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- 1:
 Microsoft PowerPoint - etab_jun09.ppt [Compatibility Mode]
- Coping with Vertical Interconnect Coping with Vertical Interconnect Bottleneck Bottleneck Bottleneck Bottleneck Jason Cong Jason Cong UCLA Computer Science Department UCLA Computer ...
URL: https://www.src.org/.../2009s-study-siii-vertint-cong-v2.pdf
Modified: 2011-06-17 - 473KB
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- 2:
PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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- 3:
2012 - 2016 SRC-GRC Strategic Plan - DRAFT II
- 1 2012-2016 SRC-GRC Strategic Plan Limited Distribution Notice Distribution of the material in this document is limited to employees of SRC-GRC member companies or participating ...
URL: https://www.src.org/...ecutive/2012-2016strat-plan-draft.pdf
Modified: 2011-06-07 - 3.7MB
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- 4:
3D IMAPS
- Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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- 5:
2009 Summer Study: 3D Desig Eco-System
- AGENDA : 2009 GRC ETAB Summer Study Session III: Design Challenges for 3D Packaging Integration 8 00 I t d ti J h D i IBM 8:00 Introduction - John Darringer, IBM 8:15 An ...
URL: https://www.src.org/...e003506/2009s-study-riko-qualcomm.pdf
Modified: 2011-06-17 - 2.3MB
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- 6:
2009 Summer Study: Co-Design of Future Architectures with 3D...
- IBM Research Co-Design of Future Architectures with 3D Integration Michael Rosenfield Di t VLSI S t Director, VLSI Systems IBM Research Division Yorktown Heights, NY 6 30 09 ...
URL: https://www.src.org/...9s-study-siii-codesign-rosenfield.pdf
Modified: 2011-06-17 - 1.5MB
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- 7:
2009 Summer Study: Architecture and Appliction Perspectives for...
- Architecture and Application Perspectives for Application Perspectives for 3D Integration Yuan Xie Associate Professor Associate Professor The Pennsylvania State University ...
URL: https://www.src.org/...2009s-study-siii-architecture-xie.pdf
Modified: 2011-06-17 - 940KB
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- 8:
The GRC division of SRC focuses on research in a timeframe 5...
- Packaging Needs Document A. Introduction Processing architectures need to continue to take advantage of silicon technology dimensional scaling to provide performance enhancements, ...
URL: https://www.src.org/...ips/research-needs/2011/packaging.pdf
Modified: 2011-03-22 - 89KB
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- 9:
VIA-2020 Forum - Panel 1 - McDonald
- "Breaking the Memory Wall for Multi-core Processors with 3D Hyper-integration and Hetero-integration" SRC/NSF/ITRS Forum on Emerging nano-CMOS Architectures - Virtual Immersion ...
URL: https://www.src.org/calendar/e003362/p1-mcdonald.pdf
Modified: 2011-04-18 - 4.7MB
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- 10:
VIA-2020 Forum - Panel 1 - Draper
- SRC/NSF/ITRS 2020 Virtual Immersion Architectures Santa Cruz, CA July 10-11, 2008 Interconnect Fabrics Don Draper Rambus, Inc. SRC/NSF/ITRS 2020 Virtual Immersion Architectures ...
URL: https://www.src.org/calendar/e003362/p1-draper.pdf
Modified: 2011-04-18 - 1.7MB
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- 11:
SRC Research Needs in Logic and Physical Design and Analysis...
- SRC Research Needs in Logic and Physical Design and Analysis August 2002 I. Prologue The research needs document for physical design was first created in draft copy in 1997. This ...
URL: https://www.src.org/.../cadts/research-needs/2002/design.pdf
Modified: 2011-02-03 - 120KB
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- 12:
2009 Summer Study: Future Challenges from a Thermal Perspective...
- Future challenges from a thermal perspective for three dimensional chip stacks chip stacks June 2009 Gamal Refai-Ahmed, PhD Bahgat Sammakia, PhD AMD Fellow Professor and Director ...
URL: https://www.src.org/...03506/2009s-study-siii-refaiahmed.pdf
Modified: 2011-06-17 - 11.8MB
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- 13:
2011 Verification Needs Document Final
- SRC Research Needs in Computer-Aided Design and Test Verification 2011-2012 CADTS Research Needs: Verification This member-generated document describes needs and problems SRC ...
URL: https://www.src.org/.../research-needs/2011/verification.pdf
Modified: 2011-08-25 - 122KB
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- 14:
Research Needs for Device Sciences Modeling and Simulation
- 1 Research Needs for Memory Technologies June 2011 Device Sciences, SRC GRC Semiconductor Research Corporation P.O. Box 12053 Research Triangle Park, NC 27709-2053 Background, ...
URL: https://www.src.org/...grc/ds/research-needs/2011/memory.pdf
Modified: 2011-06-28 - 54KB
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- 15:
VIA Forum - P2 Presentation - Raja Koduri
- AMD Smarter Choice GPU A hit t d GPU Architectures and Futures - Some thoughts Raja Koduri CTO Graphics AMD CTO, Graphics, AMD Agenda . A programmer view of the graphics pipeline . ...
