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- 1:
 Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 2:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB
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- 3:
BEP Research Needs Statement
- IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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- 4:
DSMS Research Needs
- 1 Research Needs for Device Sciences Modeling and Simulation (DSMS), April 2008 Device Sciences Semiconductor Research Corporation P.O. Box 12053 Research Triangle Park, NC ...
URL: https://www.src.org/...ch-needs/2008/modeling-simulation.pdf
Modified: 2011-02-03 - 29KB
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- 5:
Microsoft Word - 2005_Final_ds_msneeds_rev3.doc
- 1 Research Needs for Device Sciences Modeling and Simulation (May 6, 2005) SRC Device Sciences 2005 Modeling and Simulation Task Force Contributing organizations: Axcelis, ...
URL: https://www.src.org/...ch-needs/2003/modeling-simulation.pdf
Modified: 2011-02-03 - 37KB
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- 6:
2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
- 1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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- 7:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 8:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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- 9:
Microsoft Word - Final 2004 Needs.doc
- 1 Draft 5/14/2004 Back End Processing (BEP) Needs Statement I. Introduction- The purpose of this document is to define the needs of the SRC member companies in the area of Back ...
URL: https://www.src.org/...ch-needs/2004/back-end-processing.pdf
Modified: 2011-02-03 - 47KB
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- 10:
S200807_research_needs_PKG.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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- 11:
Microsoft Word - Packaging Research Needsv2.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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- 12:
SRC Research Needs in Logic and Physical Design and Analysis...
- SRC Research Needs in Logic and Physical Design and Analysis August 2002 I. Prologue The research needs document for physical design was first created in draft copy in 1997. This ...
URL: https://www.src.org/.../cadts/research-needs/2002/design.pdf
Modified: 2011-02-03 - 120KB
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- 13:
ESH Needs Document for Nanotechnology
- ESH/Technology Research Needs (2008 Update) April 7, 2008 INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor ...
URL: https://www.src.org/...m/grc/nms/research-needs/2008/esh.pdf
Modified: 2011-02-03 - 56KB
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- 14:
ESH for Nanotechnology
- 1 2011 ESH/Technology Research Needs Document INTRODUCTION Investigators at the Engineering Research Center (ERC) for Environmentally Benign Semiconductor Manufacturing, as well ...
URL: https://www.src.org/...m/grc/nms/research-needs/2011/esh.pdf
Modified: 2011-03-14 - 128KB
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- 15:
Final Report - Workshop on Failure and Uncertainty in Mixed-Signal...
- National Science Foundation Workshop on Failure and Uncertainty in Mixed-Signal Circuits and Systems Arlington, Virginia July 8-9, 2010 Principal Investigators: Ralph Cavin, ...
URL: https://www.src.org/calendar/e004025/final-report.pdf
Modified: 2011-06-01 - 914KB
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- 16:
Executive Summary Second Nanotransistor Workshop:Technology,...
- Rough draft 1 9/12/01 Executive Summary Second Nanotransistor Workshop: Technology, Physics, and Simulation National Institutes of Standards and Technology Gaithersburg, MD August ...
URL: https://www.src.org/compete/2002-adt/nist-wrksp-report.pdf
Modified: 2011-02-03 - 37KB
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- 17:
2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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- 18:
Future Challenges from a Thermal Perspective for Three Dimensional...
- Future Challenges from a Thermal Perspective for Three Dimensional Chip Stacks Dr. Gamal Refai-Ahmed, AMD In the recent years, there have been grown activities of the appropriate ...
URL: https://www.src.org/calendar/e003506/refai-abs/
Modified: 2011-06-17 - 20KB
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- 19:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 20:
State-of-the-3D Industry Future Opportunities and Challenges
- Rev 2.0 1 Building the Case for 3D 3D Vs. Scaling Technology Roadmap Technology Hurdles Psycho-political Hurdles Evolutionary vs. Revolutionary The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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- 21:
S200807_research_needs_INT.doc
- Research in Support of the Die / Package Interface Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law and the ITRS roadmap, ...
URL: https://www.src.org/...ips/research-needs/2008/interface.pdf
Modified: 2011-02-03 - 29KB
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- 22:
Microsoft Word - Interface Research Needs.doc
- Research in Support of Convergence of On-Chip and On-Package Interconnect Introduction As the microelectronics industry continues to scale down CMOS in accordance with Moore's Law ...
URL: https://www.src.org/...ips/research-needs/2007/interface.pdf
Modified: 2011-02-03 - 25KB
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- 23:
2009 Summer Study: NRI Program Directions and Promising Outputs
- NRI Program Directions and Promising Outputs NRI Program Directions and Promising Outputs ETAB Summer Study Jeff Welser June, 2009 Some information in this presentation is SRC-NRI ...
URL: https://www.src.org/calendar/e003506/04-sessioni-welser.pdf
Modified: 2011-06-17 - 991KB
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- 24:
S200807_research_needs_BEP.doc
- Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
URL: https://www.src.org/...ch-needs/2008/back-end-processing.pdf
Modified: 2011-02-03 - 35KB
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- 25:
Microsoft Word - BEP_Research_Needs.doc
- Back End Processing Research Needs Statement This document summarizes the research needs of the SRC member companies in the area of Back End Processes (BEP). For additional ...
URL: https://www.src.org/...ch-needs/2007/back-end-processing.pdf
Modified: 2011-02-03 - 28KB
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- 26:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 27:
BEP Research Needs Statement
- Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
URL: https://www.src.org/...m/grc/ips/research-needs/2011/bep.pdf
Modified: 2011-03-22 - 67KB
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- 28:
2009 Summer Study: Application and Network Optimized Next Generation...
- © 2009 IBM Corporation Application and Network Optimized Next Generation System Research Shahrokh Daijavad IBM T.J. Watson Research Center 06/29/2009 IBM Research S. Daijavad 2 ...
URL: https://www.src.org/...dar/e003506/04-sessionii-daijavad.pdf
Modified: 2011-06-17 - 1.3MB
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- 29:
Microsoft Word - Pkg Needs 2005.doc
- Page 1 of 4 2005 Packaging Thrust Strategic Needs The following sections describe some specific needs within the current Packaging sub-thrusts. Overall Issues The ITRS identifies ...
URL: https://www.src.org/...ips/research-needs/2005/packaging.pdf
Modified: 2011-02-03 - 82KB
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- 30:
2010 Test Needs Document
- 1 Research Challenges in Test and Testability Semiconductor Research Corporation January 2010 Introduction Test and design for testability are recognized today as critical to a ...
URL: https://www.src.org/...rc/cadts/research-needs/2010/test.pdf
Modified: 2011-02-03 - 198KB
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