 31
NMS – Nanomanufacturing Sciences 26
IPS – Interconnect & Packaging S... 25
CSR – Cross-disciplinary Semicon... 12
DS – Device Sciences 12
SRCEA – SRC Education Alliance 8
PKG – Packaging Sciences 6
MPS – Material & Process Science... 4
ES-H – Environmental Safety & He... 3
NIS – Nanostructure & Integratio... 3
DES – Design Sciences 2
INT – Interconnect Sciences 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MSS – Manufacturing Systems Scie... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

1 through 30 of 711 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>
1: pdfPackaging Research Needs Document
Research Needs: Packaging June 1, 2021 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...021/2021_pkg_needs_document_final.pdf
Modified: 2021-05-27 - 211KB
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2: pdfMicrosoft Word - 2022_pkg_needs_final.docx
Research Needs: Packaging June 1, 2022 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Overview Semiconductor-based computing and communication has revolutionized all ...
URL: https://www.src.org/...h-needs/2022/2022_pkg_needs_final.pdf
Modified: 2022-05-02 - 784KB
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3: pdfPackaging Research Needs Document
Research Needs: Packaging June 10, 2019 Semiconductor Research Corporation (SRC), Durham, NC 27703 1 Background Semiconductor-based computing and communication has revolutionized ...
URL: https://www.src.org/.../pkg/research-needs/2019/2019-pkg.pdf
Modified: 2019-07-01 - 170KB
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4: pdfPackaging Research Needs Document
1 Research Needs: Packaging June 25, 2018 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background Semiconductor- based computing has revolutionized all ...
URL: https://www.src.org/...esearch-needs/2018/2018_pkg_needs.pdf
Modified: 2018-06-22 - 175KB
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5: pdf2016 - Packaging Research Needs Document
Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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6: pdfPackaging Research Needs Document
Packaging Needs Document Contributors: Ravi Mahajan (Intel Corporation), Peter Brofman (IBM), Ramakanth Alapati (Global Foundries), Claude Hilbert (AMD), Luu Nguyen (Texas ...
URL: https://www.src.org/...pkg/research-needs/2015/packaging.pdf
Modified: 2014-12-12 - 112KB
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7: 2005 GRC Compelling Research Report - SRC
2005 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 658 Nanostructure & Integration Sciences Role ...
URL: https://www.src.org/...ive/2005/compelling-research-reasons/
Modified: 2010-06-26 - 189KB
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8: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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9: pdfMicrosoft Word - Final 2004 Needs.doc
1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...m/grc/ips/research-needs/2004/bep.pdf
Modified: 2010-06-21 - 47KB
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10: 2006 GRC compelling research reasons - SRC
2006 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1190 Integrated Circuit & Systems Sciences ...
URL: https://www.src.org/...ive/2006/compelling-research-reasons/
Modified: 2010-06-26 - 200KB
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11: pdfPowerPoint Presentation
Future Needs of Advanced Packaging Research Brett Wilkerson Fellow Advanced Packaging 2 | Future Needs of Packaging Research Microelectronic and Advanced Packaging Technologies ...
URL: https://www.src.org/...dar/e007890/adv_pkg_research_mapt.pdf
Modified: 2024-03-05 - 420KB
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12: 2007 GRC compelling research reasons - SRC
2007 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1241 Computer Aided Design & Test Sciences A ...
URL: https://www.src.org/...ive/2007/compelling-research-reasons/
Modified: 2010-06-26 - 167KB
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13: pdfMicrosoft Word - Packaging_Needs.doc
5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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14: pdf2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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15: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document Introduction Processing architectures need to continue to take advantage of silicon technology scaling to provide performance enhancements but with ...
URL: https://www.src.org/...ips/research-needs/2012/packaging.pdf
Modified: 2012-08-30 - 387KB
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16: pdfS200807_research_needs_PKG.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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17: pdfResearch needs documen - packaging
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2010/packaging.pdf
Modified: 2010-07-22 - 87KB
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18: pdfMicrosoft Word - Packaging Research Needsv2.doc
Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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19: pdf2011-2015 SRC-GRC Strategic Plan
2011-2015 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...tab2011-2015-grc-strat-full-draft.pdf
Modified: 2010-07-01 - 1.2MB
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20: pdfThe GRC division of SRC focuses on research in a timeframe 5...
Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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21: 2008 GRC compelling research reasons - SRC
2008 GRC Compelling Research Reasons Advanced Micro Devices, Inc. next company Newly Recognized ID Science Areas Title PI Start Date 1292 Interconnect & Packaging Sciences The New ...
URL: https://www.src.org/...ive/2008/compelling-research-reasons/
Modified: 2010-06-26 - 188KB
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22: pdfMicrosoft Word - Pkg Needs 2005.doc
Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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23: Call for Research: Interconnect and Packaging Sciences Program...
Call for Research: Interconnect and Packaging Sciences Research Program You may submit your White Paper online or you may send the PDF or PostScript files as email attachments to: ...
URL: https://www.src.org/compete/archive/grc/2004-bep/
Modified: 2011-02-03 - 33KB
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24: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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25: pdfMicrosoft PowerPoint - SRC Webinar_Benefits of Jointly Funded...
| NXP | Public 1 | Public | NXP, and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2024 NXP B.V. ...
URL: https://www.src.org/...r/e007890/benefits_of_jointly_nxp.pdf
Modified: 2024-03-05 - 970KB
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26: pdfMicrosoft Word - Interface Research Needs.doc
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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27: pdfNeeds document - grey Area between Back-End Processing and Packaging...
Overlapping Back End Processing and Packaging Needs Document A. Introduction As integration of electronics continues to increase, the demarcation between chip and package ...
URL: https://www.src.org/...ch-needs/2010/overlapping pkg-bep.pdf
Modified: 2010-07-22 - 53KB
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28: pdfS200807_research_needs_INT.doc
Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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29: pdfS201617 JUMP Research Announcement - Needs Document
Page 1 JUMP Needs Document Point of Contact: JUMP-Solicitation@src.org 6 JUMP THEMES TO CREATE 6 JUMP RESEARCH CENTERS "VERTICAL," APPLICATION-FOCUSED CENTERS 1. RF to THz Sensor ...
URL: https://www.src.org/...te/s201617/jump-ra-needs-document.pdf
Modified: 2016-11-18 - 234KB
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30: pdfMicrosoft Word - SRC Needs for Research in Support of Convergence...
Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry moves along the technology treadmill, as indicated by the ...
URL: https://www.src.org/...s/research-needs/2004/convergence.pdf
Modified: 2010-06-21 - 26KB
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1 through 30 of 711 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>