URL: https://www.src.org/...ar/e003362/p2-presentation-koduri.pdf
Modified: 2011-04-18 - 6.3MB
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- 16:
2005 Research Needs for Extending CMOS to its Ultimate Limit
- Research Needs for Extending CMOS to its Ultimate Limit September 14, 2005 Edition 1 CMOS Extension Task Force SRC Device Sciences Digital CMOS Thrust Area Semiconductor Research ...
URL: https://www.src.org/...m/grc/ds/research-needs/2005/cmos.pdf
Modified: 2011-02-03 - 37KB
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- 17:
2010 Test Needs Document
- 1 Research Challenges in Test and Testability Semiconductor Research Corporation January 2010 Introduction Test and design for testability are recognized today as critical to a ...
URL: https://www.src.org/...rc/cadts/research-needs/2010/test.pdf
Modified: 2011-02-03 - 198KB
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- 18:
SRC Research Challenges in Test and Testability
- 1 Research Challenges in Test and Testability Semiconductor Research Corporation August 17, 2006 Introduction Test and design for testability are recognized today as critical to a ...
URL: https://www.src.org/...rc/cadts/research-needs/2006-test.pdf
Modified: 2011-02-03 - 38KB
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- 19:
No Slide Title
- Taller vs. Smaller: 3D Development & Moore's Law F. M. Schellenberg, Ph.D. Design-to-Silicon Division Mentor Graphics GRC ETAB Summer Study La Quinta, CA June 30, 2009 Mentor ...
URL: https://www.src.org/...-siii-tallervsmaller-schellenberg.pdf
Modified: 2011-06-17 - 843KB
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- 20:
BEP Research Needs Statement
- IPS - Interface: Processing Needs Document Introduction The Interconnect Packaging Sciences has identified the interface between Back End Processing and Packaging as a critical ...
URL: https://www.src.org/...ips/research-needs/2011/interface.pdf
Modified: 2011-03-22 - 75KB
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- 21:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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- 22:
S200807_research_needs_PKG.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2008/packaging.pdf
Modified: 2011-02-03 - 93KB
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- 23:
Microsoft Word - Packaging Research Needsv2.doc
- Packaging Thrust Strategic Needs Introduction As silicon technology continues to evolve along Moore's Law, the challenges to current and future packaging technology have continued ...
URL: https://www.src.org/...ips/research-needs/2007/packaging.pdf
Modified: 2011-02-03 - 95KB
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- 24:
2009 GRC ETAB Summer Study Session III Summary
- Session III Design Challenges for 3D Integration SRC GRC ETAB Summer Study 8:00 - 12:30 June 30, 2009 8:00 Introduction - John Darringer, IBM 8:15 An IFM Perspective of a 3D Design ...
URL: https://www.src.org/calendar/e003506/siii-sum.pdf
Modified: 2011-06-17 - 44KB
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- 25:
VIA-2020 Forum - Panel 4 - Peleg
- 1 Intel confidential Future PC Trends Future PC Trends & their Implications on & their Implications on Traditional Computing Architectures Traditional Computing Architectures Alex ...
URL: https://www.src.org/calendar/e003362/p4-peleg.pdf
Modified: 2011-04-18 - 83KB
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- 26:
BEP Research Needs Statement
- Back End Processing Needs Document Introduction This document summarizes the research needs of the SRC member companies in Back End Processes (BEP) and related science areas. For ...
URL: https://www.src.org/...m/grc/ips/research-needs/2011/bep.pdf
Modified: 2011-03-22 - 67KB
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- 27:
2011 Systems Design Needs
- Integrated Circuit and Systems Sciences Research Needs: Integrated System Design December 2011 The SRC GRC member companies are pleased to release this document that describes ...
URL: https://www.src.org/.../icss/research-needs/2011/systems.pdf
Modified: 2011-12-07 - 41KB
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- 28:
FCRP Program Directions and Promising Outputs
- FCRP Program Directions & Promising Outputs 2009 GRC ETAB Summer Study Betsy Weitzman g g p y y June 29, 2009 Exec. VP, SRC and Exec. Dir., FCRP (919) 941-9426 ...
URL: https://www.src.org/...ndar/e003506/03-sessioni-weitzman.pdf
Modified: 2011-06-17 - 432KB
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- 29:
SRC: Grant Application for Device Sciences Program Memory Technologies...
- Grant Application for: Device Sciences Program - Memory Technologies Research Overview Grant Application Guidelines Timetable and Deadlines Overview The Device Sciences area is ...
URL: https://www.src.org/compete/archive/grc/s200405/
Modified: 2011-02-03 - 28KB
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- 30:
Microsoft Word - Packaging_Needs.doc
- 5/21/2004 - 3:50 PM Page 1 of 6 Packaging Thrust Strategic Needs Introduction The purpose of this document is to define the needs of the SRC member companies in the area of ...
URL: https://www.src.org/...ips/research-needs/2004/packaging.pdf
Modified: 2011-02-03 - 23KB
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