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- 1:
 Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 2:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB
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- 3:
IRP Advisory Board Meeting
- Packaging (PKG) and Environment, Safety, and Health (ESH) Research Program Annual Review June 3-7, 2024 Intel, Chandler, AZ John Oakley, Science Director Kashyap Yellai, Program ...
URL: https://www.src.org/...e007869/2024_pkg_esh_intro_slides.pdf
Modified: 2024-06-03 - 2.1MB
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- 4:
E003676 - SRC/NSF/A*STAR Forum on 2020 Semiconductor Memory Strategies...
- SRC/NSF/A*STAR Forum on 2020 Semiconductor Memory Strategies: Processes, Devices, and Architectures I. Introduction In 1957, Richard Feynman asked in a lecture at Caltech if it ...
URL: https://www.src.org/calendar/e003676/finalreport.pdf
Modified: 2010-07-29 - 526KB
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- 5:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 6:
architectures for Extremely Scaled Memories
- Architectures for Architectures for Extremely Scaled Memories Extremely Scaled Memories y y Paul Franzon Department of Electrical and Computer Engineering paulf@ncsu edu ...
URL: https://www.src.org/calendar/e003676/franzon.pdf
Modified: 2010-07-29 - 4.1MB
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- 7:
Slide 1
- 230 250 270 290 310 0 0 0 0 0 0 0 0 1 2 240 260 280 300 V G (mV) V G (mV) I (nA) V SD = - 30 mV The absence of steps the sequential nature coupling of the atom. Figure 4b shows ...
URL: https://www.src.org/calendar/e004100/e004100-00-session3.pdf
Modified: 2010-11-29 - 29.2MB
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- 8:
IRP Advisory Board Meeting
- Packaging Research Program e-Kickoff March 22-23, 2023, virtual John Oakley, Science Director LaDonya Dooley, Research Program Coordinator Day 1 : https://www.src.org/calendar/...
URL: https://www.src.org/.../1_2023-ekickoff-pkg-introduction.pdf
Modified: 2023-03-27 - 535KB
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- 9:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 10:
Final Report - Workshop on Failure and Uncertainty in Mixed-Signal...
- National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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- 11:
IRP Advisory Board Meeting
- AMS-CSD Research Program Annual Review Oct 17-20, 2023 UT Dallas, TX Marcus Pan, Science Director LaTanya Holmes, Research Program Coordinator https://www.src.org/calendar/e007770/ ...
URL: https://www.src.org/calendar/e007770/2023_ams-csd_intro.pdf
Modified: 2023-10-25 - 594KB
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- 12:
Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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- 13:
2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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- 14:
E003676 - Memory Forum - Government-University-Industry Collaborative...
- page 1 IME Confidential & Proprietary Government-University-Industry Collaborative Models Singapore Perspective Prof Dim-Lee Kwong Institute of Microelectronics page 2 IME ...
URL: https://www.src.org/calendar/e003676/kwong.pdf
Modified: 2010-07-29 - 646KB
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- 15:
Future Challenges from a Thermal Perspective for Three Dimensional...
- Future Challenges from a Thermal Perspective for Three Dimensional Chip Stacks Dr. Gamal Refai-Ahmed, AMD In the recent years, there have been grown activities of the appropriate ...
URL: https://www.src.org/calendar/e003506/refai-abs/
Modified: 2011-06-17 - 20KB
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- 16:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 17:
State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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- 18:
2009 Summer Study: NRI Program Directions and Promising Outputs
- NRI Program Directions and Promising Outputs NRI Program Directions and Promising Outputs ETAB Summer Study Jeff Welser June, 2009 Some information in this presentation is SRC-NRI ...
URL: https://www.src.org/calendar/e003506/04-sessioni-welser.pdf
Modified: 2011-06-17 - 991KB
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- 19:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 20:
E003676 - Memory Forum - My (Optimistic) 3 Cents to Flash Scaling
- My (Optimistic) 3 Cents to Flash Scaling Flash Scaling Electrostatics, Resonant Tunneling and Planar Stacks Edwin C. Kan El t i l d C t E i i Electrical and Computer Engineering ...
URL: https://www.src.org/calendar/e003676/kan.pdf
Modified: 2010-07-29 - 982KB
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- 21:
2009 Summer Study: Application and Network Optimized Next Generation...
- © 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
URL: https://www.src.org/...dar/e003506/04-sessionii-daijavad.pdf
Modified: 2011-06-17 - 1.3MB
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- 22:
E003676 - Memory Forum - 3D Memory Integration Platforms
- luj@rpi.edu October 20 October 20- -21, 2009 21, 2009 1 SRC/NSF/A*STAR Forum SRC/NSF/A*STAR Forum 3D Memory Integration Platforms 3D Memory Integration Platforms - - Novel ...
URL: https://www.src.org/calendar/e003676/lu.pdf
Modified: 2010-07-29 - 1.1MB
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- 23:
2021 Packaging CHIRP Center Review
- 2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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- 24:
PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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- 25:
Slide 1
- ITRS - Deterministic Doping, Thomas Schenkel, LBNL, Nov. 12, 2010 Single Ion Implantation Thomas Schenkel Lawrence Berkeley National Laboratory T_Schenkel@LBL.gov ITRS - ...
URL: https://www.src.org/calendar/e004100/e004100-00-session2.pdf
Modified: 2010-11-29 - 52.6MB
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- 26:
NMS Nanoengineered Materials Review
- NMP Patterning/Front- End Processes Review eBook May 2 & 3, 2018 NC State University Golden LEAF Biomanufacturing Training and Education Center Restricted Distribution: SRC ...
URL: https://www.src.org/calendar/e006394/e006394-ebook.pdf
Modified: 2018-03-30 - 1.6MB
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- 27:
Microsoft PowerPoint - etab_jun09.ppt [Compatibility Mode]
- Coping with Vertical Interconnect Coping with Vertical Interconnect Bottleneck Bottleneck Bottleneck Bottleneck Jason Cong Jason Cong UCLA Computer Science Department UCLA Computer ...
URL: https://www.src.org/.../2009s-study-siii-vertint-cong-v2.pdf
Modified: 2011-06-17 - 473KB
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- 28:
VIA Forum - P2 Presentation - Raja Koduri
- AMD Smarter Choice GPU A hit t d GPU Architectures and Futures - Some thoughts Raja Koduri CTO Graphics AMD CTO, Graphics, AMD Agenda . A programmer view of the graphics pipeline . ...
URL: https://www.src.org/...ar/e003362/p2-presentation-koduri.pdf
Modified: 2011-04-18 - 6.3MB
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- 29:
FCRP Program Directions and Promising Outputs
- FCRP Program Directions & Promising Outputs 2009 GRC ETAB Summer Study Betsy Weitzman g g p y y June 29, 2009 Exec. VP, SRC and Exec. Dir., FCRP (919) 941-9426 ...
URL: https://www.src.org/...ndar/e003506/03-sessioni-weitzman.pdf
Modified: 2011-06-17 - 432KB
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- 30:
Dr. Malcolm Thompson - e-Workshop Packaging
- Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1 FlexTech & NBMC Business Model 20+ years as ...
URL: https://www.src.org/...ndar/e005802/e005802-presentation.pdf
Modified: 2015-07-23 - 4.9MB
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